Toppan Printing Co., Ltd.

Hisamitsu Pharmaceutical Company, Inc.

Hiroshi Sugimura

Takao Tomono

Gaku Suzuki

Masahiro Ueno

Yoshihiro Kodama

Toshiaki Kurosu

Kazuhiko Shiomitsu

Akira Tamura

Hideyuki Eguchi

Takashi Yoshii

According to one embodiment, a method for manufacturing a hollow needlelike object including a hollow part inside includes: a step of preparing a first needlelike-object base having a face comprising a groove forming at least a part of the hollow part; and a step of covering the face of the needlelike-object base with a covering member.

Hollow needlelike object and method for manufacturing hollow needlelike object

The invention discloses a method of manufacturing a microneedle including the steps of forming an island etching mask having thickness distribution on a substrate, and processing the substrate into a needle by taking advantage of a difference in etching rates between the etching mask and the substrate. The invention enables to readily control a point angle and height of the manufactured needle.

Method of manufacturing microneedle

A method of manufacturing a microneedle including forming a plurality of first linear grooves on a substrate in parallel to one another along a first direction using grinding and forming a plurality of second linear grooves on the substrate in parallel to one another in a second direction intersecting the first direction using grinding. At least one of the forming of a plurality of first linear grooves and the forming of a plurality of second linear grooves includes forming first stage grooves using a first dicing blade; and processing the first stage grooves by tracing the first stage grooves using a second dicing blade having a side surface different from that of the first dicing blade to thereby form second stage grooves.

Microneedle and method of manufacturing microneedle

A method of manufacturing a microneedle including the steps of forming a plurality of first linear grooves on a substrate in parallel to one another along a first direction using grinding, and forming a plurality of second linear grooves on the substrate in parallel to one another in a second direction intersecting the first direction using grinding.

A method of dividing a circuit pattern for creating complementary stencil masks corresponding to complementary patterns, the method comprising a step of dividing a circuit pattern into a plurality of complementary patterns including a first complementary pattern comprising a pattern of a cantilevered beam member having a support portion width Wand a length L, and a second complementary pattern comprising a pattern of a both end-supported beam member having a support portion width Wand a length L. The dividing of the circuit pattern is performed in a manner that a aspect ratio A(L/W) of the pattern of the cantilevered beam member is confined to not more than 100, and that a aspect ratio A(L/W) of the pattern of the both end-supported beam member is confined to not more than 150.

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Tokyo, Japan

Hiroshi Sugimura