Denso Corporation

Japan Fine Ceramics Center

Sumitomo Electric Industries, Limited

Nippondenso Co., Ltd.

Kitagawa Industries Co., Inc.

Desno Corporation

Ihi Cornoration

Hiroshi Nomura

Yukihiro Kato

Ryosuke Sakai

Takuma Esaka

Takeshi Tsukamoto

Tatsuaki Sugito

Hiroaki Miwa

Akito Sasaki

Hirohiko Nakata

Masaya Miyake

Kiyoshi Uchida

Yukio Shimokawa

Takeshi Nakamura

Takashi Ishikawa

Kazuyoshi Nagase

Akira Shintai

Hironobu Baba

Yasuo Kondo

Katsunori Michiyama

Kazuhisa Ikeda

Satoshi Kitaoka

Toru Matsuzaki

Masatoshi Tokunaga

Kan Kinouchi

Hideaki Matsubara

Norio Yamaguchi

Tsuyoshi Takemoto

Michitake Kuroda

Haruhisa Koike

Yutaka Suematsu

Taishi Yokoi

Kenji Nakahira

Hatsuomi Isogai

A current sensor includes a wiring board, a shield, an insulating sensor housing, and a shield adhesive. The wiring board and the shield are accommodated in the sensor housing. The sensor housing has a shield support part to support the shield, and a shield adhesion part. An application surface of the shield adhesion part is further from the shield than a contact surface of the shield support part. The shield is mounted on the contact surface of the shield support part, and the shield adhesive is disposed between the application surface of the shield adhesion part and the shield. The shield and the wiring board are aligned with and spaced from each other in the sensor housing.

Current sensor

The current sensor has a conductive member through which a current to be measured flows in a predetermined direction, and a magneto electric converter facing and spaced apart from the conductive member in an intersecting direction intersecting the predetermined direction. An opposing portion of the conductive member facing the magneto electric converter has an annular shape in which two tip surfaces face each other via a gap around the predetermined direction. The magneto electric converter is opposed to the hollow portion, arranged in the opposing portion having an annular shape, in the intersecting direction via the gap.

An environmental resistant coating member includes a SiC long fiber-reinforced ceramics substrate and an environmental barrier coating layer provided on the whole surface of the SiC long fiber-reinforced ceramics substrate. The environmental barrier coating layer includes a SiAlON bonding layer laminated on the SiC long fiber-reinforced ceramics substrate, a mullite layer laminated on the SiAlON bonding layer, a reaction inhibition layer laminated on the mullite layer, and a gradient layer formed on the reaction inhibition layer that gradually changes from a rare-earth disilicate to a rare-earth monosilicate. The reaction inhibition layer includes at least one of an alumina layer, a garnet layer, and a rare-earth (mono)silicate layer. When the reaction inhibition layer includes two or more of these layers, the layers are formed in the order of the alumina layer, the garnet layer, and the rare-earth (mono)silicate layer from a mullite layer side toward a gradient layer side.

Environmental resistant coating member

A differential pressure detection type pressure sensor includes: a casing having a concavity; a pressure detection element disposed on a bottom of the concavity; a through hole; a first protection member in the concavity; and a second protection member in the through hole. The pressure detection element has one side facing the bottom of the concavity and the other side facing an opening of the concavity. The through hole includes one opening on the bottom of the concavity and the other opening on a part of the casing. The height of the first protection member facing the opening of the concavity and the height of the second protection member in the other opening of the through hole are on a same plane.

Differential pressure detection type pressure sensor and method for manufacturing the same

A soft hexagonal ferrite sintered material includes crystal particles of M-type hexagonal ferrite corresponding to a general chemical formula MFeOwherein M is at least one element selected from the group consisting of Ba, Sr and Pb. Crystal particles having particle diameters of 5 &#x3bc;m to 100 &#x3bc;m are extracted from a sintered material produced from a precursor powder mixture. The extracted particles as seed crystals are mixed with a calcined powder comprising fine crystals having the above composition and particle diameters of 0.5 &#x3bc;m to 3 &#x3bc;m, then is sintered until the intended particle growth of the crystal particles in the sintered material is achieved to give an average particle diameter of 30 &#x3bc;m to 500 &#x3bc;m.

