Hitachi Chemical Company, Ltd.

Hitachi Chemical Dupont Microsystems, Ltd.

National Institute of Advanced Industrial Science and Technology

Hiroshi Matsutani

Akitoshi Tanimoto

Takumi Ueno

Shingo Tahara

Yu Aoki

Shigeru Nobe

Ken Nanaumi

Kei Kasuya

Nanako Mizuguchi

Alexandre Nicolas

Katsuya Maeyama

Makoto Kaji

Shigeki Katogi

Yasuharu Murakami

Toshihiko Takasaki

Haruaki Sue

Koichi Abe

Masayuki Ooe

Takashi Kumaki

Hajime Nakano

Iwao Fukuchi

Hideyasu Tsuiki

Yuko Uchimaru

Misao Inaba

Satoshi Asaka

Takashi Hattori

Yukihiko Yamashita

Yohei Ishikawa

Kouichi Abe

Keiko Kudoh

A polyketone composition includes: (A) a polyketone having, in a main chain, a structural unit represented by the following Formula (I); and (B) an epoxy compound. In Formula (I), X represents a bivalent group that has from 1 to 50 carbon atoms and that may have a substituent group, Y represents a bivalent hydrocarbon group that has from 1 to 30 carbon atoms and that may have a substituent group, and n represents an integer from 1 to 1500. 

Polyketone composition including epoxy compound, cured polyketone, optical element, and image display device

An aromatic polyketone including, in a structural unit, at least one alicyclic skeleton and at least one carbon atom bound by two rotatable single bonds, or an aromatic polyketone including a structural unit represented by the following Formula (1), the following Formula (2), or the following Formula (4), and a structural unit represented by the following Formula (5) is provided. 

Aromatic polyketone, method of producing the same, aromatic polyketone composition, aromatic polyketone film, optical element, and image display apparatus

Provided is a method of manufacturing an aromatic polyketone film, the method including: applying a coating liquid to at least a part of a surface of a substrate to form a coating liquid layer, the coating liquid including a solvent and an aromatic polyketone having a structural unit represented by Formula (1) or (2); drying the coating liquid layer; and after the drying, subjecting the coating liquid layer to a heat treatment. In Formula (1) or (2), each Rindependently represents an alkyl group having 1 to 20 carbon atoms; each Rand each Rindependently represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms; X represents a specific divalent aromatic hydrocarbon group, or a divalent alicyclic hydrocarbon group having 3 to 30 carbon atoms; and Y represents a specific divalent functional group. 

Method of manufacturing aromatic polyketone film, aromatic polyketone film, substrate provided with aromatic polyketone film, optical element, and image display device

The invention provides a photosensitive resin composition comprising (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a compound that generates an acid by light, and (C) an acrylic resin having a group that crosslinks with the component (A), as well as a method for manufacturing a patterned cured film, and an electronic component prepared therewith.

Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component

A positive-type photosensitive resin composition includes (A) a phenol resin modified by a compound having an unsaturated hydrocarbon group having 4 to 100 carbon atoms; (B) a compound that produces an acid by light; (C) a thermal crosslinking agent; and (D) a solvent. The positive-type photosensitive resin composition according to the present invention can be developed by an alkaline aqueous solution, and an effect thereof is that a resist pattern having sufficiently high sensitivity and resolution, excellent adhesion, and good thermal shock resistance can be formed.

Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device

Disclosed is a photosensitive resin composition comprising (A) an alkali-soluble resin having a structural unit represented by the following formula (1), (B) a compound that generates an acid by light, (C) a thermal crosslinking agent, and (D) an acryl resin having a structural unit represented by the following formula (2): wherein Rrepresents a hydrogen atom or a methyl group; Rrepresents an alkyl group having 1 to 10 carbon atoms, or the like; and a represents an integer of 0 to 3, b represents an integer of 1 to 3, and the total of a and b is 5 or less, and wherein Rrepresents a hydrogen atom or a methyl group; and Rrepresents a hydroxyalkyl group having 2 to 20 carbon atoms.

Photosensitive resin composition, method for producing patterned cured film, semiconductor element and electronic device

There is provided a photosensitive resin composition containing (A) an alkali-soluble resin, (B) a compound which generates an acid when exposed to light, (C) a thermal crosslinking agent, and (D) a nitrogen-containing aromatic compound represented by the following formula (1): wherein Rrepresents a hydrogen atom or a hydrocarbon group; Rrepresents a hydrogen atom, an amino group or a phenyl group; and A and B each independently represent a nitrogen atom, or a carbon atom and a hydrogen atom bonded thereto.

The positive-type photosensitive resin composition according to the present invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound that produces an acid by light, a thermal crosslinking agent, and a silane compound having at least one functional group selected from an epoxy group and a sulfide group.

Positive photosensitive resin composition, method of creating resist pattern, and electronic component

The positive tone photosensitive composition of the invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound producing an acid by light, a thermal crosslinking agent and an acrylic resin. It is possible to provide a positive tone photosensitive composition that can be developed with an aqueous alkali solution, has sufficiently high sensitivity and resolution, and can form a resist pattern with excellent adhesiveness and thermal shock resistance.

Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device

A positive tone photosensitive composition comprising: (A) an alkali-soluble resin having a phenolic hydroxyl group; (B) a phenol resin modified by a compound having an unsaturated hydrocarbon group containing 4 to 100 carbon atoms; (C) a compound that generates an acid by the action of light; (D) a thermal cross-linker that crosslinks the ingredient (A) and the ingredient (B) by heating; and (E) a solvent.

Positive-type photosensitive resin composition, method for producing resist pattern, and electronic component

Interlayer insulating films(insulating films) provided in a memory capacitor cellare formed between a gate electrodeand a counter electrodeC formed on a silicon wafer. The interlayer insulating filmscomprise a borazine-based resin, having a specific dielectric constant of no greater than 2.6, a Young's modulus of 5 GPa or greater and a leak current of no greater than 1&#xd7;10A/cm.

Borazine-based resin, process for its production, borazine-based resin composition, insulating film and method for its formation

Provided is a positive photosensitive resin composition which is advantageous not only in excellent sensitivity, resolution and adhesion, but also in excellent heat resistance even when the composition is cured by a low-temperature process at equal to or lower than 280&#xb0; C., as well as low water absorption and capability to give a pattern with favorable configuration. The positive photosensitive resin composition contains: (a) alkaline aqueous solution-soluble polyamide having a polyoxazole precursor structure; (b) an o-quinonediazide compound; and (c) a latent acid generator which generates acid upon heating. The composition optionally further contains (d) a compound having a phenolic hydroxyl group or (e) a solvent.

Positive photosensitive resin composition, method for forming pattern, and electronic part

Interlayer insulating films(insulating films) provided in a memory capacitor cellare formed between a gate electrodeand a counter electrodeC formed on a silicon waferThe interlayer insulating filmscomprise a borazine-based resin, having a specific dielectric constant of no greater than 2.6, a Young's modulus of 5 GPa or greater and a leak current of no greater than 1&#xd7;10A/cm.

Borazine-based resin, and method for production thereof, borazine based resin composition, insulating coating and method for formation thereof, and electronic parts having the insulating coating

The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1):&#x2014;R&#x2014;S&#x2014;R&#x2014;S&#x2014;R&#x2014;&#x2003;&#x2003;(1) 

Sulfur-containing phenolic resin, process for preparing the same, phenol derivatives having thioether structure or disulfide structure, process for preparing the same and epoxy resin composition and adhesive

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Hitachi, Japan

Hiroshi Matsutani