Sumitomo Wiring Systems, Limited

Mitsubishi Petrochemical Company Limited

Sony Corporation

Mitsubishi Engineering-plastics Corporation

Mitsubishi Chemical Corporation

Japan Polychem Corporation

Toyota Jidosha Kabushiki Kaisha

Sumitomo Electric Industries, Limited

Autonetworks Technologies, Limited

Sony United Kingdom Limited

Matsumura Sangyo Co., Ltd.

Hiroshi Nakano

Kenji Okamura

Michiharu Kihira

Tetsuya Aihara

Hiroyoshi Maesoba

Toshihiko Sugano

Masahide Hio

Mitsutoshi Aritomi

Hideshi Uchino

Takao Tayano

Masuzo Yokoyama

Makoto Nakamura

Shinichi Yamauchi

Hiroyuki Kaneko

Hiroki Hirai

Masaaki Tabata

Toshifumi Ichio

James Hedley Wilkinson

Masato Minakata

Eiji Kojima

Atsushi Nishida

Hideki Matsunaga

Yusuke Arashiro

Shiroh Gotoh

Tomohide Yoshida

Kiyoji Takagi

Haruo Ohmura

Hiroshi Omori

Kouji Iwaki

Hiroyasu Furuse

Kiyokazu Takada

Tarou Amano

Hiroshi Kobayashi

Toru Suzuki

Katsumi Tahara

Yoshihiro Murakami

Masahiko Aoyama

Yasuo Iwasaki

Takeyoshi Nishio

Tetsuya Shinozaki

Tsutomu Yamamoto

Masaaki Miyamoto

Hiroomi Hiramitsu

Hitoshi Sakamoto

Yoshihisa Gonno

Hironari Sano

Yoshiyuki Ishihama

Yasutake Furukoshi

Takayuki Inoue

Shigeki Shimada

Tetsuya Iwamoto

Takao Tayama

Keiichi Itou

Junji Mayumi

Osamu Hirabayashi

Kenyu Ohno

Fumiyoshi Yamada

Yoshihisa Narui

Atsushi Kusuno

Masayuki Tomita

Akifumi Mishima

Katsuhiro Otsuka

Tadashi Takahashi

Fumiyo Ikehata

Motohiro Seki

Kikuo Kotake

Hiroshi Ohmori

Shinako Mori

Tomohiko Tanaka

Hiroyuki Satoh

Kazutoyo Matsumura

Emi Higashiizumi

Toshiro Kojima

Hidetaka Ito

Shuuichi Toriu

Masanobu Miwa

Hirotugu Niwa

Kenichi Muramatsu

An object of the present invention is to provide a resin composition improved in film formability and/or mechanical property, particularly tensile elastic modulus or tearing strength, of the film. The present invention provides a resin composition including at least (A) an aliphatic polyester-based resin and (C) a starch, the aliphatic polyester-based resin (A) forming a matrix phase and the starch (C) forming a dispersed phase, wherein the average particle diameter of the dispersed phase is 1 &#x3bc;m or less.

Resin composition, film, bag product and production process of resin composition

The present invention relates to a polyester resin composition comprising: (A) a polyester resin containing 5% by mole or more and not more than 86% by mole of a succinic acid unit in the whole of an aliphatic dicarboxylic acid unit; (B) a polyester resin containing 5% by mole or more and not more than 95% by mole of an aromatic dicarboxylic acid unit in all of dicarboxylic acid units; and (C) a polyester resin containing an aliphatic oxycarboxylic acid, wherein the polyester resin composition contains from 10 to 89% by weight of the resin (A) and from 11 to 90% by weight of the resin (B) relative to a total sum of the resins (A) and (B) and contains from 1 to 40% by weight of the resin (C) relative to a total sum of the resins (A), (B) and (C).

Polyester resin composition

Process for preparing a thermoplastic resin composition containing an aromatic polycarbonate resin which may include a thermoplastic resin other than the aromatic polycarbonate resin, a granular talc, and optionally a rubber polymer, a flame retardant or a fluorinated polyolefin. The granular talc has a particle size in which a proportion of a 500 &#x3bc;m-mesh screen residue thereof is not less than 55% by weight.

Thermoplastic resin composition and resin molded product

For generation of a subtitle in a digital movie screening system, it is essential to reduce the burden of processing the subtitle when screening a movie. There is provided a subtitle generating apparatus destined for use in a digital movie screening system, the subtitle generating apparatus, which includes a storage unit having a movie subtitle file stored therein, a controller to generate an internal file on the basis of the subtitle file, and a subtitle processor to decode the internal file for generating a subtitle and combine the subtitle and a movie picture with each other, the subtitle file consisting of a main file in which there are described information identifying a file of text data representing characters to be displayed as a subtitle of a movie and a file of image data representing the content of an image displayed as the movie subtitle along with control data for displaying the subtitle, one or more font files including font data on the text data, and one or more image files including the image data, the internal file being an integration of the main, font and image files, made by combining the described content of the main file with the substantive data of the font and image files, and the controller generating the internal file from the subtitle file prior to displaying the movie.

Subtitle generating apparatus and method

The present invention relates to a thermoplastic resin composition which comprises 100 parts by weight of a thermoplastic resin (component A) and 1 to 400 parts by weight of a granular inorganic filler (component B) comprising an inorganic filler having an average particle diameter of 0.01 to 100 &#x3bc;m and a water-soluble polyester resin binder, and having a bulk density of 0.4 to 1.5 g/mL; and a resin molded article obtained by molding the thermoplastic resin composition. The thermoplastic resin composition is improved in various properties such as extrusion moldability, rigidity, impact resistance, thermal stability and hue, and exhibits an excellent balance between these properties.

