Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Hiroshi Shigemura

Tomoya Maekawa

Toru Yamada

Hideaki Nakakubo

Toshio Ishizaki

Hiroshi Kushitani

Toshiya Motooka

Masaki Kita

Emiko Kawahara

Fumihiko Taniguchi

Seiji Tamura

Yasurou Kurahara

The present invention is a temperature sensor that is inserted into a screw hole of a container to be detected. The temperature sensor includes a bottomed cylindrical metal case having an opening part, a temperature-sensitive element disposed inside the opening part, a terminal in which lower end thereof is connected to the temperature-sensitive element and an upper end thereof is led out outward, and a resin coupler that seals the opening part. The terminal is led out from the resin coupler. The metal case includes a lower part disposed with the temperature-sensitive element, a screw part that is provided above the lower part and is engaged with the screw hole, and a large diameter part that is provided above the screw part and has a larger diameter than a diameter of the screw part. Further, an outer circumference of the large diameter part is covered with a resin layer.

Temperature sensor

A temperature sensor includes a detector and a first mold-resin body. The detector includes: a temperature sensing element which is disposed at a first end part of the detector, a terminal which is disposed at a second end part of the detector, and a lead wire for coupling the temperature sensing element to the terminal. The first mold-resin body covers the temperature sensing element, a portion the terminal, and the lead wire. The temperature sensor further includes a second mold-resin body which covers an another portion of the terminal and the first mold-resin body; the another portion of the terminal is exposed from the first mold-resin body. Then, a gate mark is formed on a surface of the second mold-resin body; the surface faces a side of the first end part.

Temperature sensor and manufacturing method therefor

In recent years, ceramic laminated devices are becoming a focus of great attention as considerable contribution to the miniaturization of high frequency wireless equipment such as a cellular phone, but it is difficult for the conventional ceramic laminated device to secure reliability while maintaining favorable high frequency characteristics. The present invention provides a ceramic laminated device including a reinforcement electrode, which is formed inside a laminated body in which a plurality of ceramic layers, a plurality of inner electrodes and inter-layer via holes are stacked, not electrically connected with inner electrodes nor inter-layer via holes but mechanically connected with the ceramic layers.

Ceramic laminated device, communication equipment and method of manufacturing ceramic laminated device

A duplexer is composed of a laminate in which dielectric layers and electrode layers are laminated alternately. A first filter for transmitting and a second filter for receiving, having different pass band frequencies, are provided in the laminate. A matching circuit composed of a coupling line, having one end that is short-circuited and the other end that is connected to an external terminal, is provided between the first filter and the second filter. The first filter includes two first stripline resonators, each having one end that is short-circuited. The second filter includes two second stripline resonators, each having one end that is short-circuited. The coupling line is coupled to the first stripline resonator dose to the coupling line by electromagnetic field coupling. The coupling line is coupled to the second stripline resonator close to the coupling line by electromagnetic coupling.

Duplexer, and laminate-type high-frequency device and communication equipment using the same

The present invention comprises baluns which convert balanced line signals and unbalanced line signals mutually, and filters which are electrically connected to the baluns and pass or attenuate the predetermined frequency bands. Electrode layers which compose the electrode patterns of the baluns and the filters , and the dielectric layers are integrally stacked.

Complex high frequency components

A dielectric filter including a plurality of resonators, and at least one transmissions line provided among said plurality of resonators. A band rejection characteristic is formed around a resonance frequency of said resonator, and a line length of said transmission line is shorter than &frac14; of a wavelength corresponding to the resonance frequency of said resonator.

Dielectric filter, antenna duplexer, and communications appliance

A dielectric filter including a plurality of resonators, and at least one transmission line provided among said plurality of resonators. A band rejection characteristic is formed around a resonance frequency of the resonator, and a line length of the transmission line is shorter than &frac14; of a wavelength corresponding to the resonance frequency of the resonator.

A laminated filter comprising a laminated body created by laminating a plurality of dielectric sheets, a resonator electrode disposed on an inner part of the laminated body, and an input-output electrode disposed on the inner part of the laminated body at a position facing the resonator electrode through the dielectric sheet. A stub electrode is connected to the input-output electrode.

Growing community of inventors

Kyoto, Japan

Hiroshi Shigemura