Lapis Semiconductor Co., Ltd.

Kirin Beer Kabushiki Kaisha

Kabushiki Kaisha Toshiba

Hiroshi Shibata

Fumio Takahashi

Norio Endo

Atsushi Yoshimura

Kuniaki Tsurushima

Daiju Mizumoto

Takahiro Yamamichi

Shinobu Ueno

Takafumi Asakura

A semiconductor device has a semiconductor substrate and a semiconductor film doped with impurities that is formed so as to cover an inner wall surface of a trench formed so as to extend from a first surface of the semiconductor substrate towards an interior thereof. The semiconductor film is formed so as to extend continuously from the inner wall surface to the first surface of the semiconductor substrate. The semiconductor device further has an opposite electrode having a first portion that is provided at a position opposing the semiconductor substrate while sandwiching the semiconductor film therebetween, and that extends on the first surface of the semiconductor substrate, and a second portion that is continuous with the first portion and extends so as to fill the trench. The semiconductor device further has an insulating film that insulates the semiconductor film from the opposite electrode.

Semiconductor device and manufacturing method for semiconductor device

A semiconductor device has: a semiconductor substrate; a trench that extends from a first surface of the semiconductor substrate towards an interior of the semiconductor substrate, and that has a recess/protrusion structure on a side wall surface thereof; a semiconductor film that is formed so as to cover the side wall surface of the trench, be continuous with the side wall surface, and extend onto the first surface of the semiconductor substrate; an opposite electrode having a first portion that is provided at a position opposing the semiconductor substrate while sandwiching the semiconductor film therebetween, and that extends on the first surface of the semiconductor substrate, and a second portion that is continuous with the first portion and extends so as to fill the trench; and an insulating film that insulates the semiconductor film from the opposite electrode.

A semiconductor wafer manufacturing method including: forming a plurality of trench capacitors at a main surface of a semiconductor wafer, wherein each of the plurality of trench capacitors is configured as unit cells that internally include unit trench capacitors, and wherein a length component in a predetermined direction of a layout pattern of trenches of the plurality of trench capacitors is made equivalent, within a fixed tolerance range, to a length component in a direction that intersects the predetermined direction.

Semiconductor wafer manufacturing method and semiconductor device

A semiconductor device including a light receiving portion provided in a semiconductor layer of a first conductor type, the light receiving portion being of a second conductor type that is different from the first conductor type; a buffer layer provided at a light incidence side of the light receiving portion, the buffer layer being of the first conductor type; and a low refractive index layer provided at a light incidence side of the buffer layer, the low refractive index layer having a lower refractive index than refractive indices of the semiconductor layer and the buffer layer.

Semiconductor device configuring a back-illuminated solid state imaging device and semiconductor device manufacturing method thereof

An effervescent beverage containing a grain degradation product which contains creamy and tasty foam having a refreshing texture and a new texture of a prolonged creamy-foam retention is formed on the effervescent beverage upon drinking, a method for dispensing and a dispenser of such effervescent beverage are disclosed. According to the present invention, there is provided a method for dispensing the effervescent beverage containing a grain degradation product by cooling the effervescent beverage and pouring it into a vessel to serve, wherein foam having a snow-like refreshing texture and a new texture of a prolonged creamy-foam retention is formed on the effervescent beverage, said method comprising:

Effervescent beverage containing grain degradation product with refreshing foam

A packing material removal apparatus for removing a packing material from a package including combined articles herein and supplying the combined articles to a next process by a supplying unit, comprises a cutting unit having a suction opening for sucking the packing material to form a slack section, and a cutter for cutting the slack section, a removal unit having a pair of removal rollers which rotate in opposite directions to each other and on which the package cut by the cutting unit is put, and a drop unit having a transferring board, a shutter board for preventing the combined articles from being transferred to the supplying unit and permitting the combined articles to be sent to the supplying unit, an operation device for moving the shutter board upwardly and downwardly with respect to the transferring board, and side boards for supporting both ends of the combined articles on the transferring board.

Apparatus for removing packing material from packed article

An outer lead bending apparatus comprises a fixed unit, a movable unit movable toward and away from the fixed unit, a first die detachably mounted on one of the fixed unit and movable unit and holding a semiconductor package devise in place, and a second die detachably mounted on the other unit and, when the movable unit is driven toward the fixed unit, bending, together with the first die, the outer leads of the semiconductor package devise into a given configuration.

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Yokohama, Japan

Hiroshi Shibata