Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Hiroshi Kurimoto

Junji Yamane

Koichiro Minato

Yoshihiro Watanabe

Hiroyuki Saikawa

Douyuu Hachisu

Morihiro Yamada

Takanao Saitou

Doyuu Hachisu

Masami Kobayashi

Takanao Saito

Ryuji Nakamura

Yasushi Kurasaki

Kohei Harazono

Kouhei Harazono

Masaharu Minami

A capacitor is improved in reliability by suppressing the formation of burrs or protrusions at a joint portion between an aluminum wire round rod and an external terminal in a lead wire used for a capacitor. A metal cap having a higher melting point than aluminum is fitted to an end portion of the aluminum wire round rod and the metal cap is heated, thereby joining the aluminum wire round rod to the metal cap. Thereafter, the external terminal and the metal cap are welded to each other. The metal cap has a curved surface in which an outer periphery is decreased from an opening toward an end portion opposite to the opining. The opening is provided with a stepped portion, so that the sealing degree is increased when the lead wire is inserted into a hole of the sealing member.

Capacitor lead wire, its manufacturing method, and capacitor using the same

A lead-wire includes a led-out electrode made of metal and a cap. The cap is put over an end of the led-out electrodes, and is made of metal harder than the metal forming the led-out electrodes. An electronic component includes a functional element and the lead-wire. The led-out electrodes is led out of the functional element.

Electronic component, lead-wire and their production methods

A chip-type aluminum electrolytic capacitor is provided that allows a lead wire exposed from an insulated terminal plate to have an increased temperature sooner than the other parts to provide highly-reliable soldering in a relatively-easy reflow atmosphere environment and that has a superior vibration resistance. The capacitor includes an insulated terminal plate () that includes, at the outer surface thereof, an insertion hole () to which a pair of lead wires () introduced from a sealing member of a capacitor body are inserted and a first concave groove () for storing lead wires () inserted to the hole while lead wires () being bent in an orthogonal direction. Insulated terminal plate () is attached to the capacitor so as to be abutted with the above sealing member. Metal electrode () is buried in an inner face of first concave groove () provided in insulated terminal plate () and the periphery thereof. A part of metal electrode () is exposed at end face section () of insulated terminal plate (). The capacitor also has bidirectional second concave groove () that extends from the insertion hole of insulated terminal plate () to end sections () of the insulated terminal plate.

Chip-type aluminum electrolytic capacitor

Disclosed is an aluminum electrolytic capacitor, which comprises a capacitor element prepared by rolling an anode foil and a cathode foil together with a separator and impregnating them with a driving electrolyte, an anode lead electrically connected to the anode foil, a cathode lead electrically connected to the cathode foil, a tubular metal case having one closed end and the other open end and containing the capacitor element, and a sealing member hermetically closing the open end, wherein the anode and cathode leads are bent along an outer surface of the sealing member. In this aluminum electrolytic capacitor, the sealing member is comprised of a rubber composition containing a rubber component having, as a constituent, a butyl rubber prepared by crosslinking an isobutylene-isoprene copolymer having an unsaturation degree of 1.2 to 2.5 mol %, with an alkyl-phenol-formaldehyde resin, and 100 to 200 mass parts of reinforcing filler with respect to 100 mass parts of the rubber component. The rubber composition has a Wallace hardness according to International Rubber Hardness Degree (IRHD) of 80 Hw or more, and a tensile elastic modulus at a solder reflow temperature of 4 N/mmor more.

Aluminum electrolytic capacitor and method of producing the same

The electronic component of the present invention includes a case having an opening, an electronic component element and electrolytic solution disposed in the case, and a sealing member disposed so as to seal the opening. The sealing member has elasticity and is formed of a cross-linked structure of compound. The compound contains butyl rubber polymer as main component, phenol-based additive, and silane-based additive. Accordingly, the sealing member is improved in air-tightness, and the volatilization of the electrolytic solution becomes lessened. Further, an electronic component having such sealing member ensures excellent mounting ability. As a result, it is possible to obtain an electronic component capable of assuring excellent reliability for a long period of time even in a high temperature atmosphere and under high-temperature high humidity conditions.

Electronic component

Electrolytic capacitor with open circuit mode mechanism

Growing community of inventors

Yamaguchi, Japan

Hiroshi Kurimoto