Sii Nanotechnology Inc.

Hiroshi Matsumura

Takashi Ogawa

Yo Yamamoto

Toshiaki Fujii

Kiyoshi Hasegawa

Toshio Doi

Masashi Muramatsu

Provided are an X-ray analyzer and a mapping method for an X-ray analysis which, in a inspection for a harmful substance contained in, for example, a material or a composite electronic component, enable determination as to whether a sample is normal or abnormal to be performed visually based on an image obtained by the X-ray mapping analysis. In the X-ray analyzer, an X-ray mapping image of a sample which is confirmed to be normal in advance is obtained as a reference mapping image. A mapping analysis is performed on a inspection sample. A difference from the reference mapping image is obtained for each pixel, to thereby display a difference mapping image. A region in which the amount of specific element is larger than a reference amount is displayed with high brightness, and hence an abnormal portion may be easily found.

X-ray analyzer and mapping method for an X-ray analysis

A charged particle beam apparatus which is able to adjust charged particle optics easily in a short time with a high degree of accuracy and a method of adjusting charged particle optics are provided. A charged particle beam apparatusincludes a charged particle source, charged particle opticsconfigured to set the ion beam I to a bean characteristic value corresponding to an input value to cause a sample to be irradiated therewith, scanning meansconfigured to be able to move the irradiation point of the charged particle beam I relatively with each other, observing meansbeing capable of obtaining an image, and a control unit, and the control unitincludes spot pattern forming meansconfigured to set the input value to different values and cause the sample to be irradiated with the charged particle beam I by a plurality of times at different positions to form a plurality of spot patterns and spot pattern analyzing meansconfigured to select a spot pattern having a smallest characteristic value, and sets the input values of the charged particle opticsto a value equal to the input value corresponding to the selected spot pattern.

Charged particle beam apparatus and method of adjusting charged particle optics

A charged particle beam apparatus includes a charged particle source, an aperture, an object lens, an observing unit, an aperture driving portion, and a control portion. The control portion includes a spot pattern forming portion that forms a plurality of spot patterns on a surface of a sample by irradiating a charged particle beam, an analyzing portion that calculates a position of a spot center of the spot pattern and a geometrical center position of a halo, and an adjusting position determining portion that calculates an adjusting position based on a position of intersecting lines connecting the positions of the spot centers of the respective spot patterns and the center position of the halo. In this manner, the position of the aperture can be easily and accurately adjusted in a short period of time by moving the center axis of the aperture to the adjusting position.

Charged particle beam apparatus and method adjusting axis of aperture

A network system has a first LAN, a second LAN, and a storage device for storing data accessible from the first LAN and the second LAN. A control apparatus controls accessibility of the data stored in the storage device from the first LAN and the second LAN. The control apparatus includes an access prevention device for preventing access from the first LAN to the second LAN and from the second LAN to the first LAN and a device for overriding a setting of the access prevention device to allow accessibility of the second LAN from the first LAN.

Growing community of inventors

Chiba, Japan

Hiroshi Matsumura