Tdk Corporation

Hiroshi Shutoh

Masaaki Yamashita

Yutaka Shimizu

A resin composition includes an epoxy compound, a first triphenylbenzene compound, and a second triphenylbenzene compound. A ratio M (mol %) expressed by M (mol %)=(M1/M2)&#xd7;100 is from 0.2 mol % to 16.3 mol %, where M1 is the number of moles (mol) of an alkoxy group contained in the second triphenylbenzene compound, and M2 is sum of the number of moles (mol) of a hydroxyl group contained in the first triphenylbenzene compound, the number of moles (mol) of the hydroxyl group contained in the second triphenylbenzene compound, and the number of moles (mol) of the alkoxy group contained in the second triphenylbenzene compound.

Resin composition, resin sheet, resin cured product, and resin substrate

An inorganic filler-containing epoxy resin cured product contains a magnesium oxide powder and has a maximum thermogravimetric mass loss rate &#x394;Rof &#x2212;0.20 mass percent/&#xb0; C. or more within a temperature range of 300&#xb0; C. to 500&#xb0; C. The filling factor of the magnesium oxide powder in the inorganic filler-containing epoxy resin cured product is 45% to 63% by volume.

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Tokyo, Japan

Hiroshi Shutoh