Tatsuta Electric Wire & Cable Co., Ltd.

Hiroshi Tajima

Masahiro Watanabe

Yuusuke Haruna

Sirou Yamauchi

Takahiko Katsuki

Kenji Kamino

Yoshiharu Yanagi

Sougo Ishioka

Katsuma Ookura

Yoshihiro Hosoya

Tsuyoshi Hasegawa

Yusuke Haruna

Shirou Yamauchi

Yukari Kobayashi

Kiyoharu Sekiguchi

An electromagnetic wave shielding film with high bending resistance includes a protecting layer, a metal layer, and an adhesive layer stacked in this order. A ratio of Repulsion Y to Repulsion X ([Repulsion Y]/[Repulsion X]) is 0.77 or higher, where Repulsion X denotes a repulsion of a stack including the protecting layer and the metal layer measured in a defined test for measuring repulsion of stacks, and Repulsion Y denotes a repulsion of the adhesive layer measured in a defined test for measuring repulsion of adhesive layers.

Electromagnetic wave shield film

An electromagnetic wave shielding film includes an electroconductive adhesive layer having high peel strength and high connection reliability and suppresses cracks in an insulating layer on the electroconductive adhesive layer. The electromagnetic wave shielding film includes an electroconductive adhesive layer containing electroconductive particles and an adhesive resin composition and an insulating layer on the electroconductive adhesive layer. The electroconductive particles include high melting point electroconductive particles and low melting point electroconductive particles having a lower melting point than the high melting point electroconductive particles, and the high melting point electroconductive particles include high melting point flaky particles and high melting point spherical particles, and the content of the high melting point flaky particles is 60 to 80% by weight of the total content of the high melting point flaky particles, the high melting point spherical particles, and the low melting point electroconductive particles.

Electromagnetic wave shielding film and shielded printed wiring board

An electromagnetic wave shielding film with high bending resistance and high electromagnetic wave-shielding characteristics, even when used with high-frequency signal transmission, is disclosed. The electromagnetic wave shielding film includes an adhesive layer; a shielding layer placed on the adhesive layer; and an insulating layer placed on the shielding layer, wherein a plurality of openings having an opening area of 1 to 5000 μmare formed in the shielding layer, the openings include first openings having opening areas of more than 1 μmand 300 μmor less and second openings having opening areas of more than 300 μmand 5000 μmor less, and the percentage of the number (cumulative frequency) of the first openings among the openings is 30 to 90%, and the percentage of the number (cumulative frequency) of the second openings among the openings is 10 to 70%.

Electromagnetic wave shielding film

An electromagnetic wave shielding film has permeability to volatile components, shielding characteristics, and resistance to folding. The electromagnetic wave shielding film includes an adhesive layer; a metal layer made of a metal and placed on the adhesive layer; and an insulating layer placed on the metal layer. Multiple openings are formed in the metal layer; the openings include openings (A) including island-shaped metal layer fragments, each opening (A) having island-shaped metal layer fragments formed therein, and the openings (A) including island-shaped metal layer fragments include openings (A) including one or more island-shaped metal layer fragments. Each opening (A) defines an opening (A) including island-shaped metal layer fragments in which a total area of the island-shaped metal layer fragments accounts for 40 to 80% of an area inside a contour of the opening (A).

A shielded printed wiring board with electromagnetic wave shielding film on both sides thereof is produced by placing electromagnetic wave shielding films on the two sides of the printed wiring board, with ends thereof protruding past an end of the printed wiring board. The protruding ends of the electromagnetic wave shielding films are brought together, with an air gap therebetween, and an initial application of heat and pressure causes the ends of the electromagnetic wave shielding film to adhere to each other, but without completely curing adhesive resin components of the electromagnetic wave shielding films. Protective film layers are removed from the electromagnetic wave shielding films, followed by subsequent application of heat and pressure to complete cure of the adhesive resin and to remove the air gap.

Method for manufacturing shielded printed wiring board and shielded printed wiring board

An electromagnetic wave shielding film that can be thinned, and has high peel strength, electroconductivity, shielding properties, and flex resistance and conformability to a step is provided. An electromagnetic wave shielding film of the present invention is an electromagnetic wave shielding film including: an electroconductive adhesive layer containing electroconductive particles and an adhesive resin composition, wherein the electroconductive particles contain flaky electroconductive particles and spherical electroconductive particles, the average particle size of the spherical electroconductive particles is 1 to 10 μm, the content of the flaky electroconductive particles and the spherical electroconductive particles in the electroconductive adhesive layer is 70 to 80% by weight, the weight ratio of the flaky electroconductive particles to the spherical electroconductive particles, [flaky electroconductive particles]/[spherical electroconductive particles], is 6/4 to 8/2, and the thickness of the electroconductive adhesive layer is 5 to 20 μm.