Thermoplastic resin composition and resin molded article

Polycarbonate resin compositions containing 100 parts by weight of aromatic polycarbonate resin having a concentration of end hydroxyl group of 100 to 1800 ppm and 0.0001 to 5 parts by weight of fine particles of a boride of La, Ce, Pr, Nd, Tb, Dy, Ho, Y, Sm, Eu, Re, Tm, Yb, Lu, Sr or Ca. Heat ray shielding molded products molded from this polycarbonate resin composition have low haze, excellent transparency, low solar transmittance and sufficient heat ray shielding properties, especially for visible light and selective shielding for infrared rays, and are excellent in mechanical strength and thermal stability at melting. These molded products may be used for windows for buildings or vehicles or as optical materials such as infrared ray cut filters or films for agricultural use.

Polycarbonate resin composition and heat ray shielding molded product

Disclosed herein is an information display apparatus for displaying an image received from an image supplying source on an image display section after carrying out a conversion process on the image in an image conversion section employed in the information display apparatus on demand. The information display apparatus may include a timing storage section, an image determination section, and an output-path switching section.

Image display apparatus and image display method

A digital movie screening system in which a movie subtitle can easily be used with protection of the copyright on the subtitle. A character information generating apparatus includes an encryption unit to encrypt a font file including data for displaying characters in a specific font, and a character information file generator to generate a character information file including a main file describing therein text data representing the content of characters to be displayed on a display unit and control data for displaying the characters and a font file encrypted by the encryption unit. The character information file generator also describes, in the main file, information on whether a font file indicated with a pointer, if any, described in the main file is an encrypted file.

Character information generating apparatus and method, character information displaying apparatus and method, digital movie screening method and system, and subtitle display apparatus

A connector cover () has of two half pieces () mounted on a rear of a connector housing (). Upper and lower ribs (U,L) are formed in one half piece () near a rubber plug () mounted in a rear end portion of the connector housing () at opposite sides of an extension (L) of the axial line of a through hole () of the rubber plug, through which hole a wire (W) is inserted. The upper and lower ribs define a first wire guide () to bend small-diameter wires (W) drawn out backward from the through hole (). The connector cover () also has a second wire guide () for bending the small-diameter wires (W) bent by the first wire guide () in a direction opposite to a bending direction by the first wire guide ().

Connector with a cover with wire guides bending a wire in opposite directions

A board connector () has a housing () and terminal fittings () penetrate through the back wall () of the housing (). A board connecting portion () of each terminal fitting () penetrates through the back wall () and is solder-connected to a board (). The housing () has a heat transfer inhibiting portion for inhibiting heat transfer to the back wall (). The heat transfer inhibiting portion has a through-hole () or heat-insulating grooves () in the back wall (). As a result, heat transfer to the back wall () is inhibited and deformation of the back wall () due to thermal expansion also is inhibited. Consequently, it is possible to prevent the terminal fittings () from separating from the board () and going into a state of being not solder-connected thereto.

Board connector

A plurality of terminal fittingsare mounted to a housingboard connecting portionshaving mounting portionsat lower ends protrude rearward, fixed fittingshaving mounting platesat lower edges are mounted to opposite side surfaces of the housingand the mounting portionof each terminal fittingand the mounting platesof the fixed fittingsare secured to a PCBby reflow soldering. During the reflow soldering, a drawing force toward the PCBacts on each of the terminal fittingsand the fixed fittingsbased on surface tension of molten solder H, but the center of the fixed fittingin the fore/aft direction of the board connecting portionis positioned forward of the center of gravity position O of a connectorand rotation moment Mb toward the PCBacts on the front of the housingbased on a drawing force Fb on the side of the fixed fittingto prevent the front from being raised.

A circuit board connector has a fixing member () for a housing () on a circuit board (K). Engaging portions () of the fixing member () are bent to increase the areas of engaging surfaces () in the thickness direction (TD). Thus, contact areas between the engaging portions () and restricting surfaces () of the housing () increase, and forces acting on the contact surfaces are distributed. Accordingly, even if large separating forces repeatedly act on a housing (), damage and to the engaging portions () and restricting surfaces () can be prevented.

Connector

A polycarbonate-based resin composition for extrusion molding using a siring die, and a molded product produced by extrusion-molding the resin composition using a sizing die, The polycarbonate-based resin composition comprises, as a main component, a polycarbonate having a viscosity-average molecular weight of 17000 to 27000 and containing main repeating units represented by the following formula (A): wherein an amount of proton (Pa) and an amount of proton (Pb) per 1 g of the polycarbonate which are calculated from respective integral values of a signal (a) detected at &#x3b4;=7.96 to 8.02 ppm and a signal (b) detected at &#x3b4;=8.11 to 8.17 ppm inH-NMR spectra thereof as measured in a deuterated chloroform solvent, satisfy the following formula (1):4&#x3c;{(Pa)+(Pb)}&#x3c;26 &#x2003;&#x2003;(1)wherein a unit of each of (Pa) and (Pb) is &#x3bc;mol/g. The above polycarbonate resin composition exhibits good mechanical properties and a good moldability.

Polycarbonate-based resin composition for extrusion molding using sizing die and molded product

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Yokkaichi, Japan

Hiroshi Nakano