Yamaha Robotics Co., Ltd.

Yamaha Robotics Holdings Co., Ltd.

Shinkawa Ltd.

Wacom Co., Ltd.

Hiroshi Munakata

Takuya Adachi

Michael Kirkby

Ysmaldo Jose Landaez Garcia

John Ditri

Yuhei Ito

Masaru Yokota

Shota Nakano

Choyekh Mahdi

Moe Tehrani

Landaez Ysmaldo

Provided is a transfer apparatus. The transfer apparatus includes, in addition to a non-contact chuck that lifts and holds a workpiece in a non-contact manner, a plurality of ultrasonic vibrators that radiate ultrasonic waves. The plurality of ultrasonic vibrators are configured to radiate the ultrasonic waves to generate a standing wave that attracts the workpiece, and are configured for the non-contact chuck to hold the workpiece at a position where forces attracting in a plurality of directions toward outside of the workpiece are balanced when viewed from a direction facing the workpiece.

Transfer apparatus capable of suppressing side slip of workpiece lifted by non-contact chuck

An acoustic foreign matter removal device includes a stage, an acoustic head, and a movement mechanism. The acoustic head has a plurality of ultrasonic speakers and a casing. A plurality of ultrasonic waves generated from the plurality of ultrasonic speakers are concentrated in a gap between the casing and a holding surface of the stage to form a low pressure region; and foreign matter adhering to a surface of an electronic component is sucked into the low pressure region to remove the foreign matter from the surface.

Acoustic foreign matter removal device

A defect detection device () that detects defects in a semiconductor device () comprises ultrasonic speakers () that ultrasonically vibrate the semiconductor device (), a laser source () that irradiates the semiconductor device () with collimated laser light (), a camera () that has an imaging element () which acquires images by imaging the semiconductor device () that has been irradiated with the collimated laser light (), and a detection unit () that detects defects in the semiconductor device () on the basis of the images picked up by the camera (), wherein the detection unit () detects defects in the semiconductor device () on the basis of the deviation between images acquired by the camera () of the semiconductor device () when static and when ultrasonically vibrated.

Defect detection device and defect detection method

Provided is a wire bonding state determination device which determines a bonding state between a pad and a wire after the wire is bonded to the pad. The wire bonding state determination device includes: a waveform detector which makes an incident wave incident to the wire, and detects a transmission waveform of the wire and a reflection waveform from a first bonding surface between the pad and the wire; and a bonding determination unit which determines the bonding state between the pad and the wire based on the transmission waveform and the reflection waveform detected by the waveform detector.

Wire bonding state determination method and device using a prescribed electric waveform

A defect detection device () which detects a defect of a semiconductor device () includes: a standing wave generator (), applying a standing wave () to the semiconductor device () to apply a suction force to a wire (); cameras (); and a control part (), adjusting an operation of a standing wave generator () and performing defect detection on the semiconductor device (). The control part () captures, by using the cameras (), a first image of the semiconductor device () of a first state in which the suction force is applied to the wire () and a second image of the semiconductor device () of a second state in which the suction force applied to the wire () is smaller than the first stage, and compares the first image and the second image to perform defect detection.

An ultrasound vibrating-type defect detection apparatus () for detecting a defect in a semiconductor apparatus () is provided with: an ultrasound vibrator (); a high-frequency power supply (); a camera (); and a controller () for adjusting the frequency of high-frequency power supplied from the high-frequency power supply () to the ultrasound vibrator (), and for performing detection of a defect in the semiconductor apparatus (). The controller () causes the camera () to capture an image of the semiconductor apparatus () while varying the frequency of high-frequency power supplied from the high-frequency power supply () to the ultrasound vibrator (), and performs detection of a defect in the semiconductor apparatus () on the basis of the captured image.

Ultrasound vibrating-type defect detection apparatus and wire defect detection system

An ultrasonic cleaning method of the invention includes: a cleaning liquid coating step (S), coating a cleaning liquid on a front surface of an electronic component held on a cleaning stage; a pealing step (S), irradiating the front surface of the electronic component coated with the cleaning liquid with ultrasonic waves from ultrasonic speakers installed to an acoustic head and peeling off a foreign matter attached to the front surface from the front surface; and an attracting step (S), concentrating the ultrasonic waves generated from the ultrasonic speakers at a gap between a casing and a holding surface of the cleaning stage to form a low pressure region whose pressure is lower than atmospheric pressure at a central lower part of the casing, and attracting the foreign matter peeled off from the front surface of the electronic component and the cleaning liquid coated on the front surface.

Ultrasonic cleaning method

An ultrasound horn is provided which vibrates a bonding tool, attached at a tip, in a plurality of directions with a simple structure. There is provided an ultrasound horn having: a longitudinal vibration generator; a horn portion; and a torsional vibration generator. The torsional vibration generator includes a body including a polygonal pillar portion, second layered elements in which a plurality of second piezoelectric elements are layered, and which are attached to side surfaces of the polygonal pillar portion, weights, and a pressure application ring which applies a pressure by pressing the second piezoelectric elements against the polygonal pillar portion via the weights.

Growing community of inventors

Tokyo, Japan

Hiroshi Munakata