Hitachi Chemical Dupont Microsystems, Ltd.

Hitachi Chemical Dupont Microsystem L.l.c.

Hiroshi Komatsu

Masayuki Ooe

Dai Kawasaki

Takumi Ueno

Yoshiko Tsumaru

Kouji Katou

Hajime Nakano

Nagatoshi Fujieda

Takeharu Motobe

A photosensitive polymer composition includes (a) a polyamide having a repeating unit represented by the following general formula (I): wherein U represents a tetravalent organic group, V represents a bivalent organic group and p is an integer representing a number of the repeating unit; (b) a compound which generates an acid upon receiving light; and (c) a compound represented by the following general formula (II): wherein m and n are each independently integer of 1 or 2, Rs are each independently hydrogen, alkyl group or acyl group, and Rand Reach independently represents fluoroalkyl group having 1 to 3 carbon atoms.

Photosensitive polymer composition, method of producing pattern and electronic parts

A heat resistant photosensitive resin composition having excellent film properties is provided by constituting a photosensitive resin composition containing (A) a polymer having an acid functional group and/or a substituent derived therefrom, (B) a compound having at least one substituent derived from an amine functional group, (C) a photoreactive compound, and (D) a solvent. Using this composition, a pattern with high resolution can be produced, and thus an electronic part having a high quality can be produced.

Heat-resistant photosensitive resin composition, method for forming pattern using the composition, and electronic part

A photosensitive resin composition is disclosed that includes (A) a heat-resistant polymer of the general formula (1):(where the symbols are as defined in the specification), (B) a photoreactive compound, and (C) a solvent. A relief pattern is formed from the composition by applying the composition to a support substrate and drying it to form a photosensitive resin film; exposing the dried film; developing the exposed film using an alkaline aqueous solution; and heating the developed photosensitive resin film. Also disclosed is an electronic component that includes an electronic device having such a pattern.

Photosensitive resin composition, process for forming relief pattern, and electronic component

The invention provides a developer for photosensitive polyimides, with which polyimide patterning for interlayer insulating films for multi-layered circuit boards and for .alpha.-ray shield layers, buffer coat layers and others for semiconductor memory devices is attained within a shorter period of time than with conventional developers. It provides a developer for photosensitive polyimide precursors, which comprises two or more solvents including at least an aprotic polar solvent, and in which the mixed solution of the solvents has a polar component solubility parameter, .delta.P, of not smaller than 7, and provides a patterning method of using the developer.

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Ibaraki, Japan

Hiroshi Komatsu