Toray Industries, Inc.

Nagoya Mekki Kogyo Kabushiki Kaisha

Hiroshi Kobayashi

Hiroshi Takezaki

Nobuyuki Tomioka

Itaru Asano

Takahiko Otsubo

Taiki Maeyama

Makiko Saito

Hiroaki Sakata

Yuji Echigo

Shirou Honda

Takashi Ikushima

Naofumi Hosokawa

Nobuyuki Suganuma

Yuko Shimizu

Suehiro Kamizono

Tom Wong

Hirokazu Ohnishi

Daisuke Kido

A prepreg having high processability and laminating performance and a method to produce such a prepreg is described, the prepreg comprising at least the components [A] to [E] shown below, and having a structure incorporating a first layer composed mainly of the component [A] and a first epoxy resin composition that contains the components [B] to [D] but which is substantially free of the component [E], and a second layer composed mainly of a second epoxy resin composition that contains the components [B] to [E],

Prepreg and production method therefor, slit tape prepreg, carbon fiber-reinforced composite material

A prepreg is provided that has excellent processability and handleability and that can be processed into a cured product with high heat resistance. Also provided is a method to produce such a prepreg in an industrially advantageous way without being restricted by the types and contents of the matrix resin components used. The prepreg includes at least components [A] to [D] as given below and a preliminary reaction product that is a reaction product of the component [B] and the component [C], at least one surface resin in the prepreg having a storage elastic modulus G' in the range of 1.0&#xd7;10to 2.0&#xd7;10Pa as measured at a temperature of 40&#xb0; C. and an angular frequency in the range of 0.06 to 314 rad/s: [A] carbon fiber, [B] epoxy resin, [C] curing agent, and [D] thermoplastic resin.

Prepreg, method for producing same, and slit tape prepreg

[Problem] To provide: a fiber-reinforced composite material having both Mode I interlaminar fracture toughness and compressive strength under wet heat conditions; an epoxy resin composition for producing the fiber-reinforced composite material; and a prepreg produced using the epoxy resin composition. [Solution] An epoxy resin composition comprising at least the following constituents [A], [B] and [C]: [A] an epoxy resin; [B] composite polyamide microparticles which satisfy such a requirement (b1) the materials constituting the particles are a polyamide (B1) and a thermoplastic elastomer resin (B2), such a requirement (b2) that the melting point or the glass transition temperature of the polyamide (B1) is higher than 100&#xb0; C. and such a requirement (b3) the number average particle diameter is 0.1 to 100 &#x3bc;m; and [C] a curing agent.

Epoxy resin composition, prepreg and fiber-reinforced composite material

The invention provides a prepreg that can give a fiber-reinforced composite material exhibiting stable and excellent interlaminar fracture toughness and impact resistance under wide molding conditions. The prepreg includes at least a reinforcement fiber [A], a thermosetting resin [B], and the following component [C] wherein 90% or more of the material [C] is present inside a region of the prepreg that extends from any surface of the prepreg to a prepreg site having, from the surface, a depth of 20% of the thickness of the prepreg. The component [C] satisfies requirements that (i) the storage elastic modulus G' of the material constituting the particles is more than 1 MPa, and 70 MPa or less at 180&#xb0; C., and that (ii) the ratio of the storage elastic modulus G&#x2032; of the material constituting the particles at 160&#xb0; C. to the storage elastic modulus G&#x2032; of the material at 200&#xb0; C. ranges from 1 to 5; and is insoluble in the thermosetting resin [B].

Prepreg, fiber-reinforced composite material, and thermoplastic resin particles

Composite polyamide fine particles include a polyamide (A1) which has a melting point or a glass transition temperature of over 100&#xb0; C. and a polymer (A2) which is different from the polyamide (A1). The composite polyamide fine particles have: a dispersion structure in which a plurality of domains each having an average particle diameter of 0.05 to 100 &#x3bc;m whose main component is the polymer (A2) are dispersed in a polyamide (A1) based matrix; an average particle diameter of 0.1 to 500 &#x3bc;m; and a sphericity of 80 or more.

Composite polyamide fine particles and method of producing same

A process of producing polymer microparticles wherein, in a system which includes a polymer (A), a polymer (B) and an organic solvent and can cause phase separation into two phases of a solution phase mainly composed of the polymer (A) and a solution phase mainly composed of the polymer (B) when the polymer (A), the polymer (B) and the organic solvent are dissolved and mixed together, after an emulsion is formed at a temperature of 100&#xb0; C. or higher, the polymer (A) is precipitated by bringing a poor solvent for the polymer (A) into contact with the emulsion.

Polymer microparticles and process for production thereof

A process of producing polylactic acid-based resin microparticles includes a dissolving process that forms a system, which can cause phase separation into two phases of a solution phase mainly composed of polylactic acid-based resin (A) and a solution phase mainly composed of polymer (B) different from polylactic acid-based resin, by dissolving the polylactic acid-based resin (A) and the polymer (B) different from polylactic acid-based resin in an ether-based organic solvent (C), an emulsion-forming process that forms an emulsion by applying a shear force to the system, and a microparticle-forming process that precipitates polylactic acid-based resin microparticles by contacting the emulsion with a poor solvent which has lower solubility of the polylactic acid-based resin (A) than the ether-based organic solvent (C).

Process of producing polylactic acid-based resin microparticles, polylactic acid-based resin microparticles and cosmetics

A filament bundle is rewound from a reel, and passes through various sorts of liquid in processing vessels to be used for plating. The filament bundle passes through a fixed guide roller and a movable guide roller while it travels within the liquid in the processing vessel. The movable guide roller is moved periodically, the filament bundle is stretched and slackened by turns, whenever the filament bundle is slackened or untied, the bundle is loosened. The filament bundle with each filament subjected to the plating is taken up to a take-up reel.

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Nagoya, Japan

Hiroshi Kobayashi