Yamaha Corporation

Hiroshi Nakaya

Kazuki Soga

Toshihisa Yamazaki

Suguru Tabara

Kenichi Miyazawa

Tatsuya Hiraku

Toshiharu Fukushima

Akio Yamamoto

Yoshiro Yamauchi

Akio Matsushima

A bow hair material for a bow hair of a bow of a bowed string instrument. The bow hair material includes threads constructed from poly phenylene sulfide resin. The bow material may be formed into a hair bundle that includes a plurality of threads that are substantially parallel with each other. A mounting portion may be formed by welding an end portion of the hair bundle that mounts the hair bundle on a frog or stick of the bow.

Bow hair material and bow for bowed string instrument

A manufacturing method for a board for a stringed instrument that is used as a top plate or a back plate of an acoustic stringed instrument such as a violin, where the board has a purfling, includes forming, for instance, a groove with a depth that is 20% or more and less than 60% of a thickness of the board for a stringed instrument, filling the groove with a resin in which, for instance, colored particles having a diameter of 3 &#x3bc;m or more and less than 70 &#x3bc;m are dispersed and which has a degree of elongation of 20% or more, removing the resin that has flowed out of the groove, and curing the resin.

Board for stringed instrument, acoustic stringed instrument, and method of manufacturing board for stringed instrument

An acoustic string instrument includes a top plate, a back plate, and a body disposed between the top plate and the back plate. The body has a plurality of first positioning portions. At least one of the top plate or the back plate, or both has a plurality of second positioning portions. The first positioning portions are fixed to the second positioning portions corresponding to the first positioning portions.

Acoustic string instrument, and methods for manufacturing and repairing same

A board for a stringed instrument which forms a front plate or a back plate of a stringed instrument, includes: a laminated plate that is obtained by laminating a plurality of veneers having a uniform thickness by an adhesive, at least one of the veneers having a different planar shape than the other veneers, in which the laminated plate is curved to be convex toward one surface side and has a thin portion and a thick portion.

Board for stringed instrument, method of manufacturing board for stringed instrument, and stringed instrument

A board for a stringed instrument which forms a front plate or a back plate of a stringed instrument, includes: a veneer that includes a concave portion for partially reducing the thickness of the veneer, in which the veneer is curved to be convex toward one surface side. In this board for a stringed instrument, fiber of the veneer may extend along the curved shape of the veneer.

A stick of a string instrument bow includes a base material having an arched-rod shaped carbon fiber resin layer made of carbon fiber resin and a glass fiber resin layer which covers the outer surface of the carbon fiber resin layer and is made of glass fiber resin, and the glass fiber resin layer has a non-adhesion portion formed of an air layer present within the glass fiber resin layer and an adhesion portion which does not include the air layer.

Stick of string instrument bow, string instrument bow and methods of manufacturing stick of string instrument bow

After a wiring material layer ( ) which is made of WSi or the like is formed on an insulation film covering a semiconductor substrate ( ), a first antireflection coating film ( ) which is made of TiON or TiN and a second antireflection coating film ( ) which is made of an organic material are sequentially formed on the wiring material layer ( ). Resist patterns ( to ) are formed on the second antireflection coating film ( ) by photolithography. The dry etching of the second antireflection coating film ( ) is performed using the resist patterns ( to ) as masks, after which the dry etching of the first antireflection coating film ( ) is conducted using the resist patterns ( to ) and patterns ( to ) of the second antireflection coating film ( ) as masks. The dry etching of the wiring material layer ( ) is effected using the resist patterns ( to ), the patterns ( to ) of the second antireflection coating film ( ) and patterns ( to ) of the first antireflection coating film ( ) as masks. The resist patterns ( to ) and the patterns ( to ) of the second antireflection coating film ( ) are removed. Lamination layers, each including one of patterns of the wiring material layer ( ) and one of the patterns of the first antireflection coating film ( ), form wiring layers. The resist patterns ( to ) and the patterns of the second antireflection coating film ( ) may be removed after the etching of the first antireflection coating film ( ), and the wring material layer ( ) may be etched using the patterns of the first antireflection coating film ( ) as masks.

Wiring forming method

An electric violin has a combination of two sorts of vibration detectors for transverse vibration components and vertical vibration components, a low-pass filter connected to the vibration detector for the transverse vibration components and a high-pass filter connected to the vibration detector for the vertical vibration components, piezoelectric transducers connected in parallel to a signal processing system, or vibration detectors connected to filter circuits different in frequency characteristics for producing right-channel and left-channel signals so that the electric violin generate electric tones close to acoustic violin tones.

Bowed stringed musical instrument for generating electric tones close to acoustic tones

A reticle pattern is transferred to a semiconductor wafer with a coated resist film by using a reduction (demagnification) exposure system having a focus sensor and an autofocus mechanism operating in response to an output of the focus sensor. An average level of a plurality of autofocus points in a chip area is calculated while the semiconductor wafer is mounted on a stage. The semiconductor wafer is scanned and levels of the surface in the chip area are sampled. From the distributions of sampled surface levels, a stepped surface level to be focussed is derived. An offset value between the average level and the stepped surface level to be focussed is derived and an autofocus point is corrected by the offset value to expose the chip area of the semiconductor wafer. A method of exposing a semiconductor wafer is provided which can perform an exposure most suitable for each process, by identifying a stepped surface level to be automatically focussed.

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Hamamatsu, Japan

Hiroshi Nakaya