Oki Electric Industry Co., Ltd.

Daiichi Pharmaceutical Co., Ltd.

Oki Data Corporation

Nof Corporation

Canon Kabushiki Kaisha

The Furukawa Electric Co., Ltd.

Nippon Telegraph and Telephone Public Corporation

Kabushiki Kaisha Toshiba

Hitachi, Ltd.

Mitsubishi Electric Corporation

Olympus Corporation

Tohoku University

Nippon Zeon Company, Ltd.

Amada Company, Limited

Ricoh Company, Ltd.

Hiroshi Kikuchi

Akira Nagumo

Mitsuru Kishimoto

Tohru Yasukohchi

Shinichi Katakura

Tadashi Kasai

Hideo Kobayashi

Tatsuya Suzuki

Masayuki Ishikawa

Takashi Hasegawa

Jo Klaveness

Hideki Kimura

Tadashi Ogawa

Jiro Tanuma

Yukio Ota

Yoshiharu Momiyama

Hideaki Ishimizu

Hisao Ono

Shigeki Nakajima

Norio Suzuki

Minoru Isobe

Katsuyuki Ito

Tatsuya Koyama

Minoru Mizutani

Hiroshi Okada

Kenji Sato

Noriko Sato

Hiroyoshi Kawasaki

Yoshitaka Tadaki

Tatsuyuki Tokunaga

Mitsuru Akashi

Takehito Shimatsu

Kohei Seyama

Yuichi Gomi

Hiroyuki Mabuchi

Hideaki Takahashi

Yukio Otome

Tetsuya Nishio

Tatsuhiko Shimomura

Tadashi Hirata

Isao Amemiya

Tetsuya Hayashida

Masato Sakai

Tomonori Nakamura

Junichi Terai

Arne Berg

Kazuyoshi Yoshida

Yoshihiko Konno

Hiroaki Okamoto

Shigenori Koido

Pal Rongved

Takao Mizutani

Azusa Sugawara

Shyoichi Watanabe

Hitoshi Yamauchi

Minoru Teshima

Takashi Itaya

Hirokazu Andou

Kuniharu Hayashi

Sadao Hirota

Takao Uchida

Chika Itoh

Yoshinori Koshida

Kazuhiro Kubo

Syunsuke Ohhashi

Kiyoto Yachi

Chihiro Komori

Masanori Maekawa

Yukio Ohta

Munehiro Tomikawa

Tadasi Kodama

Seiji Kojima

Yoshitomo Koga

Tadao Shimizu

Kiyoshi Ikeda

Masahiko Shimosugi

Kiyoshi Matsuda

Naoji Akutsu

Noboru Ooishi

Hirokazu Ando

Haruhisa Saito

Shoji Wada

Masato Kawasaki

Tomohiro Kyoto

Kazuhiko Nagaoka

Yoshiaki Takemoto

Mitsuhiro Tsukimura

Tatsuhiro Ishida

Kenji Sakanoue

Toshiyuki Asaka

Akio Kishida

Miyuki Uomoto

Tetsuo Takano

Katsuya Kamimura

Kyohei Ishikawa

Thorfinn Ege

Yoshihiro Makuta

Shusaburo Hokukoku

Naohiro Takazawa

Masahiro Tatsukami

An electronic component cleaning apparatus for cleaning a surface of a wafer includes: a wet cleaning unit, a dry cleaning unit, a transport unit and a control unit. The control unit; performs the wet cleaning of the surface of the wafer by the wet cleaning unit; transports the wafer that has been cleaned to the dry cleaning unit; performs the dry cleaning of the surface of the wafer with atmospheric pressure plasma by the dry cleaning unit; transports the wafer that has been dry-cleaned to the wet cleaning unit; and performs a hydrogen water treatment to hydrophilize the surface of the wafer using hydrogen water in which hydrogen gas is dissolved in water.

Electronic component cleaning apparatus

A surface treatment apparatus applies a hydrophilic treatment to a bonding surface of a target object bonded to a bonded object using hydrogen bonding, the hydrophilic treatment being applied prior to the bonding. The surface treatment apparatus includes a support base and a spray nozzle. The support base supports a surface of the target object opposite to the bonding surface, the target object being one or more target objects. The spray nozzle causes dew condensation temporarily on the bonding surface by spraying, onto the bonding surface of the target object supported by the support base, humidified air having a water vapor pressure equal to or higher than a saturated water vapor pressure corresponding to a temperature of the bonding surface.

