Tokyo Electron Limited

Fujikin Inc.

Hiroshi Kannan

Tadahiro Ishizaka

Yasuhiko Kojima

Noboru Tamura

Nobukazu Ikeda

Kouji Nishino

Osamu Nakamura

Ryousuke Dohi

Atsushi Matsumoto

Kazuya Dobashi

Tomio Uno

Takashi Shigeoka

Yasuhiro Oshima

A plasma generation method in a toroidal plasma generator that includes a gas passage having a gas entrance and a gas outlet and forming a circuitous path and a coil wound around a part of the gas passage includes the steps of supplying a mixed gas of an Ar gas and an NFgas containing at least 5% of NFand igniting plasma by driving the coil with a high-frequency power, wherein the plasma ignition step is conducted under a total pressure of 6.65-66.5 Pa.

Plasma generation method, cleaning method, and substrate processing method

A substrate processing unit comprises a processing vessel for receiving a substrate, a cleaning gas supply system for supplying cleaning gas to the processing vessel so as to clean the interior of the processing vessel, an exhauster for exhausting the processing vessel, an operating state detector for detecting the operating state of the exhauster, and an end point detector for detecting the end point of the cleaning on the basis of the detection result from the operating state detector.

Substrate processing unit, method of detecting end point of cleaning of substrate processing unit, and method of detecting end point of substrate processing

The present invention prevents substantial reduction of flow rate control accuracy in a small flow quantity range, achieves accurate flow rate control over the entire range of flow rate control, and also allows control of a wide pressure range of a chamber with accurate flow rate control. Specifically, a gas supply facility having a plurality of pressure type flow controllers connected in parallel, and a third controller to control operation of the pressure type flow controllers to supply a desired gas exhausted by a vacuum pump to a chamber while controlling its flow rate, is provided wherein one pressure type flow controller is a controller used to control a gas flow rate range up to 10% of the maximum flow rate supplied to the chamber, while the remaining pressure type flow controllers are made to be ones controlling the rest of the gas flow rate range.

Gas supply facility of a chamber and a method for an internal pressure control of the chamber for which the facility is employed

A heater plate, which has a wafer W mounted thereon and which includes a heater in its interior, is placed on a cooling block including a coolant chamber in its interior. The cooling block includes a gas introduction pipe passing therethrough. The gas introduction pipe is connected to a space between the heater plate and the cooling block to make it possible to supply He gas as thermal conduction gas to the space. A gas suction pipeis connected to the space to make it possible to suck He gas.

Heat-treating apparatus and heat-treating method

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Tokyo, Japan

Hiroshi Kannan