General Electric Company

Sabic Innovative Plastics IP B.v.

Ge Plastics Japan Ltd.

Hiroshi Kubo

Hiromi Ishida

Vijay Rajamani

Takashi Ohtomo

Sho Sato

Kenichi Ishiwa

Kazunari Kosaka

Xiangyang Tai

Takuro Kitamura

Ming Yin

Weiguang Yao

Hidekazu Kabaya

Atsuo Oshiro

Koji Myojo

A flexible resin composition comprises poly(arylene ether) resin, syndiotactic polystyrene, olefin elastomer, hydrogenated styrene-butadiene copolymer, and a non-halogen fire retardant.

Resin composition for wire and cable covering material

A resin composition useful for wire and cable covering material is formed by compounding a phosphate ester retardant, boron phosphate, and zinc borate hydrate with a polyphenylene ether group resin or a combination of a polyphenylene ether group resin and an aromatic vinyl group resin, in a specific ratio.

Flame-retardant composition and article

A resin composition which has improved resistance to yellowing due to light without loss of the superior characteristics of polyphenylene ether polyamide resins comprises (A) a polyphenylene ether resin, (B) a polyamide resin, (C) a styrene thermoplastic resin, (D) a pigment; wherein the styrene thermoplastic resin and the pigment are dispersed in the polyphenylene ether resin and the polyphenylene ether resin is a particulate dispersion in the polyamide resin. The composition may further comprise a rubber polymer wherein the rubber polymer is dispersed in the polyphenylene ether resin.

Thermoplastic resin composition

Thermoplastic compositions are provided containing polyphenylene ether resin, polyamide resin and terpene phenol having a hydroxyl value of 45 or above. The compositions have outstanding coating film adhesion.

Compositions of polyphenylene ether and polyamide resins containing

Resin composition comprising 8-10 parts by weight of a polyphenylene ether resin, 90-20 parts by weight of a polyamide resin, and 30-70 parts by weight, per 100 parts by weight of the polyphenylene ether resin and the polyamide resin combined, of a plate or flake like inorganic filler wherein the inorganic filler has an average particle size of no more than 5 .mu.m and as aspect ratio of no less than 3 and wherein the difference between the crystallization initiation temperature of a composition comprising 90 weight percent polyamide and 10 weight percent of the inorganic filler and the crystallization initiation temperature of the polyamide resin is 5.degree. C. or less. The resin compositions have excellent surface smoothness, high rigidity, a small linear expansion coefficient, and good impact resistance, heat resistance and chemical resistance.

Resin composition

Resin compositions comprising (A) polyethylene ether resins, (B) polyamide resins, (C) elastomeric substances, and (D) needle-shaped titanium oxide are disclosed. The disclosed resins exhibit an excellent balance of stiffness and impact resistance, low linear coefficient of expansion, and good heat resistance, oil resistance, forming processability and molding surface appearance.

Growing community of inventors

Moka, Japan

Hiroshi Kubo