Matsushita Electric Industrial Co., Ltd.

Hiroshi Sogo

Masahide Tsukamoto

Tamao Kojima

Yasuhiko Horio

Akihito Hatakeyama

Yasushi Fukumura

Hiroshi Kagata

Junichi Kato

Tatsuya Inoue

A coaxial dielectric resonator which is prismatic and has a through hole in a vertical direction, has such feature that each base side of said prism being no more than 1.6 mm, a diameter of said through hole being no more than 0.8 mm, said coaxial dielectric resonator having an electrode portion on a surface thereof and on an inner surface of said through hole.

Dielectric resonator, method for manufacturing the same, filter and

A method of manufacturing an organic substrate used for printed circuits, which includes the steps of forming through-holes in a porous raw material provided with cover films and having compressive shrinkage, filling electro-conductive paste into the through-holes, separating the cover films from the porous raw material filled with the electro-conductive paste in its through-holes, applying metal foils onto the surfaces of the porous raw material from which the cover films have been separated, and compressing the porous raw material applied with the metal foils through heating and pressurization, whereby the electro-conductive substances in the electro-conductive paste are connected for electrical connection between the metal foils.

Method of manufacturing organic substrate used for printed circuits

A method of manufacturing an organic substrate used for printed circuits, which includes the steps of forming through-holes (3) in a porous raw material (2) provided with cover films (1) and having compressive shrinkage, filling electro-conductive paste (4) into the through-holes (3), separating the cover films (1) from the porous raw material (2) filled with the electro-conductive paste (4) in its through-holes (3), applying metal foils (5) onto the surfaces of the porous raw material (2) from which the cover films (1) have been separated, and compressing the porous raw material (2) applied with the metal foils (5) through heating and pressurization, whereby the electro-conductive substances in the electro-conductive paste are connected for electrical connection between the metal foils.

Porous substrate and conductive ink filled vias for printed circuits

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Nishinomiya, Japan

Hiroshi Sogo