Sumitomo Chemical Company, Limited

Daiwa Can Company

Daiwa Engineering Co., Ltd.

Hiroshi Nakamura

Kunimasa Kamio

Yasuhiro Hirano

Akira Yokota

Yasuhisa Saito

Shigeki Naitoh

Masatsugu Akiba

Mituo Maeda

Tohru Nagashima

Shuichi Kanagawa

Yutaka Shiomi

Shigeo Hozumi

Akira Morii

Kohichi Okuno

Masao Yamagiwa

Katsuya Watanabe

Noriaki Saito

Hisao Takagishi

Hideo Nomura

Toshiaki Hayashi

Yoshifumi Yoshida

Yoshiki Matsuoka

Noriyuki Arai

Yutaka Yamaguchi

Shigenao Hata

Hidekazu Yoshioka

Toshihisa Kasahara

Hideyuki Tani

To provide a plate material conveying system configured to load plate materials produced by a press work onto a tray at regular intervals, prior to a cleaning process. The plate material conveying system comprises: a feeding sectionthat feeds the plate materials produced by the press work at regular intervals; a storage sectionthat stores the plate materials conveyed sequentially from the feeding section; a loading sectionthat loads the plate materials stored in the storage sectionon the tray opposing thereto at one time; and a discharging sectionthat conveys the tray from a site to be opposed to the storage sectionto a predetermined site.

Plate material conveying system

A thermoplastic resin composition comprising an aromatic polysulfone resin and at least one resin selected from aromatic polyester resins, wherein the amount of alkali metal which exists in the aromatic polysulfone resin as a terminal phenolate is 50 ppm or less, and molded article thereof. This composition is excellent in heat resistance and melt-mold processability.

Aromatic polysulfone resin composition and molded article containing the same

Disclosed herein is a process for melt-bonding a molded article of a thermotropic liquid crystalline polyester with a metal, which comprises activating or irradiating a surface of a molded article of a thermotropic liquid crystalline polyester resin and melt-bonding the surface with a metal at or above the flow temperature of the thermotropic liquid crystalline polyester.

Process for melt-bonding molded article of liquid crystalline polyester with metal

Liquid crystal polyester resin composition and molded article

Provided is a liquid crystal polyester resin composition prepared by compounding glass fiber with a liquid crystal polyester resin, wherein said glass fiber has been surface-treated with a thermosetting resin and the ignition loss of the surface-treated glass fiber is from 0.05 to 0.4% by weight. The molded article obtained by using the composition of the present invention have excellent mechanical property and heat-resistance, particularly, solder heat-resistance, and are extremely useful as materials for which heat-resistance is required such as electric and electronic parts.

Liquid crystal polyester resin composition and molded article thereof

Provided is a granular fertilizer coated with a thermosetting resin coating, characterized in that a dissolution rate of the fertilizer is retarded by containing a hydrophobic compound in at least one of the coating portion and the fertilizer portion thereof. The dissolution rate is further retarded than that of a conventional granular coated fertilizer coated with a thermosetting resin.

Granular coated fertilizer and method for producing the same

A thermoplastic resin composition in which 5 to 45 parts by weight of carbon fiber and 0.1 to 10 parts by weight of conductive carbon black are compounded per 100 parts by weight of resin components comprising an aromatic polycarbonate resin and an aromatic polysulfone resin. The thermoplastic resin composition is excellent in heat-resistance and mechanical strength, and heat-resistant IC trays therefrom are useful products which can endure drying of IC at high temperature and are excellent in handling properties.

Thermoplastic resin composition and heat-resistant tray for IC

The stilbene epoxy resin having two different aryl groups and an epoxy resin mixture including this stilbene epoxy resin have lower melting points than those of the stilbene epoxy resin having two identical aryl groups and the epoxy resin mixture of the latter stilbene epoxy resin. Compared with the conventional resins, the present resin or resin mixture has improved working and molding properties, which shortens the time required for the molding and working process, resulting in economic advantages and a preferred affect on productivity. The present epoxy resin or resin mixture is preferably used as an adhesive, a coating, an insulating material, an electrical or electronic material for laminated sheets or the like. It is especially suited for use as material for encapsulating electronic parts.

Epoxy resin, resin composition, and resin-encapsulated semiconductor

The stilbene epoxy resin having two different aryl groups and an epoxy resin mixture including this stilbene epoxy resin have lower melting points than those of the stilbene epoxy resin having two identical aryl groups and the epoxy resin mixture of the latter stilbene epoxy resin. Compared with the conventional resins, the present resin or resin mixture has improved working and molding properties, which. shortens the time required for the molding and working process, resulting in economic advantages and a preferred affect on productivity. The present epoxy resin or resin mixture is preferably used as an adhesive, a coating, an insulating material, an electrical or electronic material for laminated sheets or the like. It is especially suited for use as material for encapsulating electronic parts.

A thermoplastic resin composition comprising an aromatic polycarbonate resin and an aromatic polysulfone resin and having the specific melt viscosity ratio between the two resins in the composition. This composition is excellent in heat resistance and gives a molded article of especially high temperature of deflection under load.

Thermoplastic resin composition and molded article

The invention provides a cis-stilbene type epoxy resin having lower melting point and lower viscosity than the trans-stilbene type epoxy resin hitherto known. The stilbene type epoxy resin has a cis-isomer content of essentially 100%, or in the alternative, at least about 10% with the rest being the trans-isomer, and is based on the following general formula (1): ##STR1## wherein R.sub.1 to R.sub.8 are independently an acyclic or cyclic alkyl group, a hydrogen atom, or a halogen atom. Production processes for these epoxy resins are also disclosed.

Epoxy resin stilbenes and process for producing the same by

Epoxy resin and process for producing the same

A powder coating composition comprising as essential components: (A) polyester resin having at least two hydroxyl groups in a molecule, and (B) polyvalent organic cyanate having at least two cyanate groups in a molecule of the following formula and/or its prepolymer; ##STR1## wherein A is C1-C6 hydrocarbon group, and A may be different from each other;

Polyester powder coating composition

An epoxy resin composition which comprises: (a) an epoxy resin having at least two epoxy groups in the molecule, (b) an epoxy resin curing agent, (c) a cure accelerator, (d) an aromatic polyamide pulp and (e) an inorganic filler as the essential components, the aromatic polyamide pulp (d) being contained in an amount of 0.5 to 10% by weight based on the total weight of the component (a), the component (b) and the component (d), and the inorganic filler (e) being contained in an amount of 75 to 94% by weight based on the total weight of the component (a), the component (b), the component (c) and the component (e), and a semiconductor device sealed with the above epoxy resin composition. The cured product of the epoxy resin composition is good in balance of hot impact strength and hot flexural strength and hence, the semiconductor device sealed with the epoxy resin composition is excellent in soldering resistance.

Epoxy resin composition, process for producing the same and resin-sealed

A resin composition comprising a polymeleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are epoxidized and allyl-etherified and, as an optional ingredient, a curing agent, or a resin composition comprising a polymaleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are allyl-etherified and an epoxy resin; and a heat resistant composite material comprising cured product of said resin composition as its matrix phase and containing a fiber as its reinforcing material.

Growing community of inventors

Ibaraki, Japan

Hiroshi Nakamura