Denki Kagaku Kogyo Kabushiki Kaisha

Agency of Industrial Science and Technology

Ishikawajima-harima Jukogyo Kabushiki Kaisha

Hiroshi Nishikawa

Takashi Kawasaki

Hiroyuki Hara

Hiroshi Harada

Yukio Kuroda

Hisahiko Fukase

Akihiro Nomura

Heiji Kato

Kazuo Kobayashi

Ichitaro Ogawa

Hisayoshi Yoshida

Koichi Matsuda

Masami Nakashima

Kunio Matui

Shin-ichiro Asai

Hagio Tsuyoshi

Hiroaki Yasunaga

Kenichi Adachi

Ueki Saruta

Melamine borate particles each consisting essentially of needle crystal primary particles of melamine borate (C.sub.3 N.sub.6 H.sub.6.2H.sub.3 BO.sub.3) which are aggregated to one another.

Method of using hexagonal system boron nitride powder

Hexagonal system boron nitride powder

This invention concerns a sintered article for a sheath in an apparatus for continuous casting of a thin sheet and a sheath using the sintered article. The sintered article comprises boron nitride, zirconium oxide, and at least one member selected from the group consisting of aluminum nitride and aluminum borate and combines resistance to thermal shock, lubricity, and strength. The sheath is formed of the sintered article and, therefore, enjoys the prominent properties of the sintered article.

Sintered product for making sheath used for continuous thin plate

A pressureless sintered body of boron nitride contains more than 95 wt% of boron nitride. The pressureless sintered body hexagonal of boron nitride has a density of not less than 1.10 g/cm.sup.3 and a bending strength of not less than 300 kg/cm.sup.2. A process of producing the pressureless sintered body of boron nitride comprises pulverizing powders of starting feed boron nitride so that a specific surface area of each of the powders is two times or more than that of the starting feed boron nitride powder, molding the thus pulverized powders to obtain a pre-molded body and sintering the pre-molded body at a temperature of not less than 1400.degree. C. under atmospheric pressure and under non-oxidative atmosphere.

Pressureless sintered body of boron nitride

An electrically conductive hot press sintered ceramic product comprising boron nitride, titanium diboride and aluminum nitride and having a flexural strength of at least 900 kg/cm.sup.2, a specific resistance of from 300 to less than 2,500 .mu..OMEGA.cm and less anisotropy.

Electrically conductive ceramic product and process for its production

An epoxy resin composition for encapsulating semiconductors and semiconductor elements is disclosed. This epoxy resin composition mainly comprises (a) a polyfunctional epoxy compound, (b) a styrene type block copolymer or styrene type block copolymer and liquid rubber, (c) a hardener for the epoxy compound and (d) an inorganic filler.

Epoxy resin composition for encapsulating semiconductor

Growing community of inventors

Omuta, Japan

Hiroshi Nishikawa