Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Matsushita Electric Industrial Co., Ltd.

Goyo Paper Working Co., Ltd.

Hiroshi Okamura

Yoshihiko Misawa

Toshio Yano

Ken Takahashi

Yoshinori Isobata

Akira Iizuka

Masuo Masui

Eigo Sarashina

Takeshi Yoshida

Masanori Ikeda

Michinori Tomomatsu

Tadashi Endo

Masahiro Taniguchi

Hiroyuki Fujiwara

Toshihiko Nagaya

Yasuyuki Ishitani

Syozo Kadota

Yoshiyuki Hattori

Satoshi Nonaka

Hiroshi Kawahara

Makoto Nakashima

Mami Kikuchi

Yousuke Hassaku

Hiroki Yukawa

Tomoo Hama

Kazuki Takatori

Shimpei Sugino

Hitoshi Nakamura

Yukinobu Yamazaki

Michinori Nakamoto

A manufacturing-job apparatus includes a control module, a holding module, and a job module. The holding module is configured to hold a job object. The job module is configured to execute a job for the job object. The control module includes a communication unit and a common interface. The communication unit is configured to communicate with each of the holding module and the job module. The common interface is configured to supply motive power to both of the holding module and the job module.

Modular component mounting apparatus and method

A component mounting apparatus includes a carriage that holds a part feeder for supplying a component in a state of being attached to a base and attaches the part feeder to the base in a state of being coupled to the base; a mounting head that mounts the component to a substrate after the component is taken out of the part feeder held by the carriage coupled to the base through an opening formed between the base and a cover member formed so as to cover an upward side of the base; and a shutter moved from an opened position in which the opening is opened to a closed position in which the opening is closed when the carriage is separated from the base.

Component mounting apparatus

An adhering amount detecting process includes: lowering the nozzle to a trial application position; performing a trial application to apply the viscous material to a trial application surface disposed on an application stage; and detecting an amount of the viscous material adhering to the nozzle. Then, whether a difference between maximum and minimum values of the amounts of the viscous material adhering to the nozzle detected by performing the adhering amount detecting process a plurality of times exceeds a threshold is determined. If the difference is determined as not exceeding the threshold, the lowered position of the nozzle with respect to the application target is set such that a gap between the nozzle at the lowered position and an application surface of an application target coincides with a gap between the nozzle at the trial application position and the trial application surface.

Method and apparatus for applying viscous material

A method of determining a solder paste height of solder paste printed on a circuit board, the method including obtaining a two-dimensional image of the circuit board which is captured from above a solder printed surface, and determining the solder paste height corresponding to a pixel value of each of pixels of the two-dimensional image, based on height information which defines a relationship between the pixel value and the solder paste height, the pixel value being a value representing at least one of luminance of red in a RGB color model, luminance of green in the RGB color model, luminance of blue in the RGB color model, hue in a HSI color model, saturation in the HSI color model, and intensity in the HSI color model.

Method of determining solder paste height and device for determining solder paste height

A service providing method for monitoring a mounting tact of a component mounting apparatus includes collecting, from the service receiver, mounting tact information including a mounting tact result value of the component mounting apparatus from the service receiver by use of a service provider via a communication system. The method additionally includes judging whether a mounting operation of the component mounting apparatus has a tact loss corresponding to an amount by which a mounting tact is greater than a standard mounting tact as a result of analysis of the collected mounting tact information and determining and feeding back, to the service receiver via the communication system, NC data for allowing the component mounting apparatus to be operated.

Component mounting apparatus, service providing device and servicing method

A service receiving method for receiving a component library generated from mounted component data, including component size and mounting conditions, via a communication system that includes the Internet. The method includes the service provider receiving mounted component data having mounting conditions actually realized by a fabrication of non-defective products. The method also includes the service provider deriving a component library from a mounted component database.

A service receiving method for receiving a component library including component size necessary for mount production, by inputting, via a service receiver, to a service provider, mounted component data having the results of fabrication of non-defective products, through the communication system that includes the Internet and deriving, by the service receiver, the component library from a mounted component database provided in the service provider, the mounted component database containing the input mounted component data accumulated for each type of component.

A method for monitoring a mounting tact of a component mounting apparatus including a component supplier for supplying a component and a component holder for holding the component from the component supplying device and mounting the component onto a circuit board. The method includes collecting and monitoring a mounting tact result value of the component mounting apparatus during a mounting operation via a communication system. The method further includes calculating a tact loss corresponding to an amount by which the mounting tact result value is greater than a standard mounting tact and monitoring the calculated tact loss.

A service receiving device is provided for in a production facility such as a component mounting apparatus. A service providing device is provided for on a manufacturer's side of the production facility. The service receiving device and service providing device are configured to communicate with each other through various communication systems including, for example, the Internet. The communication system can be operated by software to create and/or transmit service responses to problems or production matters, including productivity or quality of maintenance.

Component mounter, service supplier, and service supplying method

Disclosed is a resin composition for water-resistant and moisture-proof paper comprising 40 to 75 parts by weight of a polyolefin (A), 25 to 60 parts by weight of a tackifier (B) and 0 to 20 parts by weight of a compatibilizing agent (C), the total of (A), (B) and (C) being 100 parts by weight, and further blending 20 to 300 parts by weight of an inorganic filler (D) to 100 parts by weight of the sum of (A), (B) and (C). According to the present invention, the water-resistant and moisture-proof paper is provided at low cost which is disaggregated with ease by a pulper and recycled as paper materials.

Resin composition, water-resistant/moisture-proof paper, containing the same, and process for producing the same

Growing community of inventors

Kyoto, Japan

Hiroshi Okamura