Fujikura Limited

Hiroshi Miyata

Hirohito Watanabe

Masatoshi Inaba

A method of manufacturing a printed circuit board includes: forming a copper layer of an interconnection pattern on a base film; laminating a cover lay on the base film so as to expose a part of the copper layer from the cover lay and cover the copper layer by the cover lay; mechanically polishing at least the exposed portion of the copper layer; and performing a plating process on the exposed portion of the copper layer so as to form a plated layer on the copper layer, and the angles &#x3b1;and &#x3b1;between the polishing direction of the exposed portion of the copper layer and the bending lines Cand Csatisfy the following formula (1):30&#xb0;&#x2266;&#x3b1;and &#x3b1;&#x2266;150&#xb0;&#x2003;&#x2003;(1).

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Sakura, Japan

Hiroshi Miyata