Hitachi Automotive Systems, Ltd.

Hitachi, Ltd.

Hitachi, Ltd. & Hitachi Car Engineering Co.

Hiroshi Onuki

Daisuke Terada

Shigenobu Komatsu

Junji Onozuka

Takuya Aoyagi

Atsushi Kazama

Katsuaki Fukatsu

Takeo Hosokawa

Tomonari Misawa

Ryo Ando

Masayuki Hio

Mizuki Shibata

Yoshiyuki Akiyama

Miho Tobita

Hiroshi Nakano

Noboru Tokuyasu

Noboru Sugiura

Ryoichi Kobayashi

Takashi Ito

Jun Kubo

Tatsuya Miyake

Takashi Naitou

Hanae Shimokawa

Hiroyuki Ota

Ryota Yamasaki

Kaori Kashio

Kentarou Miyajima

Jiro Hashizume

Kenji Nakabayashi

Katsuhiko Kikuchi

Atsuo Soma

Takatoshi Yamamoto

Yusuke Kaga

Kousaku Morita

Kazuya Ishihara

Toshiki Otsuki

Shosaku Ishihara

A pressure sensor which detects a combustion pressure of an engine includes: a contact part which is in direct or indirect contact with a casing of the engine when the pressure sensor is attached to the engine; and a pressure detection unit which detects the combustion pressure and outputs a signal corresponding to the combustion pressure, wherein the pressure detection unit includes a pressure detection element which detects the combustion pressure and outputs a signal, and a circuit unit which converts the signal obtained from the pressure detection element into a signal corresponding to the combustion pressure, and the pressure detection unit is provided at a location positioned more inside the engine than the contact part when the pressure sensor is attached to the engine.

Pressure sensor

A noise resistance of a pressure sensor is improved while avoiding a hetero metal bonding. A pressure detection device includes a metal case having the diaphragm which is deformed due to a pressure received from a pressure medium, a sensor element which detects a pressure by detecting the deformation of the diaphragm, a lead frame which is electrically connected to the sensor element, and a connection member which holds the lead frame. A first surface of the lead frame, that is, the surface on a side near the metal case in the parallel plate region, and a second surface of the metal case, that is, the upper surface of the base member interpose at least one of the resin of the connection member being an insulator and the insulating adhesive and are disposed to face each other with a predetermined gap therebetween.

Pressure detection device with noise resistant pressure sensor

According to the conventional knowledge, a thermal humidity measurement device has problems in which the direction of air flow is limited to one direction is too hard to handle in securing the humidity responsiveness because there are limitations on the mounting direction of the thermal humidity measurement device and the state of air flow. An introduction guide protrudes from an air introduction surface to the outside of a measurement chamber, is parallel to a humidity introduction port surface, and has a portion not in contact with an inlet surface of a humidity introduction tube as seen from any direction to guide the flow of air to the humidity introduction tube from any direction of 360&#xb0;.

Humidity measurement device

A thermal humidity measuring device includes first and second heating elements, and is capable of obtaining a plurality of measurement values (measured values) by effectively utilizing each of the heating elements, which includes measuring humidity by the first heating element. A thermal humidity measuring device includes a first bridge circuit that includes a first heating element that senses humidity, and a second bridge circuit that includes a second heating element that heats air around the first heating element. In the thermal humidity measuring device, a first output signal is extracted from the first bridge circuit, and the humidity is sensed. A second output signal is extracted from the second bridge circuit, and the second output signal includes information relating to at least any one of pressure, an air flow rate, and air temperature.

Thermal humidity measuring device

Provided is a physical quantity measurement device in which a bonding temperature of a bonding layer is lowered to a temperature not affecting an operation of a semiconductor chip and an insulating property of the semiconductor chip and a base is secured. The physical quantity measurement device includes a base (diaphragm), a semiconductor chip (strain detection element) to measure a physical quantity on the basis of stress acting on the base, and a bonding layer to bond the semiconductor chip to the base. The bonding layer has a first bonding layer bonded to the semiconductor chip, a second bonding layer bonded to the base, and an insulating base material disposed between the first bonding layer and the second bonding layer. The first and second bonding layers and contain glass. A thermal expansion coefficient of the first bonding layer is equal to or lower than a thermal expansion coefficient of the second bonding layer, a softening point of the second bonding layer is equal to or lower than a heat resistant temperature of the semiconductor chip, and a softening point of the first bonding layer is equal to or lower than the softening point of the second bonding layer.

