Nitto-denko Corporation

Nec Corporation

Hiroshi Noro

Yukiko Higo

Hisataka Ito

Eiji Toyoda

Masaki Mizutani

Satoshi Ito

Mitsuaki Fusumada

Makoto Kuwamura

Masahiro Kubo

Masayuki Yamamoto

Yasunari Ooyabu

Naohide Takamoto

Hiroyuki Katayama

Koji Matsui

Takashi Taniguchi

Kazuhiro Fuke

Sakae Kitajo

Kazumasa Igarashi

Ichiro Hazeyama

Yuki Ebe

Koji Akazawa

Takahiro Uchida

Yasuhiko Yamamoto

Takashi Fukushima

Shinichiro Sudo

Akiko Nakahashi

A phosphor encapsulating sheet, for encapsulating a light emitting diode element, includes a phosphor layer, an encapsulating layer formed at one side in a thickness direction of the phosphor layer, and an adhesive layer formed at the other side in the thickness direction of the phosphor layer for being adhered to a cover layer.

Phosphor encapsulating sheet, light emitting diode device, and producing method thereof

A method for producing an encapsulating layer-covered optical semiconductor element includes a disposing step of disposing an encapsulating layer at one side in a thickness direction of a support and a covering step of, after the disposing step, covering an optical semiconductor element with the encapsulating layer so as to expose one surface thereof to obtain an encapsulating layer-covered optical semiconductor element.

Encapsulating layer-covered optical semiconductor element, producing method thereof, and optical semiconductor device

The present invention relates to an epoxy resin composition for an optical semiconductor device, including the following ingredients (A) to (E): (A) an epoxy resin; (B) an acid anhydride curing agent; (C) a curing accelerator; (D) a specific silicone resin; and (E) a specific alcohol compound.

Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same

The present invention relates to a photocurable resin composition including the following ingredients (A), (B) and (C): (A) a linear chain epoxy resin represented by the following general formula (1), in which m indicates an integer of from 2 to 10, and Rand Reach represent a hydrogen atom or a fluorine atom; (B) an alicyclic epoxy resin having at least two epoxy groups in one molecule thereof; and (C) a phosphorus fluoride-based photopolymerization initiator. 

Photocurable resin composition and optical component using the same

A thermosetting encapsulation adhesive sheet which is used for encapsulating a chip type device () having connection electrodes (bumps) () and mounted on a wiring circuit board (). The thermosetting encapsulation adhesive sheet is composed of an epoxy resin composition having a viscosity of 5&#xd7;10to 5&#xd7;10Pa&#xb7;s as measured at a temperature of 80 to 120&#xb0; C. before thermosetting thereof. The thermosetting encapsulation adhesive sheet makes it possible to conveniently encapsulate a hollow device with an improved yield.

Thermosetting encapsulation adhesive sheet

A light-curing resin composition includes an epoxy resin having two or more epoxy groups in one molecule; a photopolymerization initiator including an anion component and a cation component; and an aralkyl compound having an alcoholic hydroxyl group.

Light-curing resin composition and optical material

The present invention relates to a photocurable resin composition including an epoxy resin, an oxetane compound and a photopolymerization initiator, in which the epoxy resin includes the following ingredient (A), and the oxetane compound includes the following ingredient (B), and the ingredient (A) is contained in an amount of from 60 to 95% by weight and the ingredient (B) is contained in an amount of from 5 to 40% by weight relative to 100% by weight of a total resin amount in the resin composition: (A) an epoxy resin having at least two epoxy groups in one molecule thereof and being liquid at room temperature; and (B) an oxetane compound represented by the following general formula (I) in which n is an integer of from 1 to 6. 

The present invention relates to a photocurable resin composition including an epoxy resin, an oxetane compound and a photopolymerization initiator, in which the epoxy resin includes the following ingredients (A) and (B) in combination, and the oxetane compound includes the following ingredient (C): (A) an epoxy resin having at least two epoxy groups in one molecule thereof and being liquid at 60&#xb0; C. or higher; (B) a solid epoxy resin having at least two epoxy groups in one molecule thereof and having a refractive index of 1.6 or more by itself; and (C) an oxetane compound represented by the following general formula (1) in which n is an integer of 1 to 6. 

The present invention relates to a resin composition for optical semiconductor devices, the resin composition including the following ingredients (A) to (D): (A) an epoxy resin; (B) a curing agent; (C) a polyorganosiloxane; and (D) a white pigment.

