Hitachi Chemical Company, Ltd.

Hitachi, Ltd.

Hiroshi Kawazoe

Kunio Harada

Tatemi Ido

Atsushi Takahashi

Akishi Nakaso

Hidehiro Nakamura

Shigeharu Arike

Tsuyoshi Sonehara

Tetsuya Enomoto

Toshio Yamazaki

Kunihiko Akai

Kiyoshi Yasue

Tomoyuki Kamata

Tatsuo Kaneko

Maiko Kaneko

A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system.

Micro fluid system support and manufacturing method thereof

The method of the present invention includes a step (i) in which a voltage is applied between first and second electrodesandso that the first electrode serves as a cathode, with the first and second electrodesandbeing placed in contact with a material that allows ions to move therethrough. The material includes an adsorbent (gel) containing a macromolecule that has adsorbed a metal ion. The macromolecule contains the same constitutional units as those contained in a macromolecule extracted from Aphanothece sacrum. The first electrodeis placed in contact with the adsorbent in step (i). The metal is deposited on a surface of the first electrodeby applying the voltage in step (i).

Metal collection method and metal collection device

The present invention relates to an analytical pretreatment device, comprising a supporting material, m inlet portsas fluid injection ports, n outlet portsas fluid outlet port, m&#xd7;n hollow filamentcommunicating between the inlet ports and the outlet ports, and n filler cartridgesconnected to the outlet ports (wherein, m is a natural number; and n is a natural number) that provides an analytical pretreatment device allowing easier automation of the analytical pretreatment step for improvement in operational accuracy and saving in labor.

Analytical pretreatment device

An electrophoresis member is produced by laying a plurality of capillaries on an adhesive layer born on a support layer to form a capillary layer, laminating thereon a second support layer, and partially removing the first support layer, the first adhesive layer and the second support layer to partially expose the capillaries to form a window portion for irradiation and detection and a sample injection portion for injecting a sample.

Electrophoresis member, production thereof and capillary electrophoresis apparatus

A wiring substrate () comprises an insulating base () with connection holes (), buried conductors () provided in the connection holes () without reaching a rear surface of the insulating base (), and wiring layersconnected to the buried conductors (). The buried conductors () thicken the wiring layers (), and can form aligning parts () on the rear surface of the connection holes () to be used for three-dimensional mounting structure. Each wiring layer () includes thin terminals (A), wirings (B) and thick electrodes (C). Not only the terminals (A) and wirings (B) but also the buried conductors () are raised by the same manufacturing process. A semiconductor element () is attached to the electrodes (C) of the wiring substrate ().

Method of manufacturing wiring substrate

Wiring board, semiconductor device, and method of manufacturing wiring board

Growing community of inventors

Shimodate, Japan

Hiroshi Kawazoe