Ebara Corporation

Kabushiki Kaisha Toshiba

Kabushiki Kaisha Topcon

Tokyo Electron Limited

Gigaphoton Inc.

Toshiba Corporation

Ebara Densan Ltd.

Gigaphton Inc.

Ebera Corporation

Hiroshi Sobukawa

Takeshi Murakami

Masahiro Hatakeyama

Hiroyuki Kawasaki

Matsutaro Miyamoto

Kenji Watanabe

Nobuharu Noji

Toshiharu Nakazawa

Mutsumi Saito

Atsushi Shiokawa

Katsuya Okumura

Tetsuji Togawa

Norio Kimura

Mamoru Nakasuji

Koji Ono

Tohru Satake

Toshifumi Kimba

Kouji Kakizaki

Yuichiro Yamazaki

Manabu Tsujimura

Satoshi Mori

Shinji Nagai

Masahiro Inoue

Ichirota Nagahama

Takanobu Ishihara

Fumio Kuriyama

Kenji Terao

Kiwamu Tsukamoto

Yoshihiko Naito

Hiroaki Ogamino

Tatsuya Kohama

Takehide Hayashi

Masami Nagayama

Yukio Murai

Shoji Yoshikawa

Tsutomu Karimata

Junichi Arami

Shin Oowada

Takamitsu Nagai

Toshimitsu Barada

Yoshinori Ojima

Tomonori Ohashi

Tetsuma Ikegami

Ichiju Sato

Shun-ichi Aiyoshizawa

Tsutomi Karimata

Shigekazu Yamamoto

A CMP polishing apparatus for flattening a quadrate substrate is provided. A polishing apparatus for polishing a quadrate substrate is provided. The polishing apparatus includes a substrate holding portion configured to hold the quadrate substrate. The substrate holding portion includes a quadrate substrate supporting surface that supports the substrate, and an attachment mechanism that attaches a retainer member to be disposed at an outside of at least one corner portion of the substrate supporting surface.

Polishing apparatus of substrate

To terminate polishing at an appropriate position, an end point position of the polishing is sensed. According to one embodiment, a method that chemomechanically polishes a substrate including a functional chip is provided. The method includes: a step of disposing the functional chip on the substrate; a step of disposing an end point sensing element on the substrate; a step of sealing the substrate on which the functional chip and the end point sensing element are disposed with an insulating material; a step of polishing the insulating material; and a step of sensing an end point of the polishing based on the end point sensing element while the insulating material is polished.

Method for polishing substrate including functional chip

A magnetic levitated pump that does not cause pulsation of a pumped liquid and can suppress the generation of particles, which are liable to be produced by contact of a sliding part, is disclosed. The magnetic levitated pump for magnetically levitating an impeller housed in a pump casing includes a motor configured to rotate the impeller, and an electromagnet configured to magnetically support the impeller. The motor and the electromagnet are arranged so as to face each other across the impeller, and the motor is arranged on the opposite side of a suction port of the pump casing.

Magnetic levitated pump

An electro-optical inspection apparatus is provided that is capable of preventing adhesion of dust or particles to the sample surface as much as possible. A stage () on which a sample () is placed is disposed inside a vacuum chamber () that can be evacuated to vacuum, and a dust collecting electrode () is disposed to surround a periphery of the sample (). The dust collecting electrode () is applied with a voltage having the same polarity as a voltage applied to the sample () and an absolute value that is the same or larger than an absolute value of the voltage. Thus, because dust or particles such as particles adhere to the dust collecting electrode (), adhesion of the dust or particles to the sample surface can be reduced. Instead of using the dust collecting electrode, it is possible to form a recess on a wall of the vacuum chamber containing the stage, or to dispose on the wall a metal plate having a mesh structure to which a predetermined voltage is applied. In addition, adhesion of dust or particles can be further reduced by disposing a gap control plate () having a through hole () at the center above the sample () and the dust collecting electrode ().

Electro-optical inspection apparatus and method with dust or particle collection function

An electro-optical inspection apparatus prevents adhesion of dust or particles to a sample surface, wherein a stage on which a sample is placed is disposed inside a vacuum chamber that can be evacuated, and a dust collecting electrode is disposed to surround a periphery of the sample. The dust collecting electrode is applied with a voltage having the same polarity as a voltage applied to the sample and an absolute value that is the same or larger than an absolute value of the voltage. Because dust or particles adhere to the dust collecting electrode, adhesion of the dust or particles to the sample surface can be reduced. Instead of using the dust collecting electrode, it is possible to form a recess on a wall of the vacuum chamber, or to dispose on the wall a metal plate having a mesh structure to which a predetermined voltage is applied.