Resin composition for optical semiconductor device, optical-semiconductor-device lead frame obtained using the same, and optical semiconductor device

The present invention relates to a resin composition for optical components, which is an ultraviolet-curable transparent resin composition used as a material for an optical component, in which the resin composition includes (A) an epoxy resin having two or more epoxy groups in one molecule thereof, (B) an oxetane compound having one or more oxetanyl groups in one molecule thereof and (C) a photo-acid generator, and in which the component (C) is contained in an amount of 0.01 to 2.0 parts by weight based on 100 parts by weight of a total amount of the components (A) and (B). The present invention also relates to an optical component obtained by using the resin composition for optical components, and a production method thereof.

Resin composition for optical components, optical component using the same and production method of optical lens

An epoxy resin composition for semiconductor encapsulation, which comprises: (A) an epoxy resin having at least two epoxy groups in a molecule thereof; (B) a compound having at least two phenolic hydroxyl groups in a molecule thereof; and (C) particles of a compound represented by general formula (1), the particles having a maximum particle diameter of not greater than 30 &#x3bc;m and a standard deviation of not greater than 5 &#x3bc;m, the particles being dispersed in the epoxy resin composition: wherein Xto X, which may be the same or different, are each a hydrogen atom, an alkyl group having 1 to 9 carbon atoms, or a fluorine atom. The epoxy resin composition is an encapsulation material excellent in pot life, fluidity and curability, and has a lower chloride ion content. The epoxy resin composition provides a highly reliable semiconductor device excellent in moisture resistant reliability.

Epoxy resin composition for semiconductor encapsulation and semiconductor device produced by using the same

The present invention relates to an epoxy resin composition for photosemiconductor element encapsulation, the epoxy resin composition including the following components (A) to (D): (A) an epoxy resin having two or more epoxy groups in one molecule thereof, (B) an acid anhydride curing agent, (C) a curing accelerator, and (D) an alcohol compound having three or more primary hydroxyl groups in one molecule thereof.

Epoxy resin composition for photosemiconductor element encapsulation and cured product thereof, and photosemiconductor device using the same

A laminated sheet for adhering to a circuit side of a projected electrode-mounting wafer in a step of grinding a backside of the wafer, wherein the laminated sheet comprises at least a layer (layer A) contacting with the circuit side, made of a thermosetting resin, a layer (layer B) directly laminated on the layer A, made of a thermoplastic resin having a tensile modulus of from 1 to 300 MPa at 40&#xb0; to 80&#xb0; C., and an outermost layer (layer C) made of a thermoplastic resin which is non-plastic at a temperature of at least 25&#xb0; C.; A method for manufacturing a semiconductor device, comprising the steps of grinding a backside of a projected electrode-mounting wafer wherein the laminated sheet is adhered to a circuit side of the wafer, removing other layers besides the layer A of the laminated sheet, and cutting the wafer into individual chips; and a semiconductor device obtainable by the method.

Laminated sheet

An object of the present invention is to provide an electronic part device which can be repaired even in the case of an electronic part device having a malfunction in electrical connection after carrying out underfill. The present invention is an electronic part device in which a semiconductor element (flip chip) () is mounted on a wiring circuit substrate () under such a state that an electrode part for connection (joint ball) disposed on the semiconductor element (flip chip) () and a circuit electrode () disposed on the wiring circuit substrate () are facing with each other. In addition, the gap between the wiring circuit substrate () and the semiconductor element (flip chip) () is filled by a filling resin layer () comprising a liquid epoxy resin composition which comprises the following component (D) and the following components (A) to (C).

Electronic component unit

A resin composition usable for encapsulating a semiconductor, comprising (A) an epoxy resin having two or more epoxy groups in one molecule; (B) a curing agent; and (C) inorganic composite oxide particles constituted by silicon dioxide and at least one metal oxide selected from the group consisting of oxides of metal atoms belonging to Group III and Group IV of the Periodic Table excluding silicon; a semiconductor device comprising a wiring circuit board, a semiconductor element, and the above resin composition; and a method for manufacturing a semiconductor device comprising the steps of adhering a resin sheet comprising the resin composition of claim 1 and a stripping sheet to a semiconductor circuit side of a bump-mounting wafer, removing the stripping sheet leaving only the resin composition to the wafer, and cutting the wafer into individual chips.

Growing community of inventors

Ibaraki, Japan

Hiroshi Noro