Riken Corporation

Ricoh Company, Ltd.

Kabushiki Kaisha Yaskawa Denki

Other

Rikagaku Kenkyusho

Hamamatsu-photonics K.k.

Ridagaku Kenkyusho

Hiroshi Kumagai

Katsumi Midorikawa

Yasufumi Yamada

Kouichi Toyoda

Yukiko Sawada

Noriko Abe

Motohisa Kamei

Shinichiro Aoshima

Makoto Umeno

Tamio Nakamura

Yukio Hashiguchi

Masatoshi Fujimoto

Shingo Ando

Seiichiro Fukushima

Takashi Motoyoshi

Takeshi Yokoyama

A robot system includes a robot, a vision sensor, a target position generation circuit, an estimation circuit, and a control circuit. The robot includes an end effector and is configured to work via the end effector on a workpiece which is disposed at a relative position and which is relatively movable with respect to the end effector. The vision sensor is configured to take an image of the workpiece. The target position generation circuit is configured to, based on the image, generate a target position of the end effector at every generation interval. The estimation circuit is configured to, at least based on relative position information related to the relative position, estimate a change amount in the relative position at every estimation interval. The control circuit is configured to control the robot to move the end effector based on the target position and the change amount.

Robot system, method for controlling robot, robot controller, and non-transitory computer-readable storage medium

A calibrating method includes controlling a laser radiator to radiate calibration laser light to an object such that a pattern is projected in a laser coordinate system with respect to the laser radiator; controlling a camera to obtain a first image of first light points of the calibration laser light projected on a surface of the object when the object is in a first position; and controlling the camera to obtain a second image of second light points of the calibration laser light projected on the surface of the object when the object is in the second position. A positional relationship between the laser coordinate system and the camera coordinate system is calculated based on the three-dimensional positions of the first light points and the three-dimensional positions of the second light points.

Calibrating method and calibration apparatus

A robot system includes a conveyor, a robot, a speed calculation circuit, and a robot control circuit. The conveyor is configured to convey a workpiece at a conveyance speed. The robot is configured to work on the workpiece while the workpiece is conveyed by the conveyor. The speed calculation circuit is configured to calculate the conveyance speed. The robot control circuit is configured to control a working speed of the robot according to the conveyance speed calculated by the speed calculation circuit.

Robot system, robot controller, and method for producing to-be-worked material

A rack includes a container holder that is fixed to a stage and holds a container that contains a liquid to be dispensed and a camera that is fixed to the stage and located in a position where the camera is capable of capturing an image of the container.

Rack for dispensing and dispensing system

A dispensing system comprising a robot configured to move a dispenser for suctioning a liquid to be dispensed, a camera for capturing an image including at least a tip of the dispenser, a liquid surface of the liquid, and an object not to be dispensed located below the liquid surface, and circuitry configured to acquire, based at least in part on the image captured by the camera, surface location information for the liquid surface, boundary location information for a boundary between the liquid and the object not to be dispensed, and dispenser location information for the tip of the dispenser on the basis of the image, and control the robot to lower the dispenser based at least in part on the dispenser location information, the surface location information, and the boundary location information.

Dispensing system, and dispensing method

An apparatus for processing a three-dimensional structure having a fine three-dimensional shape and a smooth surface is disclosed in which the three-dimensional structure is usable for an optical device. The process method includes depositing a thin layer for absorption of laser light on a flat substrate; depositing a transparent layer on the thin layer for absorption of laser light; and irradiating a process laser light, passing through the transparent layer; in which pulse injection energy of the process laser light is set to be the same as or smaller than the maximum pulse injection energy capable of exposing a surface of the thin layer in front in the incident direction of the process laser light, and to be set the same as or greater than the minimum pulse injection energy capable of removing the transparent layer in rear in the incident direction of the process laser light.

Method and apparatus for processing three-dimensional structure, method for producing three-dimensional shape product and three-dimensional structure

A laser processing method where laser beam for processing is irradiated on a processing object and the laser beam for processing directly removes a part of the processing object. The processing object is made of a glass substrate, metal thin film having high absorption to laser beam for processing is formed on a surface of glass substrate, into which laser beam for processing is made incident, the laser beam for processing is irradiated from a surface of metal thin film, and matter is directly removed by irradiation of laser beam onto the processing object in order to form a region finer than an irradiation region of laser beam for processing on the processing object.

