Sharp Kabushiki Kaisha Corporation

Hiroshi Kanishi

Yoshiyuki Itoh

Yoshikazu Kawagoe

Masayuki Tamaishi

Katsuyuki Yagi

A method of producing a solar battery module. The method uses a producing apparatus having a positioning belt and a heating belt adjacent to each other such that an object can be delivered between the belts, and also having a pressing belt opposite the positioning belt and the heating belt, the pressing belt being provided so as to straddle the positioning belt and the heating belt. In the producing apparatus, the heating belt and the pressing belt are controlled to a predetermined temperature. The method has steps where solar battery cells and inter-connectors required to connect the solar battery cells are transported to the downstream side of the positioning belt after positioned on the upstream side of the positioning belt, the solar battery cells and the inter-connectors transported up to the downstream side of the positioning belt are delivered onto the heating belt while being held by the positioning belt and the pressing belt, and the solar battery cells and the inter-connectors delivered to the heating belt are soldered while being transported, held between the heating belt and the pressing belt.

Solar battery module production method and solar battery module production apparatus

Certain example embodiments of the present invention provide a method for detecting a substrate crack by simple equipment and steps. A substrate crack inspecting method may include the steps of (1) producing a sound by providing vibration to a substrate, (2) determining a power spectrum by capturing the produced sound and carrying out an acoustic analysis for the captured sound, and (3) judging whether or not a substrate crack exists based on a spectral intensity of a predetermined frequency region.

Substrate crack inspecting method, substrate crack inspection apparatus, and solar battery module manufacturing method

After profiles of two chips are recognized on intermediate stages and their positions are corrected, collets are used as electrodes and a voltage is applied to the chips on bonding stage on which the chips are bonded onto a submount. Then, the respective two chips are allowed to emit light, final position correction is performed on the basis of the light-emission point data and bonding is performed. The two chips can be bonded at narrow pitches by tilting the collets with respect to chip surfaces. Consequently, two laser chips can be bonded at narrow pitches on one submount in high position accuracy.

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Osaka, Japan

Hiroshi Kanishi