Surface treatment apparatus and manufacturing apparatus for semiconductor device

An electric circuit abnormality detection device includes a pulse generator, a directional coupler, and a detection unit. The detection unit includes a reference reflected wave database and a calculation part. The reference reflected wave database stores waveform information of a reference reflected wave inputted from the directional coupler when a pulse signal is inputted to a reference electric circuit that has a same wiring pattern as a pulse heater and does not have an abnormality. The calculation part detects an abnormality in the pulse heater by comparing waveform information of a reflected wave inputted from the directional coupler when the pulse signal is inputted to the pulse heater, with waveform information of the reference reflected wave stored in the reference reflected wave database.

Resistance wire abnormality detection device

A wafer cleaning apparatus for cleaning a surface of a wafer includes: a wet cleaning unit that cleans the surface of the wafer with liquid; and a dry cleaning unit that cleans the surface of the wafer with atmospheric pressure plasma, and the dry cleaning unit is disposed above the wet cleaning unit to overlap the wet cleaning unit.

Wafer cleaning apparatus and bonding system

This conveying devicecomprises: a chuckthat contactlessly holds a semiconductor chipto face a holding surfaceB; and a guidethat has a guide probecapable of abutting a chip side surfaceof the semiconductor chip, and for the semiconductor chipheld by the chuck, the guide probelimits the movement of the semiconductor chipin the lateral direction which intersects a normal N to the holding surfaceB. The guide probeis capable of reciprocating movement in which a probe tipmoves towards and away from the holding surfaceB.

Conveying device

A laser beam machine includes: a laser oscillator that outputs laser light; a transmission fiber through which the laser light output from the laser oscillator propagates; a first adjuster that is disposed between the laser oscillator and an incidence end of the transmission fiber and changes an incidence numerical aperture of the laser light incident to the incidence end of the transmission fiber; a second adjuster that converges the laser light and changes a zoom magnification of the laser light between an emission end of the transmission fiber and a workpiece; and a controller that performs adjustment of a beam diameter of the laser light at an image forming position of the laser light and adjustment of an emission numerical aperture of the laser light emitted from the emission end of the transmission fiber independently of each other, by changing the incidence numerical aperture.

Laser beam machine and method for controlling laser beam machine

This method for producing a structure wherein base materials are bonded by atomic diffusion comprises: a step for applying a liquid resin on the base material; a step for smoothing the surface of the liquid resin by surface tension; a step for forming a resin layer by curing; a step for forming a metal thin film on the resin layer; a step for forming a metal thin film on the base material; and a step for bringing the metal thin film of the base material and the metal thin film of the base material into close contact with each other, thereby bonding the metal thin film of the resin layer and the metal thin film of the base material with each other by atomic diffusion.

Method for producing structure, and structure

The present invention is provided with: a stage having a placing surface for a semiconductor chip, and a first heater heating the placing surface; a bonding head having a contact surface to be in contact with an subject, a second temperature sensor measuring the temperature of the subject via the contact surface, and a second heater heating the contact surface, said bonding head being driven in at least the orthogonal direction with respect to the placing surface; and a control unit measuring the temperature of the subject based on a temperature detection value of the second temperature sensor, said temperature detection value having being obtained by heating the placing surface and the contact surface to predetermined target temperatures, respectively, by means of the first and second heaters, then bringing the contact surface into contact with the subject in a state wherein heating by the second heater is stopped.

Mounting apparatus and temperature measurement method

An information processing apparatus includes an extraction unit configured to extract a character from an input character string and a generation unit configured to generate a printTicket with the character extracted by the extraction unit as an Option of a plurality of Features, wherein print data is generated from the printTicket generated by the generation unit and a rendering command from an application.

Information processing apparatus, information processing method, and recording medium

An information processing apparatus includes a control unit configured to add a first live tile content including printer information about a first print queue and a second live tile content including printer information about a second print queue different from the first print queue to a tile list that is gathering for specifying a live tile content displayed by an operating system, wherein the first print queue and the second print queue are each associated with a same application. The operating system is configured to display the first live tile content in a tile display region according to the tile list and to display the second live tile content in the tile display region in place of the first live tile content after the first live tile content is displayed, and the application is launched when a user specifies the tile display region.