Method for processing by laser, apparatus for processing by laser, and three-dimensional structure

Disclosed is a method for processing a three-dimensional structure having a fine three-dimensional shape and a smooth surface is disclosed in which the three-dimensional structure is usable for an optical device. The process method comprises the steps of depositing a thin layer for absorption of laser light on a flat substrate; depositing a transparent layer on the thin layer for absorption of laser light; and irradiating a process laser light, passing through the transparent layer; in which pulse injection energy of the process laser light is set to be the same as or smaller than the maximum pulse injection energy capable of exposing a surface of the thin layer in front in the incident direction of the process laser light, and to be set the same as or greater than the minimum pulse injection energy capable of removing the transparent layer in rear in the incident direction of the process laser light.

A laser processing method capable of performing fine and highly accurate processing by low energy is obtained. The invention relates to the laser processing method where laser beam for processing () is irradiated on a processing object () and the laser beam for processing () directly removes a part of the processing object (). The processing object () is made of a glass substrate, metal thin film () having high absorption to laser beam for processing () is formed on a surface of glass substrate, into which laser beam for processing () is made incident, the laser beam for processing () is irradiated from a surface of metal thin film (), and matter is directly removed by irradiation of laser beam onto the processing object () in order to form a region finer than an irradiation region of laser beam for processing () on the processing object ().

Method for processing a three-dimensional structure by laser

A method for cooling atoms, having a plurality of magnetic sublevels, involves a laser. Specifically, multiple polarized coherent light sources of a predetermined wavelength are sequentially emitted to atoms to move the electrons of the atoms to a lower magnetic sublevels, hence cooling the atoms. The sequentially emitted laser light can be applied at predetermined time intervals, whereby it becomes possible to laser-cool a variety of atoms including semiconductor atoms, such as silicon and germanium.

Method for laser cooling of atoms and apparatus therefore

The transparent medium processing device comprises: a light control section for performing variable control for the status of the laser beam emitted from the light source section , and a light status measurement section for measuring the status of the laser beam inside the processing target TG. The light control section is adjusted based on the output of the light status measurement section so that the status of the laser beam inside the processing target becomes a desired status. Since the status of the laser beam inside the processing target, which is made of such a transparent medium as glass, is measured by the light status measurement section, and is fed back to the light control section, laser processing can be executed while maintaining an optimum status at a processing point inside the processing target.

Transparent medium processing device

In order to provide a multilayer film structure for soft X-ray optical elements in which a high reflectivity can be attained in even a soft X-ray wavelength region of a wavelength of 10 nm or less including the wavelength range of water window zone, in a multilayer film structure for soft X-ray optical elements wherein a first thin film, being a different type of a second thin film, and the second thin film are piled up in layers to form a multi-layer film, at least one of the aforesaid first thin film and the aforesaid second thin film is made to be an oxide thin film.

Multilayer film structure for soft X-ray optical elements

The present invention has been achieved by perceiving the fact to the effect that a semiconductor production process-like manner such as CVD method or the like by which materials and film thickness can be controlled in an atomic scale may be utilized in case of preparing thin-film crystal, and employing such semiconductor production process-like manner being quite different from conventional technique. The invention relates to preparation of crystalline thin-films for solid-state lasers wherein a substrate contained in a vessel under a high vacuum condition is heated, materials for forming the laser material are supplied onto the surface of the aforesaid substrate in the form of gas, ion, single metal or metal compound to grow crystal on the surface of the aforesaid substrate, and a material of active ionic species is supplied onto the surface of the aforesaid substrate simultaneously with supply of the aforesaid materials for forming the laser host crystal, thereby controlling valence number of the material of active ionic species so as to be identical with the valence number of the metal ion constituting the crystal of the aforesaid laser host crystal.

Growing community of inventors

Wako, Japan

Hiroshi Kumagai