Hitachi Chemical Company, Ltd.

Hiroshi Kirihara

Yoshihiro Nomura

Yoshiyuki Tanabe

Youichi Hosokawa

Shinji Iioka

Satoru Yanagisawa

Aizo Kaneda

Akira Kageyama

Teiichi Inada

Kazunori Yamamoto

Yasushi Shimada

Yasushi Kumashiro

Hiroyuki Kuriya

Takeo Tomiyama

Yoichi Hosokawa

A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.

Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame

The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25&deg; C. of from 10 to 2,000 MPa and a storage elastic modulus at 260&deg; C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.

Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film

Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film

Growing community of inventors

Ichihara, Japan

Hiroshi Kirihara