Panasonic Corporation

Hiroshi Ohkawa

Susumu Akamatsu

Yoshiya Moriyama

Kenji Yoneda

Hisashi Ogawa

Junji Hirase

Hiromasa Fujimoto

Satoru Ito

Satoru Itou

A first MIS transistor and a second MIS transistor of the same conductivity type are formed on an identical semiconductor substrate. An interface layer included in a gate insulating film of the first MIS transistor has a thickness larger than that of an interface layer included in a gate insulating film of the second MIS transistor.

Semiconductor device

A semiconductor device includes a first-conductivity-type first MIS transistor and a second-conductivity-type second MIS transistor. The first and second MIS transistors include a first and a second gate insulating film formed on a first and a second active region surrounded by a separation region of a semiconductor substrate, and a first and a second gate electrode formed on the first and second gate insulating films. The first and second gate insulating films are separated from each other on a first separation region of the separation region. A distance s between first ends of the first and second active regions facing each other with the first separation region being interposed therebetween, and a protrusion amount dfrom the first end of the first active region to a first end of the first gate insulating film located on the first separation region establish a relationship d1&#x3c;0.5s.

A semiconductor device includes an N-type MOS transistor and a P-type MOS transistor. The N-type MOS transistor has a first gate insulating film and a first gate electrode. The P-type MOS transistor has a second gate insulating film and a second gate electrode. The first gate insulating film and the second gate insulating film are made of silicon oxynitride, and the first gate insulating film and the second gate insulating film are different from each other in nitrogen concentration profile.

Semiconductor device and method for fabricating the same

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Toyama, Japan

Hiroshi Ohkawa