Hitachi, Ltd.

Toshiba Tec Kabushiki Kaisha

The Yokohama Rubber Co., Ltd.

Hitachi Power Semiconductor Device, Ltd.

Hiroshi Shintani

Kazuhiro Ogura

Naotaka Tanaka

Hisashi Tanie

Eiichi Ide

Yu Harubeppu

Gang Hou

Koji Sasaki

Naoki Takeda

Kazuto Yamakawa

Atsuo Nishihara

Jiro Watanabe

Shusaku Tomoi

Akinori Iwase

Hiroshi Yamaguchi

Kenya Kawano

Susumu Hatanaka

Hiroaki Shibano

Hiroyuki Wakamatsu

Ikuma Yusa

Hirofumi Harada

Nobuaki Kuribayashi

Tomohiro Onda

Aya Inokuchi

Miho Inahara

Naoshi Yamaguchi

Mie Okura

Ryuhei Suzuki

Yuki Mizutani

Tomohide Saita

A vibration generation device which can vibrate in only one axial direction is used to simultaneously load a vibration force in a plurality of axial directions onto a test piece, and to make it possible to easily modify the proportion of vibration force in each axial direction. The present invention includes: a vibration generation device connection partwhich is connected to the vibration generation device and is vibrated in a z-axis direction; a first diaphragmwhich is connected to the vibration generation device connection partand extends in cantilevered form in an x-axis direction intersecting the z-axis direction; a second diaphragmwhich is connected to the vicinity of an end of the first diaphragmin the x-axis direction, and which extends in cantilevered form in the z-axis direction and a y-axis direction intersecting the x-axis direction; and a test piece installation parton which the test piece is installed and which receives vibrations via the first diaphragmand the second diaphragmfrom the vibration generation device connection part, wherein at least one of the first diaphragmand the second diaphragmhas a length adjustment mechanism

Test jig and test method

Provided is a piping system for an air conditioner installed in a vehicle that can achieve appropriate weight reduction while ensuring appropriate pressure resistance as the piping system as a whole. A circulation path that connects component devices of an air conditioner () in an annular shape to circulate a refrigerant (C) is formed by each pipe body extending between the component devices. At least one of the pipe bodies includes: a resin hose () embedded with a non-metal reinforcing material () or a resin pipe () embedded with a non-metal reinforcing material (), and the resin pipe bodies (), () are employed in 50% or more of a total length of each of the pipe bodies constituting the circulation path.

Piping system for air conditioner installed in vehicle

Provided is a highly reliable semiconductor device capable of reducing stress generated in a semiconductor element even when a highly elastic joining material such as a Pb-free material is used in a power semiconductor having a double-sided mounting structure. The semiconductor device includes a semiconductor element including a gate electrode only on one surface, an upper electrode connected to the surface of the semiconductor element on which the gate electrode is provided, and a lower electrode connected to a surface opposite to the surface of the semiconductor element on which the gate electrode is provided. A connection end portion of the upper electrode with the surface of the semiconductor element on which the gate electrode is provided is located inside an end portion of the surface of the semiconductor element on which the gate electrode is provided, and a connection end portion of the lower electrode with the opposite surface of the semiconductor element is located inside an end portion of the opposite surface of the semiconductor element.

Semiconductor device including a semiconductor element with a gate electrode on only one surface

A power module or the like is provided in which lower inductance and miniaturization are achieved. The power module includes: main body units (to), cooling units (to) which cool the main body units (to), busbars () connected to power terminals () of the main body units (to), a casing (W) in which at least contact parts with the busbars () are insulative, and a metal member () which supports the casing (W). The metal member () tightly contacts the casing (W), thereby forming a box with one side opened. At least the main body units (to) and the busbars () are arranged inside the box. An insulating sealant is provided to fill the inside of the box.

Power module and method for manufacturing the same

In order to efficiently cool a heat-generating semiconductor element, it is desirable to cool a power semiconductor element from both surfaces. Therefore, in order to cool multiple power semiconductor elements, it is an effective way to alternately arrange a semiconductor component having the incorporated semiconductor element and a cooling device. A power conversion device for handling a high-power voltage needs to ensure pressure resistance between semiconductor elements or circuits inside the device. It is an effective way to seal the semiconductor component with a sealing material such as a silicone gel. Therefore, it is necessary to install the semiconductor component or the circuit having the incorporated semiconductor element, in a case from which a liquid silicone gel prior to curing does not leak even if the gel is injected. For these reasons, an object to be achieved by the invention is that the semiconductor element can be cooled from both surfaces by alternately arranging the semiconductor component having the incorporated semiconductor element and the cooling device. The above-described object can be achieved as follows. A substantially rectangular thin plate is subjected to mountain bending and valley bending so as to form a shape having as many recesses as the number of the mounted semiconductor components having the incorporated semiconductor element. Concurrently, a lateral side in a direction orthogonal to the above-described bending direction is bent so as to dispose the case in which all edges configuring an outer shape of the thin plate are arranged on substantially the same plane. The semiconductor component having the incorporated semiconductor element is arranged at a position serving as the recess of the case. The cooling devices are arranged so as to interpose the semiconductor component having the incorporated semiconductor element via the case. The semiconductor component having the incorporated semiconductor element is sealed with a silicone gel. In addition, preferably, the case is configured to include metal which has high heat conductivity. More preferably, the case is configured to include aluminum, copper, or an alloy whose principal components are both of these.

Power-module device, power conversion device, and method for manufacturing power-module device

A power conversion apparatus includes: a circuit body including a switching device; a base member forming a first concave portion and a cooling surface; and a wedge inserted in the first concave portion of the base member. The first concave portion of the base member is formed by a substrate portion forming the cooling surface, a first wall disposed on the opposite side of the substrate portion from the cooling surface, and an intermediate portion interconnecting the first wall and the substrate portion. The first wall forms an insertion space for insertion of the wedge, and a heat transfer plane forming a heat dissipating surface and a heat transfer path of the circuit body. The intermediate portion is plastically deformed by inserting the wedge into the insertion space, thus causing the first wall to be displaced toward the location of the circuit body.

Power conversion apparatus including wedge inserts

An electronic catalog system sends catalog address information to a mobile phone through a wireless communication, sends catalog data adaptable to address information selected by the mobile phone to a storage server, and prints and outputs catalog data stored in the storage server.

Electronic catalog system, catalog data printing method, server, and computer readable recording media recording program used in server

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Tokyo, Japan

Hiroshi Shintani