Mitsubishi Electric Corporation

Hiroshi Mihara

Hiroyuki Ono

Yudai Yoneoka

Noboru Nishihara

Takashi Miyasaka

Norihiko Akashi

Daisuke Koyama

Yoshiaki Irifune

Koichi Tatsuyama

Shimpei Kasahara

A printed circuit substrate includes a circuit unit, a first main frame ground interconnection, a first sub frame ground interconnection spaced away from the first main frame ground interconnection in a first direction, and a first conductive via connecting the first main frame ground interconnection and the first sub frame ground interconnection to each other. In plan view from the first direction, a second outer periphery of the first sub frame ground interconnection is surrounded by a first outer periphery of the first main frame ground interconnection. Thus, a printed circuit substrate that can prevent the circuit unit from malfunctioning can be provided.

Printed circuit substrate

An electronic device includes a printed circuit board that has a prohibited region, in which arrangement of a wiring pattern is prohibited, in a fixed region from an outer periphery, an electronic component mounted on the printed circuit board, a heat dissipation fin provided on the electronic component, and a fixing unit that is made of a conductive material and fixes the heat dissipation fin by pressing the fin against the printed circuit board side, wherein a notch is formed in two sides of the printed circuit board that face each other with the electronic component therebetween, and the fixing unit exerts an elastic force that presses the heat dissipation fin against the printed circuit board side by being locked to the notch and is such that hook portions locked to the notch are arranged in the prohibited region.

Electronic device

Growing community of inventors

Chiyoda-ku, Japan

Hiroshi Mihara