Information processing apparatus, control method thereof, and computer-readable recording medium for displaying live tile contents while performing switching thereof

A solid-state imaging device is a solid-state imaging device in which a first substrate formed on a first semiconductor wafer and a second substrate formed on a second semiconductor wafer are bonded via connect that electrically connects the substrates, wherein the first substrate includes photoelectric conversion units, the second substrate includes an output circuit that acquires a signal generated by the photoelectric conversion unit via the connector and outputs the signal, and dummy connectors that support the first and second bonded substrates are further arranged in a substrate region in which the connectors are not arranged in a substrate region of at least one of the first substrate and the second substrate.

Solid-state imaging device, imaging apparatus, substrate, semiconductor device and method of manufacturing the solid-state imaging device

An information processing apparatus outputs, when both bookbinding printing for outputting a book and a number of pages arranged on a surface of a sheet are set, a print product that a user can easily read by synchronizing an opening direction and an arrangement order.

Information processing apparatus, control method, and storage medium

A phospholipid derivative, utilizable for modification of liposomes and the like, which is a copolymer containing, as essential component units, a component unit A represented by the formula (1), a component unit B represented by the formula (2A) and/or the formula (2B), and a component unit C represented by the formula (3) [Rand Rrepresent hydrogen atom or methyl group, provided that Rand Rdo not simultaneously represent methyl group; Rrepresents a divalent hydrocarbon group having 1 to 3 carbon atoms; AO represents an oxyalkylene group having 2 to 4 carbon atoms; m represents an average molar number of the added oxyalkylene groups and is a number in the range represented as 4&#x2266;m&#x2266;100; Rrepresents hydrogen atom, a hydrocarbon group or acyl group having 1 to 20 carbon atoms; RCO and RCO represent an acyl group having 8 to 24 carbon atoms; Rrepresents a divalent hydrocarbon group having 2 to 4 carbon atoms; and X and Y represent hydrogen atom, an alkali metal atom, ammonium or an organic ammonium] wherein a molar ratio of the component unit A relative to a total of the component unit B and the component unit C is from 7/3 to 3/7, and the component unit C is contained at a ratio of from 1 to 4 moles per 1 mole of the copolymer. 

Phospholipid derivative

A phospholipid derivative represented by the following formula (1): wherein [PG]k represents a residue of polyglycerin having a polymerization degree of k, wherein k is 2 to 50, RCO and RCO independently represent an acyl group having 8 to 22 carbon atoms, symbol 'a' independently represents an integer of 0 to 5, symbol 'b' independently represents 0 or 1, M represents hydrogen atom, an alkali metal atom, an ammonium, or an organic ammonium, and k1, k2, and k3 represent numbers satisfying the following conditions: 1&#x2266;k1&#x2266;(k+2)/2, 0&#x2266;k2, and k1+k2+k3=k+2. The phospholipid derivative is highly safe for living bodies and can be suitably utilized in drug delivery systems such as liposome, and the like.

Phospholipid derivatives and process for the production there

A phospholipid derivative represented by the formula (1) (Z represents a residue of a compound having 3 to 10 hydroxyl groups; AO represents an oxyalkylene group having 2 to 4 carbon atoms; RCO and RCO represent an acyl group having 8 to 22 carbon atoms; X represents hydrogen atom, an alkali metal atom, ammonium or an organic ammonium; 'a' represents an integer of 0 to 4; 'b' represents 0 or 1; Q represents hydrogen atom or methyl group; m represents an average number of moles of the oxyalkylene group added; and m, k1, k2, and k3 are numbers satisfying the following conditions: 3&#x2266;m&#x2266;200, 9&#x2266;m&#xd7;(k1+k2+k3)&#x2266;1000, 1&#x2266;k1&#x2266;2, 0&#x2266;k2&#x2266;9 and 0&#x2266;k3&#x2266;9, and 3&#x2266;k1+k2+k3&#x2266;10), which is highly safe for living bodies, and is suitably used for solubilization and dispersion of physiologically active substances and the like, or in the fields of drug delivery systems such as liposomes and cosmetics. 

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Tokyo, Japan

Hiroshi Kikuchi