Canon Kabushiki Kaisha

Sony Corporation

Fujifilm Corporation

Hitachi Medical Corporation

Tessera Advanced Technologies, Inc.

Hiroshi Ozaki

Shinichi Nakamura

Satoshi Kuroyanagi

Hideki Adachi

Hisatsugu Tahara

Taisei Fukada

Mitsuharu Takizawa

Satoshi Kaneko

Satoru Wakiyama

Naoyuki Ohki

Tokuharu Kaneko

Masanori Miyata

Katsuo Ogura

Kazuhiro Mino

Osamu Fukushima

Hajime Fujii

Mitsuhiko Sato

Shusaku Yanagawa

Teruo Hirayama

Naoto Sasaki

Yukimasa Iseki

Kouichi Sugiyama

Hideyuki Suzuki

Kazuo Takahashi

Hidetoshi Kabasawa

Masanori Sakai

Hiroshi Morita

Takeshi Yanagita

Hiizu Ootorii

Shun Kayama

Kiyoshi Hasegawa

Shin Iwabuchi

Tomoharu Ogita

Shuichi Oka

Takayuki Ezaki

Osamu Koizumi

Shun Mitarai

Yuji Takaoka

Yuji Iwahashi

Eiji Otani

Masahiro Iwadate

Satoshi Mitani

Junichi Ohsako

Ryota Odake

Keishi Inaba

Kazunao Oniki

Takeshi Ogura

Kiyoshi Urayama

Shinji Rokuhara

Kiwamu Adachi

Yoshinobu Aiba

Kazuo Nishiyama

Seizo Seki

Motosuke Ohmi

Takashi Ota

Toshikazu Konno

Taizo Fukuda

Takayasu Hirano

Kazuki Sano

Koki Uchino

Shunji Amano

Miho Nakayama

Natsuya Ishikawa

Masaaki Indo

Seiji Nihei

Yukari Mori

A system includes an authentication server that executes authentication processing via one or more biometric authentication methods. The system detects, in response to a request for proxy work, authentication target data related to biometric information from data acquired at a location where the request for the proxy work is issued. The system executes additional authentication processing, by comparing feature data of biometric information corresponding to a proxy executor included in proxy setting and the detected authentication target data. The system manages a status of the proxy work to be executed in a case where the additional authentication processing is successful.

System and method

A semiconductor unit includes: a first device substrate including a first semiconductor substrate and a first wiring layer, in which the first wiring layer is provided on one surface side of the first semiconductor substrate; a second device substrate including a second semiconductor substrate and a second wiring layer, in which the second device substrate is bonded to the first device substrate, and the second wiring layer is provided on one surface side of the second semiconductor substrate; a through-electrode penetrating the first device substrate and a part or all of the second device substrate, and electrically connecting the first wiring layer and the second wiring layer to each other; and an insulating layer provided in opposition to the through-electrode, and penetrating one of the first semiconductor substrate and the second semiconductor substrate.

Semiconductor unit, method of manufacturing the semiconductor unit, solid-state image pickup unit, and electronic apparatus

A photoelectric module of the present disclosure includes an optical device including an optical function element array made of a first base material, and a plurality of light emitting/receiving elements made of a second base material, wherein the optical function element array includes an optical substrate and a plurality of optical function elements, the optical substrate having a first surface and a second surface, and the optical function elements being integrated with the optical substrate and being arranged one-dimensionally or two-dimensionally, and the light emitting/receiving elements and their respective optical function elements face each other with the optical substrate in between to be located on a same axis in a direction perpendicular to the optical substrate, and the light emitting/receiving elements are disposed on the second surface with a space in between while being separated in units of a smaller number than array number in the optical function element array.

Photoelectric module and optical device

There is provided a method for manufacturing a wiring substrate with a through electrode, the method including providing a device substrate having a through hole, an opening of the through hole being blocked by a current supply path and the wiring substrate including the device substrate as a core layer with the through electrode; and disposing a first metal in the through hole to form the through electrode by electroplating, in a depth direction of the through hole, using the current supply path.

