Tokin Corporation

Sharp Kabushiki Kaisha Corporation

Nec Tokin Corporation

Hiroshi Shima

Katsunori Kumasaka

Shun Mikoshiba

Yoshiyuki Abe

Noriaki Ikezawa

Kenichi Chatani

Masao Yamaguchi

Osamu Yamazaki

Takeshi Mizuno

Kenichiro Kobayashi

Kouichi Shuta

Yoshihiro Saito

A method includes preparing a first substrate member in which a cavity is formed. Moreover, the method includes preparing a magnetic member having a plurality of magnetic pieces. The magnetic member is placed in the cavity, and the second substrate member is placed on the first substrate member to close the cavity. The cavity is defined at least in part by a pair of wall surfaces facing each other in a lateral direction and opens upward in an up-down direction perpendicular to the lateral direction. The magnetic pieces are coupled with each other by positioning members so as to be arranged at regular intervals in a predetermined direction. The placing of the magnetic member in the cavity is carried out so that the predetermined direction coincides with the lateral direction or a front-rear direction perpendicular to both of the lateral direction and the up-down direction.

Method of manufacturing circuit board and circuit board

Inductor

A laminated substrate includes an upper prepreg cured body, a lower prepreg cured body and a magnetic member. The magnetic member is sandwiched between the upper prepreg cured body and the lower prepreg cured body in an up-down direction. The upper prepreg cured body is directly coupled to the lower prepreg cured body all over a predetermined area surrounding the magnetic member in a plane perpendicular to the up-down direction. The magnetic member is formed by binding soft magnetic metal powder using a binder. The soft magnetic metal powder consists of particles each of which has a flat shape. The binder comprises inorganic oxide as a chief ingredient. The magnetic member includes the soft magnetic metal powder of 60 vol. % or more and open pores of 10 vol. % or more and 30 vol. % or less. The magnetic member has a thickness of 0.3 mm or less.

Laminated substrate and manufacturing method of the same

In the present invention, a device is provided with a main surface member, a piezoelectric body plate, a first support part, and a housing. The main surface member is used as a vibration plate. The piezoelectric body plate vibrates according to an electric signal. The first support part supports the piezoelectric body plate. The housing has a second support part that supports the main surface member and extends in a prescribed direction that intersects the main surface member. The first support part is secured to the second support so that the second support part vibrates in the prescribed direction according to the vibration of the piezoelectric body plate. The vibration of the piezoelectric body plate is transmitted to the main surface member via the first support part and the second support part, and due to this the main surface member vibrates to generate a sound.

Device generating sound

A piezoelectric vibration module includes a piezoelectric element, a wiring member connected to the piezoelectric element and drawn out to the outside, and an elastic plate bonded to one surface of the piezoelectric element, wherein the elastic plate is made of a silicone rubber.

Piezoelectric element, piezoelectric vibration module, and methods of manufacturing the same

Growing community of inventors

Sendai, Japan

Hiroshi Shima