Matsushita Electric Industrial Co., Ltd.

Hiroshi Kushanti

Yuki Satoh

Toru Sakuragawa

Tetsuro Shimamura

Koji Seo

A surface acoustic wave filter with little electromagnetic coupling between wires and improved attenuation characteristics is provided. This surface acoustic wave filter comprises: a package having a concavity in the shape of stairs made by laminating dielectrics, a surface acoustic wave element provided on the bottom face of the concavity, a plurality of wires for connecting between a plurality of electrodes provided on the surface of the surface acoustic wave element and a plurality of electrodes provided on one same plane portion of the stairs of the package in correspondence to a plurality of electrodes, and a dummy wire provided between the wires.

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Izumisano, Japan

Hiroshi Kushanti