Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Hiroshi Ogata

Tadashi Endo

Tomohiro Kimura

Osamu Okuda

Takeyuki Kawase

Takaaki Yokoi

Akira Noudo

It is intended to provide an electronic component mounting device and an operation performing method for mounting electronic components so that both the operation quality and the productivity can be improved. In operation performing procedures, when an electronic component belongs to the first division, an operating head is made to move up and down based on an approximate operation position height derived from an approximate curved surface of the top surface of a board which is calculated by using the height measurement result obtained by measuring a plurality of height measuring points on the surface of the board, and when the electronic component belongs to the second division, the operating head is made to move up and down based on an individual operation position height obtained by individually measuring the board height at the operation position.

Electronic component mounting device and an operation performing method for mounting electronic components

A method by which the height of an electronic component sucked and held by a nozzle can be detected with high accuracy and high efficiency is a component height measurement method applied to a mounter () equipped with a transfer head () having a component-sucking-and-holding nozzle (), for transferring a component P and mounting the component P onto a board (), and includes: lowering the component P to within the high-accuracy range of a first line sensor () for measuring the height of the component P; and measuring the height of the component P using the first line sensor ().

Electronic component mounter and mounting method

Growing community of inventors

Yamanashi, Japan

Hiroshi Ogata