Alps Electric Co., Ltd.

Hiroshi Sakuma

Akiyuki Yoshisato

Akihiko Inoue

Kazuhiko Ueda

Yasuhiro Ikarashi

Yasuhio Ikarashi

The invention provides a surface mounting type electronic circuit unit that is suitable for miniaturization and is suitable for simple output adjustment. Circuit elements including capacitors, resistors, and inductance elements and a conducting pattern connected to the circuit elements are formed on an alumina substrate by means of thin film forming technique, and a diode D and a semiconductor chip of a transistor are fixed to a connection land of the conducting pattern by means of wire bonding, wherein only the emitter resistor out of the base bias voltage dividing resistors and the emitter resistor of the transistor is trimmed for output adjustment.

Electronic circuit unit that is suitable for miniaturization and suitable for simple output adjustment

In a surface-mounting-type electronic-circuit unit, circuit elements, including capacitors, resistors, and inductive devices, and electrically conductive patterns connected to the circuit elements are formed on an alumina board as thin films. Semiconductor bare chips for a diode and a transistor are wire-bonded to connection lands in electrically conductive patterns. And end-face electrodes connected to grounding electrodes, input electrodes, and output electrodes of electrically conductive patterns are formed at side faces of the alumina board.

Compact, surface-mounting-type, electronic-circuit unit

The invention provides an electronic circuit unit that is suitable for miniaturization and excellent in high frequency characteristic. Capacitors and a wiring pattern are formed on an alumina substrate by means of thin film forming technique, and a part of the wiring pattern is served as the connection land for mounting a bare chip of a transistor. Among the capacitors, the top electrode of the capacitor is served also as a part of the connection land, and the bottom side collector electrode of the bare chip is connected to the connection land by use of conductive adhesive. Top electrodes of the residual capacitors are served as the bonding pad, and the base electrode and the emitter electrode on the top side of the bare chip are connected to the top electrodes of the respective capacitors by a wire.

Electronic circuit unit that is suitable for miniaturization and excellent in high frequency characteristic

To provide a surface-mounting type electronic circuit unit suitable for miniaturization, circuit elements including capacitors, resistors and inductance elements and a conductive pattern connected to these circuit elements are thinly formed on an alumina substrate, semiconductor bare chips for a diode and a transistor are bonded on a connection land of the conductive pattern via wire, an inductance element composed of a pair of conductors opposite at a predetermined interval on the aluminum board is thinly formed and a unbalance/balance converter is formed by these conductors.

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Miyagi-ken, Japan

Hiroshi Sakuma