Hitachi, Ltd.

Hitachi Vlsi Engineering Corp.

Hiroshi Tachi

Kanji Otsuka

Takayuki Okinaga

Yasuyuki Yamasaki

Hiroshi Ozaki

Michiaki Furukawa

Takeo Yamada

Mitsuo Usami

Shigeo Kuroda

Masao Kato

Kunizo Sahara

Seiji Miyamoto

Takashi Kumagai

Yuuji Shirai

Kazutoshi Kubo

Masayuki Kawashima

According to the present invention, as improvement in the adhesion of inner leads with a packaging resin in a resin-sealed semiconductor device is attained by spreading leads on or near the circuit-forming face of a pellet, or on or near the main non-circuit-forming face of the pellet to extend the lengths of the inner leads on or under the pellet.

Semiconductor device and process for producing the same, and lead frame

Semiconductor device having inner leads extending over a surface of a

Attempts have been made to increase the number of pins of packages accompanying the trend toward fabricating integrated circuits highly densely and in smaller sizes. The present invention provides technology for improving reliability in fabricating packages of the surface-mounted type that have increased number of pins. That is, when the packages are mounted on the wiring substrate, the lead pins that receive load from the axial direction exhibit bending strength which is smaller than the junction strength of solder at the junction portions. To achieve this object, the lead pins are made of a material having large resiliency such as a fiber-reinforced material, a transformation pseudo elastic material, an ultra-high tension material, or a heat-resistant ultra-high tension material.

Semiconductor device having leads for mounting to a surface of a printed

Semiconductor device

Growing community of inventors

Akishima, Japan

Hiroshi Tachi