Sony Corporation

Sony Chemical & Information Device Corporation

Sony Chemicals Corporation

Hiroshi Samukawa

Kouki Hatsuda

Yoshito Ikeda

Katsuhiko Komuro

Mamiko Nomura

Hisashi Ando

Kazuki Shibata

Norikazu Yamamoto

A light-emitting device is provided which uses an encapsulant material made from a polymer having a high relative light output. The light-emitting device includes a light-emitting element and a member sealing the light-emitting element. The encapsulant material has one or more than two kinds of units given by the following formula (1) and a refractive index of 1.55 or more. where R is a hydrogen atom, alkyl group or phenyl group, Y is an alkyl group of which the carbon number is 1 to 6 or an alkyloxy group of which the carbon number is 1 to 6 and Z is an aromatic compound that meets predetermined requirements.

Encapsulant material for optical component and light-emitting device

Disclosed is a method for sealing a light-emitting device wherein formation of air bubbles in a light-emitting device module can be prevented by performing no gelation after fitting of a cover member. This method also enables to seal a light-emitting device by using a gel sealing material composed of a gel precursor which uses a solvent. Also disclosed is a light-emitting module formed by such a sealing method. In this method for sealing a light-emitting device, gelation of the gel precursor of a gel sealing material is performed before placing the precursor on the light-emitting device, and thus no gelation is necessary after fitting of a cover member. Consequently, a gel precursor having high viscosity that is difficult to be used in an injection method can be used in this method. Furthermore, a substance which requires use of a solvent can be used as a gel precursor of a gel sealing material. A light-emitting device module with high luminance wherein no air bubbles are included can be obtained by this method.

Light emitting element module and method for sealing light emitting element

An encapsulating resin composition is provided, which gives a cured product having heat resistance, light resistance, and flexibility equivalent to those of silicone resins and having a refractive index of 1.57 or greater which is larger than that of epoxy resins. The encapsulating resin composition contains: a high refractive index acrylic-based or methacrylic-based monomer having a refractive index of 1.55 or greater; and a nonfunctional fluorene compound. In a preferred form, each of the high refractive index acrylic-based or methacrylic-based monomer and the nonfunctional fluorene compound has a 9,9-bisphenylfluorene skeleton.

Encapsulating resin composition and light-emitting device

A curable resin composition is provided which has an appropriate viscosity suitable for encapsulating a light-emitting device. The cured product of the curable resin composition has a refractive index equal to or larger than that of epoxy resins, is excellent in heat resistance and light resistance, and has thermal stress relaxation properties. The curable resin composition contains a high refractive index acrylic-based monomer having a refractive index of 1.52 or more and a non-polymerizable carbazole, and further contains a polymerizable carbazole in accordance with need. An acrylate or methacrylate having a fluorene skeleton, a bisphenol-A skeleton, a biphenyl skeleton, a naphthalene skeleton, or an anthracene skeleton is used as the high refractive index acrylic-based monomer.

Curable resin composition

A liquid-absorbent composition, which has a liquid-absorbent crosslinked resin that exhibits excellent absorption of the nonaqueous electrolyte of nonaqueous electrolyte secondary cells that constitute a nonaqueous electrolyte battery pack (and particularly a lithium ion nonaqueous electrolyte rechargeable battery pack), contains a powder of a liquid-absorbent crosslinked resin produced by crosslinking a methyl vinyl ether/maleic anhydride copolymer with a polyfunctional isocyanate compound, and a binder resin. Also, a liquid-absorbent sheet for a nonaqueous electrolyte battery pack contains supporting substrate and formed on one side of a supporting substrate a liquid-absorbent crosslinked resin layer, produced by crosslinking a methyl vinyl ether/maleic anhydride copolymer with a polyfunctional isocyanate compound. The nonaqueous electrolyte battery pack contains a battery case and disposed within the battery pack a nonaqueous electrolyte battery cell, a wiring circuit board, and an electrolyte absorption member formed from the liquid-absorbent sheet for absorbing electrolyte in the event that electrolyte leaks from the nonaqueous electrolyte battery cell.

Non-aqueous electrolyte battery pack comprising a liquid-absorbent composition

A resin composition having a viscosity suitable for encapsulating optical devices such as light-emitting devices is provided. Specifically, the cured product of the resin composition has a refractive index greater than or equal to that of epoxy resins, exhibits excellent heat resistance and light resistance, and has thermal stress relaxation properties. The curable resin composition contains a fluorene group-containing acrylate or methacrylate represented by the following formula and a specific monofunctional acrylate or methacrylate: wherein X is &#x2014;(CHCHO)&#x2014; or &#x2014;(CHCHO)&#x2014;CHCH(OH)CHO&#x2014; with n being 1 to 5 and R is an acrylic or methacrylic group.

The disclosure relates to methods and solutions for precisely and rapidly etching a polyimide resin layer. Etching solutions of the present invention include 3&#x2013;65% by weight of a diol containing 3 to 6 carbon atoms or a triol containing 4 to 6 carbon atoms, 10&#x2013;55 % by weight of an alkali compound and water in an amount of 0.75&#x2013;3.0 times the amount of the alkali compound, and can be used at 65&#xb0; C. or more to rapidly etch a polyimide resin layer having an imidation degree of 50&#x2013;98 % without unfavorably affecting the working atmosphere. Even if the resin layer is completely imidated after etching, the etching pattern of the resulting resin layer is not deformed with a decreased contamination by impurity ions as compared with those obtained using conventional etching solutions.

Etching solutions and processes for manufacturing flexible wiring boards

The present invention provides a lowly-adhesive coating material comprising 99 to 33% by weight of a fluorine-containing acrylic polymer obtained by polymerizing a monomer composition mainly comprising acrylate or methacrylate having C perfluoroalkyl groups and 1 to 67% by weight of a fluorine-type oil.

Lowly-adhesive coating material

Process for producing fluorine-containing acrylic or methacrylic polymers

Acrylic emulsions are obtained by carrying out a polymerization reaction of a first acrylic monomer dispersion, adding a second acrylic monomer dispersion, and carrying out a further polymerization reaction wherein the first acrylic monomer dispersion contains acrylic monomer and tackifier in a first proportion to acrylic monomer contained in the first acrylic monomer dispersion and wherein the second acrylic monomer dispersion contains acrylic monomer and tackifier in a second proportion to acrylic monomer contained in the second acrylic monomer dispersion, and wherein the proportion of tackifier in the first acrylic monomer dispersion is lower than the proportion of tackifier in the second acrylic monomer dispersion. A high molecular weight acrylic polymer is obtained when the first acrylic monomer dispersion is polymerization reacted. The second acrylic monomer dispersion is added to the first acrylic monomer dispersion after the first acrylic monomer dispersion is polymerization reacted. The tackifier is added to the acrylic polymer when the first acrylic monomer dispersion is further polymerized with the second acrylic monomer dispersion. Thus, holding power and adhesion are improved at the same time.

Growing community of inventors

Tochigi, Japan

Hiroshi Samukawa