Manufacturing method and wiring substrate with through electrode

Disclosed herein is a semiconductor device including: a first semiconductor chip having an electronic circuit section and a first connecting section formed on one surface thereof; a second semiconductor chip having a second connecting section formed on one surface thereof, the second semiconductor chip being mounted on the first semiconductor chip with the first and the second connecting sections connected to each other by a bump; a dam formed to fill a gap between the first and the second semiconductor chips on a part of an outer edge of the second semiconductor chip, the part of the outer edge being on a side of a region of formation of the electronic circuit section; and an underfill resin layer filled into the gap, protrusion of the resin layer from the outer edge of the second semiconductor chip to a side of the electronic circuit section being prevented by the dam.

Semiconductor device, method for manufacturing the same, and electronic device

Through electrode of a device substrate

In an information processing apparatus according to this invention, a plurality of pieces of batch setting information each configured by a plurality of pieces of print setting information are registered in advance. A setting of print setting information, use of which is inhibited, of the plurality of pieces of print setting information is accepted. Batch setting information including the print setting information, use of which is inhibited, is specified from the plurality of pieces of batch setting information. Then, a setting screen which allows the user to select pieces of non-specified batch setting information, and does not allow the user to select the specified batch setting information is displayed.

Information processing apparatus which controls print setting processing

A sensor device and an electronic apparatus by which downsizing and a reduction in costs can be achieved is provided. A sensor device according to an embodiment of the present technology includes a sensor element and a semiconductor element. The semiconductor element includes a first surface, a second surface, and a via-hole. The first surface includes a first terminal on which the sensor element is mounted and is an inactive surface. The second surface includes a second terminal for external connection and is an active surface. The via-hole electrically connects the first surface and the second surface to each other.

Sensor device and electronic apparatus

In a data providing server, whether or not specified compressed content data generated by means of a specified compression coding method corresponding to terminal identification information has been stored in a content database is detected, according to content specifying data transmitted from a portable dedicated terminal. If the specified compressed content data has been stored, the data providing server reads and transmits this to the portable dedicated terminal. And if the specified compressed content data has not been stored, the data providing server generates the specified compressed content data by means of the specified compression coding method, and transmits this to the portable dedicated terminal.

Method for providing and obtaining content

A content providing apparatus previously receives customer identification information and content identification information as customer reservation information via a terminal device, and sends customer desired content data corresponding to the content identification information to a content obtaining apparatus, to provide a customer with the customer desired content data via the content obtaining apparatus more easily, thus making it possible to significantly improve the usability of a content obtaining/providing system. In addition, a content providing server sends three-dimensional images to a portable dedicated terminal in response to a preview request sent from the portable dedicated terminal, and then sends commercial data corresponding to a preview request sent according to the display state of the three-dimensional images to reproduce it, to make the customer view and preview the content to allow the customer to accurately judge whether the content meets his/her taste, thus making it possible to select content data lightheartedly.

Content providing/obtaining system

A solid-state imaging device includes a substrate in which a plurality of pixels including photoelectric converters are formed, a wiring layer that includes wirings in a plurality of layers formed via an interlayer insulating film in a front surface side of the substrate, a base electrode pad portion that includes a portion of the wirings formed in the wiring layer, an opening that penetrates the substrate from a rear surface side of the substrate and reaches the base electrode pad portion, and an embedded electrode pad layer that is formed so as to be embedded in the opening by electroless plating.

Methods of forming integrated circuits

A semiconductor apparatus, including: a semiconductor component; a Cu stud bump that is formed on the semiconductor component; and a solder bump configured to electrically connect to the Cu stud bump.

Semiconductor apparatus, method of manufacturing semiconductor apparatus, and electronic apparatus

Growing community of inventors

Kanagawa, Japan

Hiroshi Ozaki