Tdk Corporation

Pioneer Electronic Corporation

Hiroshi Shindo

Akio Ogawa

Hirobumi Tanaka

Keisuke Okai

Yohei Noda

Kazushige Tohta

Yui Sugiura

Tomomichi Gunji

Makoto Endo

Takashi Sakurai

Satoshi Kurimoto

Hideaki Kurata

Hirokazu Hamano

Takashi Fujii

Hisayuki Abe

Yoshikazu Ito

Osamu Fukuroi

Ko Onodera

Toshio Kubota

Shinya Yoshihara

Genichi Watanabe

Masahiko Konno

Akihiro Horita

Kou Onodera

Shingo Kamata

Satoru Takeshima

A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These layers are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. A pair of side surfaces facing each other in the first axis direction of the element body is respectively equipped with an insulating layer. A pair of end surfaces facing each other in the second axis direction of the element body is respectively equipped with an external electrode electrically connected to the internal electrode layer. The insulating layer has a mountain portion formed on a peripheral edge of the side surface and a plane portion of a central portion of the side surface.

Multilayer electronic component

A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces facing each other in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. An elastic modulus of the insulating layer is 12 GPa to 140 GPa.

A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces facing each other in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. The insulating layer integrally has an insulating layer extension portion covering part of the end surfaces facing each other in the second axis direction. W/Wis 1/30 to less than &#x215c;, where Wdenotes a width along the first axis, and Wdenotes a width along the first axis of the insulating layer extension portion. The external electrode covers at least part of the insulating layer extension portion.

There are provided a ceramic electronic component and a method for producing the ceramic electronic component, where a ground electrode layer can be directly coated with lead-free solder without lowering reliabilities. Terminal electrodeis provided with a ground electrode layerof Cu having been formed by firing, a solder layerformed of a lead-free solder based on five elements of Sn&#x2014;Ag&#x2014;Cu&#x2014;Ni&#x2014;Ge, and a diffusion layerhaving been formed by the diffusion of Ni between the ground electrode layerand the solder layer. Because the diffusion layerof Ni is formed between the ground electrode layerand the solder layer, the diffusion layer, which functions as a barrier layer, suppresses the solder leach of Cu from the ground electrode layer. The diffusion layerof Ni can also suppress the growth of fragile intermetallic compounds of Sn&#x2014;Cu. Therefore, a decrease in the bonding strength between the ground electrode layerand the solder layercan be prevented.

Ceramic electronic component and method for producing same

A plating apparatus performs a plating process while placing a work in a pod disposed in a plating bath storing a plating solution. The pod has a pair of meshes that allow the plating solution to pass but substantially inhibit the work from passing. The plating apparatus is provided with a solution flowing mechanism for flowing the plating solution out of the pod through one of the pair of meshes.

Plating apparatus and plating method

The present invention is an object to provide an apparatus or a method making it possible to easily effect connection between additional electrodes, etc. and lead electrodes when performing a processing for achieving a predetermined throat height value or crown processing or the like and making it possible to measure the requisite lapping amount. For achieving the object, a flexible electrode extension sheet is used which consists of a portion for retaining a ceramic bar in which element portions are formed and a portion where there are formed wirings respectively in correspondence with the elements and adapted to be connected to these elements, in which these wirings, which can be easily connected to an external measurement system, are electrically connected to the elements, whereby the lapping amount is easily obtained from the characteristic amount of the elements in the lapping process.

Electrode extension sheet for use in a lapping apparatus

Method for measuring amount of grinding in magnetic head producing process

The present invention relates to a lapping apparatus and a lapping method that may effect further machining in response to each element on a ceramic bar to the ceramic bar that is largely locally lapped and may reduce a cost needed for machining without any jig for holding the ceramic bar. The ceramic bar is held by a surface of an elastic member made of rubber or the like. A plurality of actuators are arranged on a back surface of this elastic member. When the ceramic bar is depressed against the lapping surface, a specific portion of the ceramic bar is deformed or strongly deformed through the elastic member by these actuators to thereby make it possible to perform the lapping in response to each element.

Magnetic head grinding device and method

An apparatus for lapping a workpiece including a plurality of magnetic heads supported by a tool is disclosed. The lapping apparatus comprises a rotary-lapping table having an abrasive surface, and a lapping device assembly provided so as to be movable with respect to the abrasive surface of the lapping table. The lapping device assembly includes a device provided at a lower portion of the lapping device assembly for supporting the tool and a device for respectively applying predetermined loads to a plurality of load applying portions of the tool. The load applying portions of the tool is disposed along the longitudinal direction of the tool. The load-applying device applies the loads from a plurality of different directions to at least one of the load applying portions of the tool so that the tool is deformed into a predetermined shape.

Apparatus and method for lapping magnetic heads

A method for manufacturing a flying type magnetic head slider includes an ion etching step for shaping a surface of the slider facing to a magnetic information medium to form a predetermined pattern by using an ion etching method, a step of forming a protection layer of an organic material to cover at least one face of the slider on which at least one electromagnetic transducer element is formed, by injecting the organic material to the at least one face of the slider from a ink jet type printer head, and a step of removing the protection layer of the organic material. The protection layer forming step is executed before the ion etching step, whereas the protection layer removing step is executed after the ion etching step.

Method for manufacturing a flying magnetic head slider

Video disc player

Growing community of inventors

Tokyo, Japan

Hiroshi Shindo