An extreme ultraviolet light source apparatus comprises a target supply unit supplying a target into a vacuum chamber, a laser oscillator outputting a laser light into the vacuum chamber, a collector mirror outputting an extreme ultraviolet light outside by reflecting the extreme ultraviolet light emitted from the target being ionized as a plasma by irradiation with the laser light at a plasma luminescence point in the vacuum chamber, and an ion debris removal unit at least a part of which is located in an obscuration region including the plasma luminescence point.

Extreme ultraviolet light source apparatus

An oil-free turbo vacuum pump is capable of evacuating gas in a chamber from atmospheric pressure to high vacuum. The turbo vacuum pump includes a pumping section having rotor blades and stator blades which are disposed alternately in a casing, a main shaft for supporting the rotor blades, and a bearing and motor section having a motor for rotating the main shaft and a bearing mechanism for supporting the main shaft rotatably. A gas bearing is used as a bearing for supporting the main shaft in a thrust direction, spiral grooves are formed in both surfaces of a stationary part of the gas bearing, and the stationary part having the spiral grooves is placed between an upper rotating part and a lower rotating part which are fixed to the main shaft.

Turbo vacuum pump

An electron beam emitted from an electron gun (G) forms a reduced image on a sample (S) through a non-dispersion Wien-filter (-), an electromagnetic deflector (-), a beam separator (-), and a tablet lens (-) as an objective lens. The beam separator (-) is configured such that a distance by which a secondary electron beam passes through the beam separator is approximately three times longer than a distance by which a primary electron beam passes through the beam separator. Therefore, even if a magnetic field in the beam separator is set to deflect the primary electron beam by a small angle equal to or less than approximately 10 degrees, the secondary electron beam can be deflected by approximately 30 degrees, so that the primary and secondary electron beams are sufficiently separated. Also, since the primary electron beam is deflected by a small angle, less aberration occurs in the primary electron beam. Accordingly, since a light path length of a primary electro-optical system, it is possible to reduce the influence of space charge and the occurrence of deflection aberration.

Electron beam apparatus

An inspection apparatus by an electron beam comprises: an electron-optical devicehaving an electron-optical system for irradiating the object with a primary electron beam from an electron beam source, and a detector for detecting the secondary electron image projected by the electron-optical system; a stage systemfor holding and moving the object relative to the electron-optical system; a mini-environment chamberfor supplying a clean gas to the object to prevent dust from contacting to the object; a working chamberfor accommodating the stage device, the working chamber being controllable so as to have a vacuum atmosphere; at least two loading chambersdisposed between the mini-environment chamber and the working chamber, adapted to be independently controllable so as to have a vacuum atmosphere; and a loaderfor transferring the object to the stage system through the loading chambers.

Inspection system by charged particle beam and method of manufacturing devices using the system

A processing method is performed for processing a workpiece such as a semiconductor wafer. The processing method utilizes an apparatus comprising a cover for covering a portion of a surface, to be processed, of a workpiece, a process chamber formed by the cover and the surface, to be processed, of the workpiece, and a sealing portion provided between the cover and the surface of the workpiece for sealing the process chamber.

Processing method utilizing an apparatus to be sealed against workpiece

A processing apparatus is used for processing a workpiece such as a semiconductor wafer. The processing apparatus comprises a cover for covering a portion of a surface, to be processed, of a workpiece, a process chamber formed by the cover and the surface, to be processed, of the workpiece, and a sealing portion provided between the cover and the surface of the workpiece for sealing the process chamber.

Processing apparatus to be sealed against workpiece

A turbo-molecular pump includes a casing having an intake port, a stator fixedly mounted in the casing, and a rotor supported in the casing for rotation relatively to the stator. The stator and the rotor make up a turbine blade pumping section and a groove pumping section for evacuating gas. A scattering prevention member is provided for preventing fragments of the rotor from being scattered through the intake port.

Turbo-molecular pump

A turbo-molecular pump has a casing, a stator fixedly mounted in the casing, and a rotor supported in the casing for rotation relatively to the stator. A turbine blade pumping assembly and a thread groove pumping assembly for discharging gas molecules are disposed between the stator and the rotor. The rotor comprises at least two components constituting the turbine blade pumping assembly and the thread groove pumping assembly. The components are separable from each other at a predetermined position, and joined to each other to form the rotor.

A vacuum exhaust system comprising a vacuum chamber; means for introducing a gas into the vacuum chamber; a main pump for exhausting the vacuum chamber and reducing a pressure of the vacuum chamber to a desired pressure; an auxiliary pump disposed downstream from the main pump; and piping for connecting them, wherein an outer diameter of connecting piping as a connection between the main pump and the auxiliary pump is &frac12; inch (12.7 mm) or less; and a length of the connecting piping and capability of the auxiliary pump are combined so that a back pressure of the main pump becomes 5 Torr or more. This vacuum exhaust system can realize cost reduction through a saving in entire space, simplification of piping construction work, and so on.

Vacuum exhaust system

Growing community of inventors

Tokyo, Japan

Hiroshi Sobukawa