Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Hiroshi Sogou

Kouji Kawakita

Seiichi Nakatani

Tatsuo Ogawa

Tamao Kojima

Akihito Hatakeyama

Keiichi Takahashi

Masamitsu Nishida

Shigeyuki Okumura

Hiroshi Kagata

Junichi Kato

Kojiro Okuyama

Tatsuya Inoue

Kaname Mizokami

A plasma display panel includes a front plate having a dielectric layer covering a display electrode formed on a substrate and a protective layer formed on the dielectric layer, and a rear plate facing the front plate so as to form a discharge space. The plasma display panel also includes an address electrode in a direction crossing the display electrode, barrier ribs for partitioning the discharge space, and phosphor layers. The protective layer is constructed by forming a ground film on the dielectric layer and adhering agglomerated particles to the ground film. The agglomerated particles are produced by coagulating a plurality of crystal particles made of metal oxide.

Plasma display device

A plasma display panel has a front substrate including a plurality of display electrode pairs, a dielectric layer, and a protective layer, and a rear substrate including a plurality of data electrodes, a barrier rib, and a phosphor layer. The front substrate and rear substrate face each other so that the display electrode pairs and the data electrodes intersect, and a hydrogen-absorbing material containing palladium is disposed inside the plasma display panel.

Plasma display panel incorporating a hydrogen-absorbing material

The present invention provides a piezoelectric ceramic composition that is free from lead and has a small grain size, a high coupling coefficient, a high mechanical Q, and a large frequency constant. This composition is characterized by being expressed by a formula of (Li Na K ) Ma Nb Mb O , wherein 0.03&lE;x&lE;0.2, 0&lE;y&lE;0.2, 0.98&lE;z&lE;1, 0<w&lE;0.05, Ma indicates at least one element selected from the alkaline-earth metals, and Mb denotes at least one element selected from Bi, Sb, and the rare earth elements.

Piezoelectric ceramic composition and piezoelectric element containing the same

The piezoelectric ceramic composition of the present invention contains, as a main component, a material having a composition represented by Formula: CaM Bi Ti (Nb Ta ) O , where M is at least one element selected from the group consisting of Ca, Sr, and Ba; 0.0&lE;A&lE;1.0; and 0.0&lE;X&lE;0.6.

Piezoelectric ceramic composition and piezoelectric element using the same

A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.

Printed circuit board

Printed circuit board and method of manufacturing the same

A laminated ceramic device formed by laminating ceramics and conductive metals having a conductor section at a part of at least one of its upper and lower surfaces, in which the difference in level between the conductor section and the section other than the conductor section is smaller than the thickness of the conductor section. Consequently, even in the case of arranging the pattern conductors on both the upper and the lower surfaces of the device, a laminated ceramic device can be obtained in which pattern conductors can be arranged with high accuracy at low cost, no special care is required in the case of polishing, and the thickness accuracy and the bond strength of electrodes are high.

Laminated ceramic device

A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality. By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably. In addition to that, since the conductive paste is filled up to the surface of the tackfree films, the conductive paste sticks out from the surface of the organic porous base material when the tackfree films are separated. As a result, the filled amount of the conductive substance increases after the lamination, and thus, the connection resistance is reduced considerably.

Growing community of inventors

Hyogo, Japan

Hiroshi Sogou