Sanwa Chemical Industry Co., Ltd.

Hiroshi Ono

Katuyoshi Saitoh

Yoshimichi Masuda

Takeo Saiki

Haruo Yagami

A polyamide binder for use in injection molding a metal powder comprising in combination: (a) 40 to 50 wt % of a polyamide resin component having an average molecular weight of not less than 20,000 and prepared by co-polycondensation of a mixture of dimer acid, azelaic acid, ethylenediamine and xylylenediamine each being mixed in a substantially equal molecular equivalent ratio; (b) 20 to 30 wt % of ethylene-bis-laurylamide; and (c) the balance of N,N-diacetylpiperazine.

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Isehara, Japan

Hiroshi Ono