Tokyo Electron Limited

Asahi Kogaku Kogyo Kabushiki Kaisha

Hiroshi Sone

Naoyuki Suzuki

Yoshihisa Shijo

Shinji Orimoto

Hiroyuki Yokohara

Takanobu Shiokawa

Atsushi Gomi

Yasuhiko Kojima

Junichi Takei

Rensuke Adachi

Tetsuya Miyashita

Masato Shinada

Masahide Inoue

Tatsuo Hirasawa

Katsuyoshi Aikawa

Koji Maeda

Kanto Nakamura

Yusuke Suzuki

Hiroaki Chihaya

Chiaki Yasumuro

Koichi Takatsuki

Motoi Yamagata

Toru Kitada

Atsushi Shimada

Hiroaki Fuse

Yasunobu Suzuki

Teruo Sakai

Takuya Umise

Yasuyuki Kagaya

Chinari Tanaka

Yuuki Motomura

Yuko Ochiai

Keisuke Sato

Kenichi Imakita

There is provided a mounting table. The mounting table comprises: a dielectric plate having a through-hole at an outer peripheral portion thereof and having a substrate support on which a substrate is placed; a support member; a first heat insulating member disposed between the dielectric plate and the support member; a first biasing member disposed between the first heat insulating member and the support member, and a fastening member configured to detachably fix the dielectric plate to the support member by way of penetrating through the through-hole of the dielectric plate, the first heat insulating member, and the first biasing member.

Mounting table and substrate processing apparatus

A mounting table structure includes a mounting table on which a substrate is mounted, a refrigerating mechanism configured to cool the substrate, an elevating drive part configured to move the mounting table or the refrigerating mechanism up and down, and at least one contact provided at a position between the refrigerating mechanism and the mounting table which face each other. The refrigerating mechanism and the mounting table are allowed to be brought into contact with each other via the contact by moving the mounting table or the refrigerating mechanism up and down by the elevating drive part.

Mounting table structure, substrate processing apparatus, and method of controlling substrate processing apparatus

A film forming apparatus includes: a processing container; a substrate holder that holds the substrate in the processing container; and a target assembly disposed in an upper side of the substrate holder. The target assembly includes: a target made of metal, including a main body and a flange provided around the main body, and emitting sputter particles from the main body; a target holder including a target electrode configured to supply power to the target, and holding the target; a target clamp that clamps the flange of the target to the target holder; and an anti-deposition shield provided around the main body of the target to cover the flange, the target clamp, and the target holder, and having a labyrinth structure in which an inner tip end thereof is disposed to enter a recess between the main body of the target and the target clamp.

Film forming apparatus

A sputtering device includes a processing chamber where a substrate is accommodated, and a slit plate that partitions the processing chamber into a first space where a target member is disposed and a second space where the substrate is disposed. The slit plate includes an inner member having an opening that penetrates therethrough in a thickness direction of the slit plate, and an outer member disposed around the inner member. The inner member is attachable to and detachable from the outer member.

Sputtering device

There is provided a stage mechanism, including: an electrostatic chuck having a conductive film formed on a front surface thereof, the conductive film configured to make electrically contact with a rear surface of a substrate; a conductive member electrically connected to the conductive film and formed to extend to a rear surface of the electrostatic chuck; and a moving member electrically connected to the conductive member via a connecting member and configured to move between a first position connected to a ground potential and a second position not connected to the ground potential.

Stage mechanism, processing apparatus, and method of operating the stage mechanism

Disclosed is a PVD processing method including a first process, a second process, a third process, and a fourth process. In the first process, an opening of a shield, which is provided between a first target containing a metal oxide and a second target containing a metal constituting the metal oxide, and a stage on which a substrate as a film formation object is placed, is made to coincide with the first target so as to expose the first target to the stage and the opening is brought close to the first target. In the second process, sputtering is performed using the first target. In the third process, the opening is made to coincide with the second target so as to expose the first target to the stage, and the opening is brought close to the second target. In the fourth process, sputtering is performed using the second target.

PVD processing method and PVD processing apparatus

A sputtering apparatus includes: a target disposed on a ceiling of a processing container capable of being depressurized; a gas inlet configured to supply a sputtering gas into the processing container; a first shield disposed around the target and configured to prevent deposition of a film around the target; and a second shield disposed in the processing container to cover an inner wall of the ceiling with a space from the ceiling, and including an opening in a portion corresponding to the target.

