Jsr Corporation

Other

Hiroshi Shiho

Hiroyuki Tano

Nobuo Kawahashi

Hitoshi Kato

Yukio Hosaka

Takahiro Okamoto

Kou Hasegawa

Hiroyuki Miyauchi

Yasuo Matsuki

Hideki Nishimura

Mibuko Shimada

Kenji Ishizuki

Satoshi Ishikawa

Hiroshi Yamamoto

Joseph Desimone

Tatsuya Shimizu

Kouji Tamori

Yasuaki Yokoyama

Yuichi Hashiguchi

Toshinori Sakagami

Satoshi Ebata

Takuya Yamazaki

Jeremy Richard Lizotte

Sachiko Hashimoto

Hiromi Aoi

Isamu Yonekura

Michiaki Ando

Yoichiro Maruyama

Hideki Izawa

Terri J Carson

Polishing pad

A chemical mechanical polishing pad having a face for polishing an object to be polished, a non-polishing face opposite to the face and a side face for interconnecting these faces and including the pattern of recessed portions which are formed on the non-polishing face and are open to the non-polishing face but not on the side face.

Chemical mechanical polishing pad

A chemical mechanical polishing pad which has a storage elastic modulus E'(30&#xb0; C.) at 30&#xb0; C. of 120 MPa or less and an (E&#x2032;(30&#xb0; C.)/E&#x2032;(60&#xb0; C.)) ratio of the storage elastic modulus E&#x2032;(30&#xb0; C.) at 30&#xb0; C. to the storage elastic modulus E&#x2032;(60&#xb0; C.) at 60&#xb0; C. of 2.5 or more when the storage elastic moduli of a polishing substrate at 30&#xb0; C. and 60&#xb0; C. are measured under the following conditions:

Chemical mechanical polishing pad and chemical mechanical polishing process

The present invention relates to a method of manufacturing a chemical mechanical polishing pad which provides a chemical mechanical polishing pad which fully suppresses the occurrence of a scratch on the polished surface and has an excellent polishing rate. The method comprising either one of a group of steps (A) and a group of steps (B), the group of steps (A) including

Method of manufacturing chemical mechanical polishing pad

An objective of the present invention is to provide a polishing pad for a semiconductor wafer and a laminated body for polishing of a semiconductor wafer equipped with the same which can perform optical endpoints detection without lowering the polishing performance as well as methods for polishing of a semiconductor wafer using them. The polishing pad of the present invention comprises a substratefor a polishing pad provided with a through hole penetrating from surface to back, a light transmitting partfitted in the through hole, the light transmitting part comprises a water-insoluble matrix material (1,2-polybutadiene) and a water-soluble particle (&#x3b2;-cyclodextrin) dispersed in the water-insoluble matrix material, and the water-soluble particle is less than 5% by volume based on 100% by volume of the total amount of the water-insoluble matrix material and the water-soluble particle. In addition, the laminated body for polishing of the present invention comprises a supporting layer on a backside of the polishing pad. These polishing pad and laminated body for polishing can comprise a fixing layeron a backside.

Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer

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Tokyo, Japan

Hiroshi Shiho