Provided is an electromagnetic wave shielding film capable of easily exhibiting excellent conductivity between a ground member and a shielding layer when the ground member is disposed on the electromagnetic wave shielding film. In the electromagnetic wave shielding film, the conductive adhesive layer, the shielding layer, and the insulating layerare laminated in this order, and a ratio [conductive adhesive layer/insulating layer] of Martens hardness of the conductive adhesive layerin accordance with ISO14577-1 to Martens hardness of the insulating layerin accordance with ISO14577-1 is 0.3 or more.

Provided is a shielded printed wiring board that exhibits excellent connection stability even when having a through-hole with a small opening area, and enables a high degree of freedom in circuit design. The shielded printed wiring boardaccording to the present invention includes a printed wiring board, an insulating layer, and a conductive adhesive layerdisposed between the printed wiring boardand the insulating layer. The printed wiring boardincludes a base, a circuit patterndisposed on the base, and an insulating protective layercovering the circuit pattern. The shielded printed wiring board has a through-holefor external grounding that vertically penetrates the insulating layerand the conductive adhesive layer. The conductive adhesive layerhas an extensionextending toward the inside of the through-holeas compared with the insulating layer

Shield printed wiring board and method of manufacturing shield printed wiring board

The present invention aims to provide a ground member that can be mounted on any position, wherein misalignment is less likely to occur between conductive filler particles of the ground member and a shielding layer of a shielding film when a shielded printed wiring board including the ground member is repeatedly heated and cooled to mount components thereon. The ground member of the present invention includes: a conductive external connection member having a first main surface and a second main surface opposite to the first main surface; conductive filler particles disposed adjacent to the first main surface; and an adhesive resin for fixing the conductive filler particles to the first main surface, wherein each conductive filler particle includes a low-melting-point metal.

Ground member, shielded printed circuit board, and method for manufacturing shielded printed circuit board

A printed wiring board includes a base member that includes a ground wiring pattern and a printed wiring board reinforcing member bonded to the ground wiring pattern in a conductive state. The printed wiring board reinforcing member includes a metal base material layer and a nickel layer bonded to at least a surface on a side opposite to a side bonded to the ground wiring pattern of the metal base material layer by diffusion bonding.

Printed wiring board with a reinforcing member having a diffusion-bonded nickel layer

To provide a shield film which is capable of suitably shielding electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film and has good transmission characteristics, a shielded printed wiring board, and a method for manufacturing the shield film, a metal layerwhich is 0.5 &#x3bc;m to 12 &#x3bc;m thick and an anisotropic conductive adhesive layerwhich is anisotropic so as to be electrically conductive only in thickness directions are provided in a deposited manner, so that electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film are suitably shielded.

Shield film, shielded printed wiring board, and method for manufacturing shield film

Provided are: a shield film having excellent shield characteristics in the high frequency region of the shield film; and a shield printed wiring board. A shield film () is provided on a flexible printed wiring board (), which has a base film () having a signal circuit (a) formed thereon, and an insulating film () that is provided on the whole upper surface of the base film () such that the insulating film covers the signal circuit (). The shield filmhas an electroconductive adhesive layerprovided throughout a surface of the insulating film, and a metal layerprovided throughout a surface of the electroconductive adhesive layer

Shield film and shield printed wiring board

A reinforcing member for a flexible printed wiring board that maintains an electromagnetic wave shielding effect and a ground effect of the printed wiring board over a long period of time. A reinforcing member is disposed opposite a predetermined part of a ground wiring pattern and includes one surface opposing and in electrical conduction with the predetermined part of the ground wiring pattern. The other surface is in electrical conduction with an external ground member which is at a ground potential, the one surface and the other surface opposing each other. The reinforcing member includes a base made of conductive metal and a surface layer formed on a surface of the base to constitute at least a part of the other surface, the surface layer has higher conductivity and corrosion resistance than the base made of metal, and the surface layer is 0.004 to 0.2 &#x3bc;m thick.

Reinforcing member for flexible printed wiring board flexible printed wiring board, and shield printed wiring board

A shape-retaining film which allows a flexible wiring board to retain its shape after the flexible wiring board is deformed by bending or the like, and a shape-retaining flexible wiring board including the shape-retaining film, is disclosed herein. A shape-retaining film includes a plastic-deformable metal layer and an adhesive layer which is formed on one surface side (lower side) of the metal layerand is joined with a flexible wiring board. The shape-retaining film makes it possible to retain the shape of a deformed flexible wiring board. With this arrangement, the occurrence of a repellent force in the deformed flexible wiring board is prevented.

Growing community of inventors

Higashiosaka, Japan

Hiroshi Tajima