Fujifilm Corporation

Central Glass Company, Limited

Hiroshi Saegusa

Kaoru Iwato

Yusuke Iizuka

Shuji Hirano

Kazuhiko Maeda

Satoru Narizuka

Takayuki Kato

Kei Yamamoto

Kunihiko Kodama

Shinichi Kanna

Tomotaka Tsuchimura

Hideaki Tsubaki

Akinori Shibuya

Kenji Wada

Shuhei Yamaguchi

Shinji Tarutani

Shinichi Sugiyama

Masahiro Yoshidome

Kousuke Koshijima

According to one embodiment, an actinic-ray- or radiation-sensitive resin composition includes (A) a resin that when acted on by an acid, increases its solubility in an alkali developer, (B) a compound that when exposed to actinic rays or radiation, generates an acid, and (C) a resin containing at least one group selected from among the following groups (x) to (z) and further containing at least either a fluorine atom or a silicon atom, in which three or more polymer chains are contained through at least one branch point, (x) an alkali-soluble group, (y) a group that when acted on by an alkali developer, is decomposed to thereby increase its solubility in the alkali developer, and (z) a group that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer.

Actinic-ray- or radiation-sensitive resin composition and method of forming pattern using the composition

A positive resist composition for immersion exposure includes the following (A) to (D): (A) a resin capable of decomposing by an action of an acid to increase a solubility of the resin in an alkali developer; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (C) a resin having at least either one of a fluorine atom and a silicon atom; and (D) a mixed solvent containing at least one kind of a solvent selected from the group consisting of solvents represented by any one of the following formulae (S1) to (S3) as defined in the specification, in which a total amount of the at least one kind of the solvent is from 3 to 20 mass % based on all solvents of the mixed solvent (D). 

Positive resist composition for immersion exposure and pattern forming method

An actinic-ray- or radiation-sensitive resin composition comprises (A) a resin that when acted on by an acid, exhibits an increased solubility in an alkali developer, (B) a compound that when exposed to actinic rays or radiation, generates an acid, (C) a resin containing two or more resins (c) each having at least either a fluorine atom or a silicon atom, and (D) a solvent.

Provided is an actinic ray-sensitive or radiation-sensitive resin composition including: (A) a resin capable of increasing the solubility in an alkali developer by the action of an acid, the resin containing (a) a repeating unit represented by the following formula (AN-01), (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and (C) a resin that contains at least either a fluorine atom or a silicon atom and contains a repeating unit having a group capable of decomposing by the action of an alkali developer to increase the solubility in an alkali developer: wherein the variables in formula (AN-01) are defined in the description.

Actinic ray-sensitive or radiation-sensitive resin composition and resist film and pattern forming method using the composition

Provided is an actinic ray-sensitive or radiation-sensitive resin composition including: (A) a resin capable of increasing the solubility in an alkali developer by the action of an acid, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and (C) a resin which contains (c) a repeating unit having at least one polarity conversion group and has at least either a fluorine atom or a silicon atom.

Actinic ray-sensitive or radiation-sensitive resin composition and pattern forming method using the composition

An actinic ray-sensitive or radiation-sensitive resin composition, includes: (A) a resin capable of increasing the solubility of the resin (A) in an alkali developer by the action of an acid; and (C) a resin having at least either a fluorine atom or a silicon atom and containing (c) a repeating unit having at least two or more polarity conversion groups.

Actinic ray-sensitive or radiation-sensitive resin composition and pattern forming method using the same

According to one embodiment, an actinic-ray- or radiation-sensitive resin composition comprises a hydrophobic resin (HR) containing a fluorine atom, wherein the hydrophobic resin (HR) comprises any of repeating units (a) of general formula (I) or (II) below: 

An actinic ray-sensitive or radiation-sensitive resin composition, wherein when a film having a film thickness of 100 nm is formed from the actinic ray-sensitive or radiation-sensitive resin composition, the film has a transmittance of 55 to 80% for light at a wavelength of 193 nm, and a pattern forming method using the composition are provided.

Provided is a polymerizable compound represented by the following general formula (ca-1) or (cb-1): wherein the variables in the formulae are defined in the specification.

Polymerizable compound and polymer compound obtained by using the same

A resist composition comprises: (A) a resin capable of increasing its solubility in an alkali developer by action of an acid; (B) a compound capable of generating an acid upon irradiation with actinic ray or radiation; (C) a resin having at least one of a fluorine atom and a silicon atom; and (D) a solvent, wherein the resin (C) has a degree of molecular weight dispersion of 1.3 or less and a weight average molecular weight of 1.0&#xd7;10or less.

Resist composition, resin for use in the resist composition, compound for use in the synthesis of the resin, and pattern-forming method using the resist composition

Polymers made by polymerization or cyclization condensation of a fluorine-containing polymerizable monomer represented by the formula [1] wherein 'a' represents an integer from 1 to 4. The monomer contains a plurality of polymerizable amines in the molecule and at the same time one or more hexafluoroisopropyl group(s). With this structure it can be used as an effective polymerizable monomer, which can exhibit water repellency, oil repellency, low water absorptive property, heat resistance, weather resistance, corrosion resistance, transparency, photosensitivity, low refractive index property, low dielectric property, etc., and it can be used for advanced polymer material fields.

Fluorine-containing polymerizable monomer and polymer compound using same

The present invention relates to a fluorine-containing polymerizable monomer represented by the formula [1], [Chem. 31] wherein 'a' represents an integer of 1-4. This monomer has a plurality of polymerizable amines in the molecule and at the same time a hexafluoroisopropyl group(s). With this, it can be used as an effective polymerizable monomer, which can exhibit water repellency, oil repellency, low water absorptive property, heat resistance, weather resistance, corrosion resistance, transparency, photosensitivity, low refractive index property, low dielectric property, etc., and can be used for advanced polymer material fields.

The invention is related to an arylsulfonium salt compound having a polycyclic hydrocarbon structure in a cation moiety.

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Shizuoka, Japan

Hiroshi Saegusa