Sekisui Chemical Co., Ltd.

Hiroshi Natsui

Hiroshi Yamauchi

Hiroyuki Morita

Taku Sasaki

Ren-de Sun

Shinya Uenoyama

The present invention provides a thermally expandable microcapsule that is excellent in heat resistance and durability and exhibits an excellent foaming property in a wide temperature range from low temperatures to high temperatures. The present invention is a thermally expandable microcapsule, which comprises a shell containing a copolymer, and a volatile liquid as a core agent included in the shell, the copolymer being obtainable by polymerization of a monomer mixture containing a monomer A and a monomer B, the monomer A being at least one selected from the group consisting of a nitrile group-containing acrylic monomer and an amide group-containing acrylic monomer, the monomer B being at least one selected from the group consisting of a carboxyl group-containing acrylic monomer and an ester group-containing acrylic monomer, a total amount of the monomer A and the monomer B accounting for 70% by weight or more of the monomer mixture, and a weight ratio of the monomer A and the monomer B being 5:5 to 9:1.

Thermally expandable microcapsule, method for producing thermally expandable microcapsule, foamable masterbatch, and foam molded article

The present invention provides a thermally expandable microcapsule that maintains a high expansion ratio and hardly bursts and shrinks even at a high temperature, a foamable thermoplastic resin masterbatch and a foam molded product that are produced using the thermally expandable microcapsule, and a method for producing the thermally expandable microcapsule. The thermally expandable microcapsule comprises a volatile expansion agent included in a shell as a core agent and the shell formed of a polymer, the shell containing a thermosetting resin and a polymer obtainable by polymerization of a monomer composition containing a nitrile-type monomer and a monomer having a carboxyl group, and the thermosetting resin having no radical-polymerizable double bond and at least two functional groups reactive with a carboxyl group per molecule.

Thermally expandable microcapsule

The present invention is a conductive particle having a copper layer formed on a surface of a resin particle, wherein in the copper layer, an area ratio of an area corresponding to voids in a cross-section in a thickness direction is 5% or less, and copper composing the copper layer has an average crystallite diameter of 40 nm or more. It is an object of the present invention to provide a conductive particle which has low initial connection resistance and which is hard to increase in connection resistance even when stored for a long period.

Electrically conductive microparticle, anisotropic electrically conductive material, connection structure, and method for production of electrically conductive microparticle

The present invention provides a conductive fine particle capable of suppressing a blackening phenomenon during storage and thus providing high connection reliability; an anisotropic conductive material containing the conductive fine particle; and a connection structure. The conductive particle which has a base fine particle, and a conductive layer and a low-melting point metal layer that are formed in the stated order on the surface of the base fine particle, wherein the low-melting point metal layer has an arithmetic mean surface roughness of 50 nm or lower.

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Osaka, Japan

Hiroshi Natsui