Seiko Epson Corporation

Hiroshi Ohara

Yoichi Momose

Hiroshi Wada

Chiyoaki Iijima

Hiroshi Watanabe

Kunio Wanikawa

A method of manufacturing a semiconductor device, including: providing a semiconductor substrate which has a plurality of electrodes and in which a depression is formed on a side on which the electrodes are formed; forming a resin protrusion on the semiconductor substrate so that part of the resin protrusion is positioned in the depression; and forming an interconnect on the resin protrusion, the interconnect being electrically connected to at least one of the electrodes.

Semiconductor device and method of manufacturing the same

An electroless plating apparatus includes: a storage tank for an electroless plating solution; a blocking member which blocks the electroless plating solution from flowing from a treatment side of a semiconductor wafer installed to the storage tank toward an opposite side to the treatment side, the treatment side being a side facing the electroless plating solution; and a solution supplier which causes the electroless plating solution to flow so that the electroless plating solution comes in contact with the treatment side of the semiconductor wafer.

Electroless plating apparatus, semiconductor wafer having bumps, semiconductor chip having bumps, methods of manufacturing the semiconductor wafer and the semiconductor chip, semiconductor device, circuit board, and electronic equipment

An integrated circuit is electrically connected with a plurality of pads. A passivation film covers a part of each of the pads and exposes the other part of each of the pads. Bumps are formed on the pads, respectively. Each of the bumps is a single layer disposed on a part of each of the pads exposed from the passivation film, and on the passivation film.

Semiconductor chip and wiring board with bumps formed on pads/land and on passivation/insulation film and manufacturing method of the same

A semiconductor wafer includes a plurality of monolithic integrated circuits formed in a semiconductor crystal for realizing a function of a plurality of semiconductor chips; a plurality of pads formed in a plurality of first regions to be the plurality of semiconductor chips; and a conductor formed in a layer lower than the pads through a second region, which is located between two of the first regions, and electrically connecting at least two of the pads.

SEMICONDUCTOR WAFER, METHOD OF MANUFACTURING SEMICONDUCTOR WAFER HAVING BUMPS, SEMICONDUCTOR CHIP HAVING BUMPS AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE, CIRCUIT BOARD, AND ELECTRONIC EQUIPMENT

An electro-optical apparatus having a color filter, and in particular, such an electro-optical apparatus having a high information content, includes a metal layer which serves as both a light shielding layer and as an electrical conductor so that the escape of light between display elements is prevented to improve contrast and also so that the wiring resistance is reduced to reduce rounding of an applied waveform to thereby prevent cross-talk, the apparatus thus being constructed to readily achieve high-image quality. A color filter is disposed on at least one of a pair of transparent substrates which hold therebetween a liquid crystal layer in cooperation with a sealing member. Transparent display electrodes are disposed above the color filter, with a smoothing layer interposed between the electrodes and the color filter. A light shielding layer formed from, e.g., a metal layer formed in a stripe-shaped patter between adjacent columns of color filter elements of the color filter, serves as an electrical conductor and is electrically connected with the transparent display-electrodes via through-holes formed in the color filter and the smoothing layer.

Electro-optical apparatus with metal light shield and conductor between

A structure provides for encapsulating a color filter in a planarized protective coating, forming a transparent electrode on the planar surface of the protective coating and forming an orientation film over the transparent electrode wherein the orientation film extends beyond the boundary defined by the seal between the two substrates of a liquid crystal device. The seal itself can be attached at one of its ends to the orientation film, or it can be attached at one of its ends to a portion of the transparent electrode such that that end is surrounded by the abutting orientation film. In both of the seal attachment schemes the other end of the seal is attached directly to one of the substrates. Typically the substrates are glass substrates.

Color filter structure for liquid crystal displays with seal end on or

An electro-optical device which includes a super twisted nematic liquid crystal display cell and a compensating cell disposed between a pair of polarizers. Each of these cells is characterized by a plurality of parameters including refractive index dispersion, refractive index anisotropy, layer thickness and twist angle. At least one of the parameters characterizing the liquid crystal display cell differs in value from the corresponding parameter characterizing the compensating cell.

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Shiojiri, Japan

Hiroshi Ohara