Nec Corporation

Casio Computer Co., Ltd.

Yokogawa Electric Corporation

Canon Kabushiki Kaisha

Oki Electric Industry Co., Ltd.

Mitsubishi Heavy Industries Limited

Rohm and Haas Company

Jfe Steel Corporation

Ngk Insulators, Inc.

Nitto-denko Corporation

Nippon Steel Corporation

The Furukawa Electric Co., Ltd.

National Institute of Advanced Industrial Science and Technology

Elpida Memory, Inc.

Hitachi Chemical Company, Ltd.

Hiroshi Shimizu

Kazuhiko Yoshizawa

Nobuo Masuoka

Hideo Nishijima

Yukio Nakamura

Takeshi Saitoh

Hiroyuki Kato

Junji Yoshida

Akira Miura

Naoki Tsukiji

Jun Muraki

Mitsuyuki Fujisawa

Yutaka Ohki

Michio Kaneko

Satoshi Omata

Kiyonori Tokuno

Hidetaka Kawabe

Motoyuki Suzuki

Daisuke Hayashi

Hiroaki Tanaka

Kazuhiro Takahashi

Hiroyuki Fujiwara

Minoru Kakitani

Toshio Kimura

Kentaro Mori

Kenichi Ikeda

Hiroyuki Hoshino

Kosuke Matsumoto

Fumihiko Matsuda

Ryo Fujimoto

Masanori Sakuranaga

Minoru Takeuchi

Yoshio Sano

Hideaki Matsuda

Chie Sato

Kazuo Nagata

Hidehiro Taniguchi

Masayuki Suehiro

Masao Watari

Botaro Hirosaki

Erina Ichikawa

Shohei Sakamoto

Tetsuo Onodera

Koji Akiyama

Satoshi Yoshitake

Yongjin Li

Kazunaga Yoshida

Eiichi Nakanishi

Takamitsu Onda

Yoichi Iwamoto

Keisuke Kushida

Ryohta Sasaki

Ichiro Tsuda

Shinji Kobe

Yoshikatsu Shiraokawa

Tatsunori Kaneko

Yuya Hirayama

Shuitsu Takahashi

Youko Yamaguchi

Hiromu Okamoto

Osamu Yamato

Yoshiyasu Kamiyama

Masaki Ihara

Kinichi Kimura

Shoichi Maruyama

Tomochika Hamamoto

Yuji Tosaka

Hiroshi Waki

Kenichi Kawanishi

Isamu Ichizuka

Ken Ohkubo

Tomohiko Uchino

Kenichi Tomioka

Kouzi Hara

Yoko Yamaguchi

Muneyuki Iwabuchi

Makoto Yokoi

Kenichi Tonouchi

Ryoichi Uchimura

Toshio Sekiguchi

Teruhiko Hayashi

Yuichiro Takezawa

Toshihiko Shimizu

Tadayuki Sakurada

Yoshitaka Okouchi

Norio Yoshida

Kiyoh Takahashi

Hidenori Sakamoto

Kiyoshi Takai

Shinji Oka

Kazuo Yamagishi

Ryuichi Nagase

Hitoshi Onozeki

Junichi Tamenari

Yusuke Kishine

Sigeo Sakai

Yoshinobu Ito

Tsurayuki Kawatoko

Yoshihiko Katsura

Takeo Baba

To provide a thermosetting resin composition that has low elasticity, high heat resistance, high elongation under an ordinary temperature environment and a high temperature environment, high electric insulation reliability, and high adhesion strength to a metal foil, and is capable of providing a prepreg that is excellent in crack resistance; a prepreg including the thermosetting resin composition; a metal foil with a resin including the thermosetting resin composition and a metal foil laminated on each other; a laminate including the prepreg or the metal foil with a resin; a printed wiring board including the laminate; and a semiconductor package including the printed wiring board. Specifically, the thermosetting resin composition contains (A) a phenol-based resin, and the component (A) contains (A-1) a phenol-based resin having an aliphatic hydrocarbon group having 10 to 25 carbon atoms.

Thermosetting resin composition, prepreg, resin-coated metal foil, laminate, printed wiring board, and semiconductor package

The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 &#x3bc;m or less.

Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition

Provided are a metal-clad laminate, a printed circuit board, and a semiconductor package, wherein the warps therein are effectively suppressed. Specifically the metal-clad laminate comprises a prepreg, wherein the prepreg has a resin composition attached to a fiber base material and satisfies a following formula (1) as well as a Mowing formula (2), provided that in the formulae, a1 represents an average thickness of the resin composition after being cured which is present on one surface of the fiber base material; a2 represents an average thickness of the resin composition after being cured which is present on other surface of the fiber base material; and B represents an average thickness of the fiber base material.0.12&#x3c;{(1+2)/2}/&#x2003;&#x2003;(1)0.8&#x2264;1/2&#x2264;1.25&#x2003;&#x2003;(2)

Metal-clad laminate, printed wiring board and semiconductor package

Provided is a side railhaving an outer peripheral surface, an inner peripheral surface, a first axial side surface, and a second axial side surfaceparallel to the first axial side surface, in which, a beveled portionis provided between the outer peripheral surfaceand the second axial side surface, the beveled portionis formed in a tapered surface having a diameter gradually decreasing from the first axial side surfacetoward the second axial side surface in an axial direction; a tapered surfaceis provided between a first tapered surface portionwith an angle of 10&#xb0; or more to the axial direction and a second tapered surface portionprovided between the first tapered surface portionand the outer peripheral surfaceand having a smaller angle of inclination to the axial direction than that of the first tapered surface portion.

Side rail

A ferritic stainless steel sheet comprises: a predetermined chemical composition, wherein a difference between a maximum value and a minimum value of Vickers hardness in a thickness direction is HV 50 or less.

