Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Fujitsu Corporation

Hiroshi Ogura

Tohru Yamaoka

Yuichi Miyoshi

Hiroyuki Naka

Yusuke Takeuchi

Naoko Matsuda

Yuji Nomura

Kazuaki Takahashi

Suguru Fujita

Masayoshi Miura

Yoshikazu Yoshida

Shinya Kimura

Hiroyoshi Yajima

Motohiko Fujimura

Osamu Hirota

Takato Ohashi

Kiyohide Yamashita

Keinosuke Kanashima

Yuji Nagano

Tomoyuki Sasaki

Futoshi Takeshi

Eiji Nishimura

Kazumoto Doi

Kanna Okamura

Kazuyoshi Nagai

Yuji Hashidate

Katsuhiro Makihata

Toshihiko Bessho

Shigeru Nakabayashi

Manabu Egawa

Yoshinobu Yasuno

Motoaki Kamihara

A power conversion device includes first and second components and pairs of engagement members each including male and female engagement members. The male engagement member includes an insertion part having a substantially flat plate shape. The female engagement member includes first and second clamping parts arranged to be opposed to each other. In each of the pairs of engagement members, the male and female engagement members are respectively arranged on one and another of the first and second components. The first and second components are coupled when the female engagement member clamps the insertion part inserted between the first and second clamping parts in each of the pairs of engagement members. Each of the first and second clamping parts is bent to form a projecting portion toward an opposed surface. A gap is provided at a distal end of each of the first and second clamping parts.

Power conversion device and component interconnection structure

A microphone structure has a diaphragm; a frame of which an inside is processed in a shape of a semispherical surface, a parabolic surface, or a conical surface; an acoustic transducer that converts sound pressure into an electric signal; and a wire that transmits the electric signal from the acoustic transducer to outside. A sound pressure input surface of the acoustic transducer is disposed on a bottom surface portion of the semispherical surface, the parabolic surface, or the conical surface inside the frame. The diaphragm and the frame, and the frame and the wire include waterproof mechanisms preventing ingress of water.

Microphone

An electret condenser includes a fixed filmincluding a conductive filmto be an upper electrode, a vibrating filmincluding a lower electrodeand a silicon oxide filmto be an electret film, and a silicon oxide filmprovided between the fixed filmand the vibrating filmand including an air gapRespective parts of the fixed filmand the vibrating filmexposed in the air gapare formed of silicon nitride filmsand

Electret condenser

An electret condenser microphone includes: a substratein which an openingis formed; an electret condenserconnected to one face of the substrateso as to close the openingand having an acoustic holeand a cavity; a drive circuit elementconnected to the one face of the substrate; and a casemounted over the substrateso as to cover the electret condenserand the drive circuit element. Electric contact is established at a joint part between the electret condenserand the substrate. The acoustic holecommunicates with an external space through the opening. The cavityand an internal region of the caseserve as a back air chamber for the electret condenser

Electret condenser microphone

A diaphragm structure for a MEMS device includes a through-hole formed so as to penetrate from an upper surface to a bottom surface of a substrate; and a vibrating electrode film formed on the upper surface of the substrate so as to cover the through-hole. An opening shape of the through-hole in the upper surface of the substrate is substantially hexagonal.

Diaphragm structure and MEMS device

While a dielectric film is set to have a ground potential, a fixed electrode is set to have a different potential from the ground potential. Thereafter, ions produced by corona discharge are allowed to pass through a plurality of acoustic holes formed in the fixed electrode and reach the dielectric film, thereby electretizing the dielectric film.

Electretization method and apparatus

An electric condenser includes a fixed filmincluding a conductive filmto be an upper electrode, a vibrating filmincluding a lower electrodeand a silicon oxide filmto be an electric film, and a silicon oxide filmprovided between the fixed filmand the vibrating filmand including an air gap. Respective parts of the fixed filmand the vibrating filmexposed in the air gapare formed of silicon nitride filmsand

An electret condenserincludes a fixed electrode, a vibrating electrode, an electretized silicon dioxide filmformed between the electrodes, and silicon nitride filmsandformed so as to cover the silicon dioxide film. The silicon dioxide filmcovered with the silicon nitride filmsandis formed on the vibrating electrode

A silicon nitride film () and a silicon nitride film () are formed to cover a charged silicon oxide film () serving as an electret.

Electret covered with an insulated film and an electret condenser having the electret

The outer face of a case which accommodates a whole microphone is coated by a material having a heat conductivity which is lower than that of a metal, and a material transforming temperature which is higher than the charge dissipating temperature of a dielectric layer for forming an internal electret, and which is higher than 260&#xb0; C., so that the internal temperature rise can be mitigated by the thermal resistance and the thermal capacity of the whole interior. When a microphone is attached to an application equipment, particularly, the microphone may be passed through a reflow solder bath for a short time period. A heat-resistant structure which can prevent the function from being impaired by a high temperature in the period is provided.

Heat-resistant electret condenser microphone

An electret condenser microphone includes: a substratein which an openingis formed; an electret condenserconnected to one face of the substrateso as to close the openingand having an acoustic holeand a cavitya drive circuit elementconnected to the one face of the substrateand a casemounted over the substrateso as to cover the electret condenserand the drive circuit elementElectric contact is established at a joint part between the electret condenserand the substrateThe acoustic holecommunicates with an external space through the openingThe cavityand an internal region of the caseserve as a back air chamber for the electret condenser

A traffic management system manages, distributes, and controls various traveling states of vehicles at a high quality level. A vehicle-mounted unit performs an interconnection process for user authentication when entering a predetermined radio-wave zone. A radio unit disposed on a road sends interconnection process completion information to a center device when the interconnection process for connection to the vehicle is completed. If the vehicle does not connect to the radio unit after elapsed of a predicted time at which the vehicle is expected to travel across the radio unit, then the radio unit sends an overtime to the center device. The interconnection process completion information is received, the center device calculates a predicted time at which the vehicle is expected to pass across a radio unit, and sends the predicted time to the radio unit. When the overtime is received, the center device determines whether a fault has occurred or not. When it is judged that the fault has occurred, the center device sends alarm information to vehicles traveling near a site where the fault has occurred on the vehicle.

Traffic management system

Capacitor microphone

A rectangular penetration hole is formed opening in the opposite two main surfaces of a first dielectric substrate. Conductors for grounding are respectively formed on the main surfaces, to cover the openings of the penetration hole. A conductor layer is formed on opposite inner walls in the penetration hole of the dielectric substrate. A waveguide is structured by a space surrounded by the conductors and the conductor layers. The waveguide is magnetically coupled with an input/output line on a second dielectric substrate through a coupling slot. Because a waveguide has walls made continuous in the dielectric substrate, a low-loss waveguide can be realized. Hence, a high-performance radio frequency module can be realized.

Radio frequency module and method for manufacturing the same

A method of machining a glass substrate by using a laser, in which a low-permittivity, low-dielectric-loss glass substrate capable of coping with mass production processes is made applicable as the substrate of a high-frequency circuit intended for microwave and millimeter-wave bands in particular. For that purpose, a glass substrate is provided in which the amount of air bubbles in glass is arbitrarily controlled to improve the workability of the substrate itself. Then, the glass substrate is machined while being irradiated with a pulsed laser for a plurality of times, thereby improving the machining shape of the glass substrate. Since glass substrates which are typically difficult to machine can be easily applied to the fabrication of high-frequency circuits, it becomes possible to supply high-performance circuits and apparatuses widely to the public.

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Tokyo, Japan

Hiroshi Ogura