Sputtering apparatus

A substrate processing apparatus includes a supporting table having a mounting region for a substrate. A rotation shaft supporting a shutter extends in a vertical direction. The shutter is moved between a first region above the supporting table and a second region by rotating the rotation shaft about its central axis. The shutter includes a pipe having gas output holes. When the shutter is disposed in the first region, the gas output holes are located outside the mounting region in a rotation direction from the second region toward the first region. The minimum distance between the central axis and the gas output holes is smaller than or equal to the minimum distance between the central axis and the mounting region. The maximum distance between the central axis and the gas output holes is greater than equal to the maximum distance between the central axis and the mounting region.

Substrate processing apparatus

In a processing apparatus according to one embodiment, a stage is installed inside a process chamber. The stage has a plurality of through-holes formed therein, which corresponds to a plurality of lift pins. The plurality of lift pins is supported by a spline shaft through a support body. The spline shaft is supported by a spline bearing such that the spline shaft is vertically moved. The plurality of lift pins is biased upward by a spring member through the spline shaft. The spline shaft, the spline bearing, and the spring member are installed in an outer space separated from a depressurizable inner space of the process chamber.

Apparatus of processing workpiece in depressurized space

A deposition device according to one embodiment includes a processing container. A mounting table is installed inside the processing container, and a metal target is installed above the mounting table. Further, a head is configured to inject an oxidizing gas toward the mounting table. This head is configured to move between a first region that is defined between the metal target and a mounting region where a target object is mounted on the mounting table and a second region spaced apart from a space defined between the metal target and the mounting region.

Deposition device and deposition method

A fixing unit fixes a plate-shaped member to a fixing base member. The fixing unit includes: a pressing unit configured to press the plate-shaped member toward the fixing base member; and a plurality of positioning units, installed at the fixing base member to be in contact with side surfaces of the plate-shaped member, and configured to place the plate-shaped member with respect to the fixing base member. Each of the positioning units includes: a shaft to be installed at the fixing base member; and a slide part movable along the shaft, and the slide part includes a contact part to be in contact with one of the side surfaces of the plate-shaped member and a clearance part formed on the contact part to have a smaller width than that of the contact part.

Fixing unit of plate-shaped member, PVD processing apparatus and fixing method of plate-shaped member

The closed container for an clinometric sensor is assembled of a tube-like member with a circular cross section, and a pair of side boards shaped like a disc and closing both opening ends of the tube-like member. On the inside flat plane of one side board, a pair of first electrodes are formed with a gap passing the central axis of the tube-like member and trending in the radial direction of the tube-like member. On the other hand, on the inside flat plane of the other side board, a second electrode is formed through the approximately whole area thereof. In the closed container, an electrolytic solution of approximately a half of the volume thereof is injected.

Clinometric sensor

An inclination sensor includes a container in which an electrolyte liquid and a gas bubble are sealed. The container has a top member with a concave surface having a radius of curvature in a first direction larger than a radius of curvature in a second direction, perpendicular to the first direction. The concave surface is provided with two electrodes that are aligned in the first direction. An inclination of an object is measured by mounting the inclination sensor to the object and electrically detecting the position of the bubble as it contacts the concave surface, by passing a current through the liquid.

Inclination sensor

In a tilt sensor including a sealed container which is comprised of a container body and a top cover plate which is adapted to close the container body and is provided on the inner surface thereof with a recess whose depth gradually increases from the peripheral edge toward the center thereof, and a holder which holds the sealed container, the top cover plate and the holder are provided with a positioning device which determines a relative angular position between the sealed container and the holder. A mask and a coat holder, which are used to form electrodes on the top cover plate are also disclosed.

Tilt sensor, mask and coat holder

A tilt sensor includes a sealed container formed of a container body, a top cover plate adapted to close the container body and provided on one end surface thereof with a recess having a concave surface whose depth gradually increases from a peripheral edge toward a center thereof. The tilt sensor further includes a liquid enclosure containing an air bubble, that is enclosed in the container body. To coincide the center of the configuration of the top cover plate with a line normal at a deepest portion of the concave surface at a grinding operation after molding the top cover plate, an indicia is provided on the line normal to the concave surface at the deepest point of the concave surface.

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Tokyo, Japan

Hiroshi Sone