Nippondenso Co., Ltd.

Hiroshi Sugimoto

Toru Yamazaki

Hiroshi Okada

Satoshi Hirano

Masahiro Ohba

Toshiki Saburi

Takashi Sakurai

Hideaki Namba

Taisei Katoh

Michitaka Hayashi

Katsumasa Matsui

Hidemichi Tanabe

Junzi Sugiura

Tohru Yamazaki

Hisahiro Miura

Toru Kamiya

A high frequency filter for an electric instrument including a casing of metallic conductive material, an internal electric circuit element arranged within the casing, and a connector mounted on a peripheral wall of the casing for connecting the internal electric circuit element to an external electric circuit. The high frequency filter comprises an insulation substance layer arranged between the connector and a connection terminal of the circuit element, the insulation substance layer being made of a dielectric material whose dielectric constant decreases or increases in accordance with increase or decrease of wireless frequency applied thereto, and a pair of conductive layers formed on opposite surfaces of the insulation substance layer, one of the conductive layers being connected at one end thereof to the connector and at the other end thereof to the connection terminal of the circuit element, and the other conductive layer being connected to a portion of the casing.

High frequency filter for electric instruments

A case for accommodating an electronic circuit for an electronic control system mounted on a vehicle is formed of an electric conductor and is electrically isolated from the grounding terminal of the electronic circuit which is provided on a printed substrate. Further, the outer boundary of a signal line for signal transmission between the electronic circuit and external circuits or sensors of the case is connected to the case through capacitors, thus preventing the faulty actuation of the electronic control system which otherwise might be caused by the electromagnetic wave.

Vehicle-mounted electronic apparatus

A semiconductor pressure sensor has an encased sensor unit, and a metal casing having a pressure introduction pipe and housing therein the sensor unit. The metal casing has therein synthetic resin poured by potting to fix the sensor unit securely in the metal casing. Through-type capacitors are affixed to the metal casing. The sensor unit produces an electrical signal transmitted out through the through-type capacitors and over lead wires connected to the through-type capacitors. With this arrangement, the semiconductor pressure sensor is protected against electromagnetic interference (EMI), and moisture is prevented from entering the metal casing.

Semiconductor pressure sensor

Growing community of inventors

Toyota, Japan

Hiroshi Sugimoto