Physical quantity measurement device, method for manufacturing same, and physical quantity measurement element

A pressure sensor includes a connection portion provided with a screw portion configured to fix the pressure sensor to a combustion chamber of a vehicle engine; a hollow liquid-enclosing container fixed to one end of the connection portion; a pressure transmission fluid enclosed inside the liquid-enclosing container; a diaphragm fixed to one end of the liquid-enclosing container and elastically deformed when receiving pressure to transmit the pressure to the pressure transmission fluid; a pressure detection element fixed to the other end of the liquid-enclosing container and detecting the pressure transmitted to the pressure transmission fluid and converts the detected pressure into an electric signal; and a heat-dissipating rod provided inside the liquid-enclosing container. The connection portion and the liquid-enclosing container, and the connection portion and the diaphragm are mechanically connected to each other by welding or the like.

The purpose of the present invention is to provide a semiconductor device that is small and has diagnosability, and that can quickly recover from power source malfunctions. Provided is a semiconductor device that includes: a control signal generation circuit that generates control signals which differ according to the fluctuation time of power-source voltage; and a control circuit that changes an operation sequence according to the differences in the control signals.

Semiconductor device

A semiconductor device includes a metal body; a bonding layer placed on the metal body; and a semiconductor chip placed on the bonding layer. The bonding layer includes a filler-containing first layer formed between the metal body and the semiconductor chip and a second layer bonded to the first layer and the semiconductor chip. The second layer has a thermal expansion coefficient higher than that of the first layer.

Semiconductor device, mechanical quantity measuring device, and semiconductor device fabricating method

In a pressure sensor having a configuration in which strain gauges are provided on a diaphragm, a change in sensor characteristic caused by a positional shift of the strain gauges is suppressed, and a change in sensor output in response to a change in temperature is suppressed. The pressure sensor is a pressure sensor obtained by arranging, on a diaphragm having a long side and a short side, a sensor chip in which four strain gauges having the same characteristic and constituting a bridge circuit are provided, the pressure sensor being for detecting, in the bridge circuit, voltage output that is in proportion to a pressure applied to the diaphragm, and the pressure sensor is configured as follows: the four strain gauges are arranged to be adjacent to one another in the vicinity of the center of the diaphragm so that two strain gauges are arranged along the short side and the other two strain gauges are arranged along the long side; and the diaphragm has a thin portion in a long-side direction seen from the sensor chip.

An object of the present invention is to realize a pressure sensor with a small variation in sensor characteristics. The pressure sensor includes a diaphragm having longitudinal and lateral sides, and four strain gauges disposed on the diaphragm. The four strain gauges are arranged at a center of the diaphragm. Two of the four strain gauges are arranged along a lateral direction, and other two strain gauges are arranged along a longitudinal direction.

Pressure sensor having strain gauges disposed on a diaphragm

After the periphery of the magnetic sensitive element is surrounded by an elastic member, the magnetic sensitive element is mold-formed with resin material. Soft epoxy or gel resin is employed as the elastic member, poured in an element-mounting space and solidified. The magnetic sensitive element is surrounded by silicone rubber. Such construction allows the magnetic sensitive element not to be affected by vibration and allows the elastic member to absorb the stress which is created due to the thermal deformation of the molded resin.

Noncontact rotation angle sensor, manufacturing method for the same, and throttle valve control device for internal combustion engine having the same

A thermal gas-flow measuring instrument has a first heating resistor placed in the gas to be measured. A temperature sensing resistor is positioned upstream or downstream of the first heating resistor and generates signals relating to the flow rate. Between the first heating resistor and the support for supporting the first heating resistor is a second heating resistor that is electrically insulated from the first heating resistor. The second heating resistor suppresses the heat being transferred from the first heating resistor to the support. A control circuit controls the temperatures of the first heating resistor and the second heating resistor so that the operational temperature range of the second heating resistor or the temperature range at the joint section between the first heating resistor and the second heating resistor is at or above the temperature at which water droplets evaporate to disappear by film boiling.

Thermal type flow meter including a secondary heating device to suppress heat transfer

According to the invention, a primary winding of an ignition coil is coupled with an insulated-gate bipolar transistor (IGBT). The IGBT is controlled by a current restriction circuit, which includes a control transistor for performing the on-off operation of the IGBT such that the IGBT is made conductive upon occurrence of an ignition control signal, and nonconductive, when a primary current of the ignition coil reaches a certain value depending on a reference voltage determined by a bias circuit. The bias circuit has a condenser, which is charged by a base current of the control transistor to change the base potential of the transistor slowly, when the transistor is made nonconductive.

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Hitachinaka, Japan

Hiroshi Onuki