Ferritic stainless steel sheet and method of producing same

Provided is a hot-rolled and annealed ferritic stainless steel sheet excellent in surface quality after bending work has been performed. A hot-rolled and annealed ferritic stainless steel sheet has a thickness of 5.0 mm or more and a chemical composition containing, by mass %, C: 0.001% to 0.025%, Si: 0.05% to 0.70%, Mn: 0.05% to 0.50%, P: 0.050% or less, S: 0.01% or less, Cr: 10.0% to 18.0%, Ni: 0.01% to 1.00%, Al: 0.001% to 0.10%, N: 0.001% to 0.025%, Ti: 0.01% to 0.40%, and a balance of Fe and inevitable impurities, in which a difference between maximum and minimum values of an average crystal grain diameter determined by using measuring method 1 is 50 &#x3bc;m or less, and in which a difference between maximum and minimum values of a crystal grain elongation rate determined by using measuring method 2 is 5.0 or less.

Hot-rolled and annealed ferritic stainless steel sheet and method for manufacturing the same

The present invention provides a thermosetting resin composition containing (A) a maleimide compound, (B) an epoxy resin having at least two epoxy groups in one molecule, (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a maleic anhydride, (D) a silica treated with an aminosilane coupling agent, and (E) a flame retardant dispersion.

Thermosetting resin composition and its production method, prepreg, laminate, and printed wiring board

A lens-mold producing method includes a position and posture determining step of specifying positions and postures, in space coordinates, of a first mold having a molding surface for forming one optical surface of a lens and a second mold having a molding surface for forming the other optical surface, a mold holding step of rotating and/or inclining, based on the positions and postures in the space coordinates, at least one of the first and second mold, maintaining a rotation angle and/or an inclination angle of a reference plane of the first mold with respect to a reference plane of the second mold, and holding the first and second mold, and an assembling step of arranging the molding surfaces of the first and second mold so as to face each other, fixing outer peripheries of the first mold and the second mold, and assembling a lens mold.

Method for manufacturing lens forming mold, method for manufacturing eyeglass lens, and eyeglass lens

Provided are a printed circuit board in which warps are effectively suppressed, and a semiconductor package having a semiconductor device mounted on said printed circuit board, even though circuit patterns of different amounts of metal are formed on both sides of one cured product of a prepreg. Specifically, said printed circuit board is a printed circuit board which comprises a cured product of a prepreg comprising a fiber base material and a resin composition, in which circuit patterns of different amounts of metal are formed on both sides of one cured product of the prepreg, in which said prepreg has layers on the front and back of said fiber base material, wherein said layers comprise resin compositions having different heat curing shrinkage rates, in which among these layers, the layer made of the resin composition having a smaller heat curing shrinkage rate is present on the side on which the circuit pattern with a smaller amount of metal is formed.

Printed wiring board and semiconductor package

The present invention provides a resin varnish, a prepreg, a laminate and a printed wiring board, using a thermosetting resin composition having high heat resistance, low relative permittivity, high metal foil adhesion, high glass transition temperature and low thermal expansion and excellent in moldability and platability. Specifically, the resin varnish contains (A) a maleimide compound, (B) an epoxy resin, (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a maleic anhydride, (D) a silica treated with an aminosilane coupling agent, and (G) an organic solvent.

Resin varnish, prepreg, laminate, and printed wiring board

Disclosed is a production method of a multi-layered printed wiring board, including the following steps 1 to 3:

Multilayer printed wiring board production method, adhesive layer-equipped metal foil, metal-clad laminate, and multilayer printed wiring board

Provided are a prepreg including two or more fiber substrate layers and one or more resin composition layers, in which at least one of the one or more resin composition layers has a fiber substrate layer on each of both surfaces thereof, a printed circuit board using the prepreg and a method of producing the printed circuit board, and a semiconductor package.

Prepreg, printed circuit board, semiconductor package, and method for producing printed circuit board

A side rail () in a sprit ring shape is to be mounted on a space expander () and to constitute, together with the space expander (), a multi-piece oil ring () used in an internal combustion engine. The side rail () includes an outer peripheral surface () facing radially outward, an inner peripheral surface () facing radially inward, a first axial surface () facing one end of an axial direction, and a second axial surface () facing the other end of the axial direction and parallel to the first axial surface (). A bevelled portion () is provided between the outer peripheral surface () and the second axial surface () and formed in a tapered surface having a diameter gradually decreasing from a position on the outer peripheral surface () at 0.05 mm or more from the first axial surface () toward the second axial surface ().

Since a display device is used in a relatively large room, it often displays images on a large screen. On the other hand, a display terminal often displays images on a small screen. Therefore, when the same image is displayed on the display device and the display terminal, the displayed image on the display terminal is so small that the viewer has difficulty in discerning details of the image, which poses a problem that the display terminal is disadvantageous. In a display system including a display terminal and a display device, the display device detects position coordinates optically pointed out by a pointer on a displayed image, and displays a given pointer mark at the detected position coordinates. The display terminal displays a magnified version of the displayed image approximately around received position coordinates serving as a center thereof, and displays a given pointer mark at the position coordinates.

Display system, display device, display terminal, display method of display terminal, and control program

An image capture apparatus including a timing generator that generates a frame synchronization signal with a constant cycle receives a reference signal generated at a predetermined interval based on a predetermined reference cycle, compares generation timing of the reference signal received with generation timing of the frame synchronization signal generated by the timing generator, and adjusts a generation cycle of the frame synchronization signal generated by the timing generator based on a result of the comparison.

Image capture apparatus having function of generating frame synchronization signal at constant cycle

Growing community of inventors

Tokyo, Japan

Hiroshi Shimizu