Method for producing soft magnetic hexagonal ferrite sintered material and soft magnetic hexagonal ferrite sintered material

A pressure sensor includes a sensor device and a diaphragm. The diaphragm is exposed to a fluid, a pressure relative to which is detected using the sensor device. The diaphragm is made of a material having a pitting index, which is defined by the equation, (Cr&plus;3.3Mo&plus;20N), of 50 or greater and Ni content of 30 weight % or greater to prevent the diaphragm from corroding due to the fluid.

Pressure sensor with a corrosion-resistant diaphragm

A trimming circuit includes a signal separation circuit for separating an input signal into a clock signal, a reset signal, a data signal, and a memory writing voltage signal in accordance with voltage levels. The memory circuit in the trimming voltage control circuit has at least first and second different error correction circuits. The first error correction circuit has a higher error correction capability but lower input-per-output bit efficiency than the second error correction circuit to correct important data such as a highest bit inputted to a D/A converter. The second error correction circuit such as SEC has a higher input-per-output bit efficiency than the first error correction circuit to correct data with an error correction code. The lowest or second lowest input bits are directly supplied to the D/A converter without error correction.

Trimming circuit for a physical quantity sensor

In order to form a hollow portion in a resin block after a molding operation, a projection for forming a hollow portion in a resin block is formed on an upper die. A front face of the projection is processed into a mirror finished face (smoothed flat face). Recess portions are formed in the front face of the projection. The position of the recess portions correspond to wire bonding regions of a lead frame. The lead frame is clamped between an upper die and a lower die. A molding resin is injected into a space between the upper and lower dies. As a result, an excellent wire bonding face can be secured at regions on the lead frame in correspondence with the recess portions.

Resin sealing type semiconductor device

An IC chip for signal processing circuit is enclosed in a mold IC and a pressure sensitive element unit is integrally provided thereon. When the mold IC is housed in a case, the mold IC is fixed to the case under a state where ends of connector pins insert-molded to the case are electrically connected to external terminals of the mold IC. Thereby, a sensor signal is outputted from other ends of the connector pins. By integrating the IC chip for signal processing circuit in the mold IC, the IC chip for signal processing circuit can be protected against a contaminated environment at a location where the pressure sensitive element unit is arranged.

Semiconductor physical quantity sensor device having semiconductor

In an elastic member for attaching a sensor having a protruding portion to a sensor attachment member, the elastic member has a body member having a hollow shape, a first end protrusion formed on an inner surface of the body member close to a first end thereof, and a second end flange protruding outwardly from an outer surface of the body member close to a second end thereof. The sensor protruding portion is inserted into the elastic member from the second end of the elastic member to be a provisionally fixed state, and is inserted into the through hole of the sensor attachment member while keeping the provisionally fixed state. Thereafter, only the sensor protruding portion is additionally inserted into the through hole of the sensor attachment member. These processes can be easily performed by using the above-mentioned elastic member and the thus obtained sensor assembled body has high airtightness and high stability.

Elastic member, and method and structure for attaching sensor to sensor

A sensor apparatus is capable of removing RF noise. The sensor apparatus is comprised of a first power supply line connected to a power supply terminal; a second power supply line separately branched from the first power supply line and connected thereto; an output line; and a sensor circuit unit connected to the first power supply line so as to receive power therefrom, and for detecting a condition of an article under measurement to output a detection signal to the output line. In this sensor apparatus, the sensor circuit unit includes an operational amplifier operated by accepting the power supplied from the second power supply line, which performs the detection operation; a first filter circuit is connected to the first power supply line defined from a branch point between the first power supply line and the second power supply line to the first power supply line; a second filter circuit is connected to the second power supply line; and a third filter circuit is connected to the output line.

Sensor apparatus capable of preventing high frequency noise

A ceramics composite material containing crystallized glass as the matrix and fibers or whiskers of ceramics as a reinforcement material, is obtained by melting original glass to form crystallized glass, compounding the same with fibers or whiskers of oxide ceramics and thereafter crystallizing the original glass. This ceramics composite material does not form any voids and can easily contain at least 50 volume percent of the reinforcement material, whereby a good mechanical strength and fracture toughness are achieved. In the compounding step, the content of the reinforcement can be further increased by forcing out any excess part of the original glass from the reinforcement material by applying pressure to a substance obtained by mixing the original glass with the reinforcement. Further, the ceramics composite material can be efficiently formed into a desired configuration by heating because the original glass flows viscously.

Ceramics composite material and method of producing the same

Ceramics composite material

Growing community of inventors

Nagoya, Japan

Hiroshi Nomura